Professional PCB expressions in Chinese and English

I. Comprehensive vocabulary

1. Printed Circuit: Printed Circuit

2. Printed line: Printed Wiring

3. Printed Board: Printed Board

4. Printed Board circuit: Printed Circuit Board (PCB)

5. Printed Circuit Board: Printed Wiring Board (PWB)

6. Printed component: printed component

7. Printed contact: printed contact

8. Printed Board Assembly: Printed Board Assembly

9. Board: Board

10. Single-sided printed board: Single-sided printed board (SSB)

11. Dual-sided printed board: Double-sided printed board (DSB)

12. Multilayer Printed Board: mulitlayer Printed Board (MLB)

13. Multilayer Printed Circuit Board: mulitlayer Printed Circuit Board

14. Multilayer Printed Circuit Board: mulitlayer prited wiring board

15. Rigid Printed Board: rigid printed board

16. Rigid single-sided printed board: rigid single-sided printed borad

17. Rigid dual-sided printed board: rigid double-sided printed borad

18. Rigid multi-layer printed board: rigid multilayer printed board

19. Flexible multi-layer printing board: flexflexible Multilayer Printed Board

20. Flexible Printed Board: Flexible Printed Board

21. Flexible single-sided printed board: flexible single-sided printed board

22. Flexible dual-sided printed board: Flexible Double-sided printed board

23. Flexible Printed Circuit: Flexible Printed Circuit (FPC)

24. flexible printing line: Flexible Printed Wiring

25. Rigid Printed Board: Flex-rigid printed board, rigid-flex Printed Board

26. Rigid dual-sided printed board: Flex-rigid double-sided printed board, rigid-flex double-sided printed

27. Rigid multi-layer printed board: Flex-rigid multilayer printed board and rigid-flex multilayer printed board

28. fl Printed Board: flush Printed Board

29. Metal Core printing board: metal core Printed Board

30. Metal Matrix Printed Board: Metal Base Printed Board

31. Multi-wiring Printed Board: muyun-wiring Printed Board

32. Ceramic Printed Board: ceramic substrate Printed Board

33. conductive adhesive Printed Board: electroconductive paste Printed Board

34. molded circuit board: molded circuit board

35. molded Printed Board: stamped Printed Wiring Board

36. Sequential laminated multilayer printing board: Sequentially-laminated mulitlayer

37. Strip printing board: discrete wiring board

38. Micro wire board

39. laminated Printed Board: buile-up Printed Board

40. Multi-layer layout: Build-up mulitlayer Printed Board (bum)

41. Build-up Flexible Printed Board

42. Surface laminated circuit board: Surface laminar circuit (SLC)

43. Embedded convex Block Printed Board: b2it Printed Board

44. multilayer film substrate: multi-layered film substrate (mFs)

45. Multi-layer printed board: alivh Multilayer Printed Board

46. Chip board: chip on board (COB)

47. Buried resistance Board: buried resistance Board

48. motherboard: mother board

49. Sub-board: daughter board

50. Backplane: backplane

51. bare board: bare board

52. keyboard board sandwich board: copper-Invar-copper board

53. Dynamic scratching Board: dynamic flex Board

54. Static scratching Board: static flex Board

55. detachable Board: break-away planel

56. Cable: Cable

57. Flexible Flat cable: Flexible Flat cable (FFC)

58. membrane switch: membrane switch

59. hybrid circuit: hybrid circuit

60. Thick Film: Thick Film

61. Thick Film circuit: thick film Circuit

62. Film: Thin Film

63. Thin Film hybrid circuit: thin film hybrid circuit

64. Interconnection: Interconnection

65. Wire: conductor Trace Line

66. fl Conductor

67. Transmission Line: Transmission Line

68. Cross-traffic: crossover

69. Edge plug: edge-board contact

70. Enhanced Board: stiffener

71. Base: Substrate

72. Substrate Surface: Real Estate

73. Wire plane: conductor side

74. Component plane: component side

75. welding surface: solder side

76. Printing: Printing

77. Grid

78. Image: Pattern

79. conductive graph: conducting Pattern

80. non-conductive image: non-conducting Pattern

81. Character: Legend

82. MARK: Mark

Ii. substrate:

