What is the encapsulation technology in the CPU

The so-called "encapsulation technology" is a technology that is used to pack integrated circuits with insulating plastic or ceramic materials. Take the CPU as an example, actually see the volume and appearance is not the real CPU core size and face, but the CPU core and other components after encapsulation of the product. Encapsulation technology encapsulation is necessary and critical for chips. Because the chip must be isolated from the outside, in order to prevent the air impurities in the chip circuit corrosion caused by the loss of electrical performance. On the other hand, packaged chips are also easier to install and transport. Because of the quality of packaging technology has a direct impact on the performance of the chip itself and the connection with the PCB (printed circuit board) design and manufacture, so it is critical.

Encapsulation Technology

Packaging is also referred to as the installation of semiconductor IC chip shell, it not only plays the role of placing, fixing, sealing, protecting the chip and enhancing the thermal conductivity, but also communicates the bridge between the inner world of the chip and the external circuit--the contact on the chip is connected to the pin of the package shell by wire. These pins are also connected to other devices through the wires on the printed circuit board. Therefore, for many integrated circuit products, packaging technology is a very important link.

The encapsulation technology uses the CPU package to use the insulating plastic or the ceramic material packing mostly, can play the seal and enhances the chip Electrothermal performance the function. Because now the processor chip's internal frequency is more and more high, the function is more and more strong, the pin number is more and more, the package appearance also unceasingly changes.