Case collection and collation (1)

Objective: To collect sufficient cases and organize the debugging methodology

 

First, the system should understand, and secondly, identify the possibility of problems and think of various possibilities.

Mobile phone manufacturers reflect that the signal from their board RF is poor. They finally found that the camera wiring problem was caused by the absence of ground, resulting in radiation and affecting the performance of RF signals.

Typical digital signals affect analog signals.

Therefore, we need to remove irrelevant signals one by one to ensure clean signal quality.

Analysis:

First, because it is easy to reproduce, the difficulty is reduced.

1) chip problems. This is not a category, and there is no problem with the demo board.

2) Principle Design problems, such as topology, device selection, and material order errors

3) PCB problems, such as capacitor placement and Si. Pi problems.

 

Start:

1) Check the schematic diagram and test the waveforms of each point.

2) capacitor position adjustment,

Si includes interference and reflection. First, eliminate interference.