1. substrate: Base Material

2. laminate: Laminate

3. metallic foil substrate: Metal-clad bade Material

4. copper clad laminate: copper-clad laminate (CCL)

5. Single-sided copper clad laminate: Single-sided copper-clad laminate

6. Double-sided copper clad laminate: Double-sided copper-clad laminate

7. Composite Laminate: Composite Laminate

8. Thin laminate: thin Laminate

9. Metal Core copper clad laminate: metal core copper-clad laminate

10. Metal base copper clad laminate: Metal Base Copper-clad laminate

11. flexible copper foil insulation film: flexible copper-clad dielectric film

12. matrix material: basis material

13. Pre-dip material: prepreg

14. bonding sheet: bonding sheet

15. Pre-dip adhesive sheet: preimpregnated bonding sheer

16. epoxy glass substrate: epoxy glass substrate

17. Joining method laminate: laminate for additive process

18. Pre-Fabricated Inner foil panel: Mass lamination panel

19. inner layer: Core Material

20. Catalytic plate: Drawing Zed board, coated drawing Zed Laminate

21. gluing catalytic laminate: adhesive-coated Zed Laminate

22. adhesive coated non-rush laminate: adhesive-coated uncoated Zed Laminate

23. Bonding Layer: bonding layer

24. Bonding Film: Film Adhesive

25. Adhesive insulating film: adhesive coated dielectric film

26. No support adhesive film: Unsupported Adhesive Film

27. Cover Layer: Cover layer (cover lay)

28. Enhanced sheet: stiffener Material

29. Copper Foil: copper-clad Surface

30. Copper Strip Surface: foil removal Surface

31. laminated surface: UNCLAD laminate Surface

32. Base film surface: Base film surface

33. adhesive surface: adhesive faec

34. Original cleansing: plate finish

35. Rough Surface: Matt Finish

36. longitudinal direction: length wise direction

37. Mode direction: Cross wise direction

38. Clipboard: Cut to size panel

39. phenolic paper-coated copper foil: phenolic cellulose paper copper-Clad Laminates (phenolic/paper CCL)

40. Epoxy paper coated copper foil: epoxide cellulose paper copper-Clad Laminates (epoxy/paper CCL)

41. epoxy glass coated copper foil: epoxide woven glass fabric copper-Clad Laminates

42. epoxy glass cloth composite copper foil: epoxide cellulose paper core, glass cloth surfaces copper-Clad Laminates

43. epoxy glass fabric composite copper foil: epoxide non woven/woven glass reinforced copper-Clad Laminates

44. Copper Foil: ployester woven glass fabric copper-Clad Laminates

45. polyimide woven glass fabric copper-Clad Laminates

46. Copper Foil coated with bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates

47. Epoxy Composite cloth coated copper foil: epoxide synthetic fiber fabric copper-Clad Laminates

48. Copper Foil coated with poly (vinyl) fiberglass: Teflon/fiber glass copper-Clad Laminates

49. Ultra thin laminate: ultra thin Laminate

50. Ceramic-clad copper foil: ceramics Base Copper-Clad Laminates

51. Ultraviolet blocking copper foil: uv blocking copper-Clad Laminates

Iii. Substrate Materials

1. Grade A resin: A-stage Resin

2. Grade B resin: B-stage Resin

3. Grade C resin: C-stage Resin

4. Epoxy Resin: Epoxy Resin

5. phenolic resin: Phenolic Resin

6. polyester resin: polyester resin

7. polyimide resin

8. bismaleimide-triazine Resin

9. acrylic resin: acrylic resin

10. Melamine Formaldehyde Resin: Melamine Formaldehyde Resin

11. polyfunctional Epoxy Resin

12. brominated epoxy resin

13. Epoxy phenolic: Epoxy Novolac

14. Fluorine resin: fluroresin

15. Silicone: Silicone Resin

16. silane: Silane

17. Polymer: Polymer

18. amorphous polymers: AMORPHOUS POLYMER

19. Crystallization: Crystalline polamer

20. dimorphism

21. copolymer: Copolymer

22. synthetic resin: Synthetic

23. thermosetting resin: Thermosetting Resin

24. thermoplastic resin: thermoplastic resin

25. photosensitive resin: Photosensitive Resin

26. epoxy equivalent: weight per epoxy equivalent (WPE)

