Information about Chip Encapsulation

PLCC: plastic leaded chip carrier package plastic with lead Chip Carrier encapsulation, commonly used
Pc20, 28, 44, 68 and 84 pins
Tqfp: The thin quad flatpack package is encapsulated in a flat package, with common PINs such as 100,144,176.

Pqfp: Plastic quad flatpack package plastic four-around flat encapsulation, common 44,100,160,
208,240,304 pin
Cpga: ceramic pin Grid Array package ceramic needle Grid Array encapsulation, common 120,
132,156,175,191,233,299,411,475,559 pin

Dip: dual in-line package dual-row direct insert Encapsulation
Sh-dip: shrink dual in-line package Shrink double row direct insert Encapsulation
SIP: single in-line package
ZIP: Z-in-line package Z-shaped direct insertion package
PGA: PIN Grid Array array encapsulation (or cylindrical encapsulation)

The above is the through hole encapsulation.

Sop: small outline package small shape Encapsulation
Soj: small outline with J-lead small shape with J-pin encapsulation (similar to PLCC)
QFP: Flat encapsulation of quard flatpacks
Vqfp: very thin QFP is very thin and flat encapsulation (similar to tqfp, with fewer pins,
Commonly used 100, 64, and feet)
Htqfp: Heat Sink quard flatpacks with flat encapsulation around heat sink
Cqfp: ceramic quad flatpack ceramic four-sided flat encapsulation (ceramic carrier, and General
QFP is different in that its pin is split from the inside to the peripheral parallel to the chip edge, shape
It looks like four "horns ")
LCC: leadless chip carrier no-lead carrier
BGA: Ball Grid Array Encapsulation
TCP: tape carrier package on-load encapsulation (such as the encapsulation of black glue protection in the workbook)
CSP: Chip Scale (or size) Package Chip Scale encapsulation (the chip area is only larger than that of the Silicon Wafer
20%, smaller than BGA and TSOP)
For more information, see ANSI Y14.5M-1982 standards

The above is the surface mount technology package

Chip encapsulation is generally plastic. The encapsulation starting with C is ceramic encapsulation.
CPU (486,586) other than PII is encapsulated in cpga.

The encapsulation of PII is s.e. C. cartridge (the single edge contact (S. E. C .))
It is a unique packaging technology of intel.