In conventional wisdom, the power supply is proportional to the weight. For example, we go to buy power, usually first weigh the weight, the heavy may be the power of relatively sufficient. This is a very effective method when we do not have the instrument to actually test the power supply or not. But technology is progressing, just as a computer from the birth of a building to the size of the current portable notebook, power is also experiencing the same technological changes. Let's take a look at some of the latest power supplies, and you'll find that the power supply is actually getting thinner.
First of all, from the consumer psychology, the manufacturer must improve the user's purchase value, that is to say, to spend the least amount of money to buy better performance products. Therefore, manufacturers will continue to carry out technological innovation, in the maintenance of the same performance, and further improve the integration of products, the use of new materials, the design of a concept to reduce costs.
Specifically, how the power supply is achieved through the above concept. Firstly, as one of the most important contents of the CCC test, EMI Circuit is an important barrier for the power supply to reduce electromagnetic radiation. In the past, in order to achieve the CCC requirements. EMI circuit is usually set to two levels, using common mode and differential mode circuit in the realization of EMI filtering. However, with the improvement of the performance of components, only part of the circuit will be able to achieve the requirements of CCC. In particular, the lower power supply, due to the electromagnetic interference is very small, generally we see a level of EMI only one x capacitor. Of course, the EMI circuit of high-power power supply is relatively complicated.
Second, the PFC circuit is also a very important link. In the past, PFC used a metal skeleton, and now uses new materials, such as ceramics and plastics. Both of these materials are not only good insulation, but also greatly reduce the weight of the PFC, as well as reduce the noise generated by a lot of it.
Third, SMD technology widely used, so that part of the capacitance, resistance, diode volume greatly reduced, and are integrated into the back of the PCB board, so we see the internal structure of the power supply than before to tidy a lot of, at the same time, neat interior layout is more conducive to the formation of power supply duct, has beneficial to Www.xker.com Feeds
Finally, the development of chip technology, integration more and more high, such as the previous PWM plus comparator design, and now the two chips are concentrated in a chip, not only that, the surrounding auxiliary components are also greatly reduced.
The development of power device technology, the optimization of circuit design, make the power efficiency from 65% to more than 80%, the efficiency of the increase will lead to the reduction of power supply, so, the previous thick heat sink can also lose weight.
Of course, there are changes also have the same, that is, some devices can not be changed, such as large capacitors, transformers, switch tubes, rectifier tubes and so on. In addition, different products, its selling points are different, some components also have differences. For example, air ka wide, in order to adapt to low voltage, the use of 680 micro-method of large capacitors, and if this function is not required, as long as 330 micro-method is enough.
To sum up, technological progress at the same time, our vision and ideas have to change