27. epoxy value: epoxy value

28. dicyandiamide

29. Binder: binder

30. Adhesive: adesive

31. curing agent: curing agent

32. Flame Retardant: Flame Retardant

33. opaquer

34. plasticizer: plasticizers

35. Unsaturated Polyester: unsatuiated polyester

36. Polyester Film: polyester

37. polyimide film: polyimide film (PI)

38. PTFE: polytetrafluoetyene (PTFE)

39. Poly (PVDF) propylene film: perfluorinated ethyene-propyene copolymer film (FEP)

40. enhancement material: Reinforcing Material

41. Glass Fiber: Glass Fiber

42. E-glass fiber

43. d glass fiber: D-glass fiber

44. S glass fiber: S-glass fiber

45. glass fabric

46. Non-woven fabrics: non-woven fabric

47. Fiberglass mat: glass mats

48. Yarn

49. monofilament: filament

50. Stranded: strand

51. Weft Yarn

52. Warp: Warp Yarn

53. But Neil: denier

54. Longitude: Warp-wise

55. weft direction: Weft-wise, filling-wise

56. weft and weft density of the fabric: thread count

57. Fabric Structure

58. Plain tissue: Plain Structure

59. Bad cloth: gray fabric

60. sparse fabric: woven scrim

61. Bow latitude: bow of Weave

62. Break Through: End missing

63. Latitude deficiency: mis-picks

64. Latitude oblique: bias

65. Crease

66. yun Zhi: waviness

67. Fish Eye

68. Terry length: feather Length

69. thick section: Mark

70. Crack: Split

71. Twist: twist of Yarn

72. Dose content: Size content

73. Residual Amount of decimal agent: Size Residue

74. treatment agent content: Finish level

75. Dose: Size

76. Coupling Agent: couplint agent

77. fabric processing: finished fabric

78. polyamide fiber: polyarmide Fiber

79. Non-woven Polyester: Non-woven Polyester Fabric

80. Impregnated insulated longitudinal paper: impregnating insulation paper

81. poly aromatic amide fiber paper: Aromatic Polyamide paper

82. fracture length: breaking length

83. Absorbent Height: height of capillary rise

84. wet strength retention rate: wet strength retention

85. Whiteness: whitenness

86. Ceramics: Ceramics

87. conductive foil: conductor Foil

88. Copper Foil: Copper Foil

89. Electrolytic Copper Foil: electrodeposited copper foil (Ed Copper Foil)

90. calender copper foil: rolled copper foil

91. annealed copper foil: annealed copper foil

92. calender annealed copper foil: rolled annealed copper foil (RA Copper Foil)

93. Thin Copper Foil: Thin Copper Foil

94. coated copper foil: adhesive coated Foil

95. rubber coated copper foil: resin coated copper foil (RCC)

96. composite metal foil: Composite Metallic Material

97. Carrier foil: Carrier Foil

98. Invar

99. foil (profile) profile: foil Profile

100. glossy: shiny side

101. Rough Surface: matte side

102. Processing surface: treated side

103 anti-rust treatment: stain Proofing

104 double-sided copper foil: Double treated Foil

Iv. Design

1. Schematic diagram: shematic dimo-

2. Logic Diagram: logic digoal

3. Print line layout: printed Wire Layout

4. layout diagram: master drawing

5. Manufacturing design: Design-for-manufacturability

6. Computer Aided Design: computer-aided design. (CAD)

7. Computer-Aided Manufacturing: computer-aided manufacturing. (CAM)

8. Computer Integrated Manufacturing: Computer integrat manufacturing. (CIM)

9. Computer Aided Engineering: Computer-Aided Engineering. (CAE)

10. Computer-Aided Testing: computer-aided test. (CAT)

11. Electronic Design Automation: Electric Design Automation. (EDA)

12. Engineering Design Automation: engineering design automation. (eda2)

13. assembly design automation: Assembly aided automated tural design. (AAad)

14. Computer aided drawing: computer aided Drawing

15. Computer control display: Computer Controlled display. (CCD)

16. Layout: Placement

17. Wiring: Routing

18. Layout Design: Layout

19. re-deployment: Rerouting

20. Simulation: Simulation

21. Logical simulation: Logic Simulation

22. Circuit Simulation: circit Simulation

23. Timing simulation: timing simulation

24. modularization: Modularization

25. Wiring completion rate: Layout wiring iency

26. machine description format: Machine descriptionm format. (MDF)

27. machine description format database: MDF Databse

28. Design Database: Design Database

29. Design origin: Design Origin

30. Optimization (Design): optimization (Design)

31. axis for design optimization: predominant axis

32. Table origin: Table Origin

33. Image: copying ing

34. Driver file: Drive File

35. Intermediate file: intermediate file

36. Manufacturing document: Manufacturing documentation

37. Queue support database: queue support database

38. Component placement: component Positioning

39. Graphic Display: Graphics dispaly

40. Proportional Factor: Scaling Factor

41. Scan filling: Scan Filling

42. rectangular filling: rectangle Filling

43. Fill field: Region Filling

44. entity design: Physical Design

45. Logic Design: Logic Design

46. Logic Circuit: Logic Circuit

47. Hierarchical Design: hierarchical design

48. Top-Down Design: Top-Down Design

49. Bottom-up design: bottom-up design

50. Network: Net

51. Digitalization: digitzing

52. Design Rule Check: Design Rule Checking

53. Wiring: Router (CAD)

54. Network table: net list

55. Computer Aided Circuit Analysis: computer-aided circuit analysis

56. subwire Network: Subnet

57. Objective Function: Objective Function

58. Design post-processing: Post design processing (PDP)

59. Interactive Drawing design: interactive drawing design

60. Cost matrix: Cost metrix

61. Engineering Drawing: Engineering Drawing

62. Block Diagram: block digoal

63. Maze: Moze

64. component density: component density

65. Traveling Salesman Problem: Traveling Salesman Problem

66. Degree of Freedom: degrees freedom

67. Inbound: out going degree

68. Outbound: Incoming degree

69. Manhatton distance

70. Euclidean distance: Euclidean distance

71. Network: Network

72. array: Array

73. segment: Segment

74. Logic: Logic

75. Logic Design Automation: Logic Design Automation

76. Split line: separated time

77. layer: separated layer

78. sequence: definite sequence

V. shape and size:

1. Wire (Channel): conducting (track)

2. Wire (body) width: conductor width

3. Wire distance: conductor spacing

4. Wire layer: conductor layer

5. wire width/Spacing: conductor Line/Space

6. First wire layer: conductor layer No.1

7. Circular Disk: Round pad

8. Square pad

9. Diamond Disk: Diamond pad

10. rectangular pad: oblong pad

11. Bullet-shaped disk: Bullet pad

12. Tear Tray: TearDrop pad

13. Snowman Tray: Snowman pad

14. V-shaped disk: V-shaped pad

15. Ring Plate: Annular pad

16. non-circular disks: non-circular pad

17. Isolation Disk: Isolation pad

18. non-functional connecting Disk: monfunctional pad

19. offset connecting Disk: Offset land

20. backend bare Disk: Back-bard land

21. Disk address: anchoring spaur

22. Connecting disk image: Land Pattern

23. Connecting disk grid array: Land Grid Array

24. Pore ring: annular ring

25. Component hole: component hole

26. Installation hole: mounting hole

27. Support hole: supported hole

28. Non-support hole: Unsupported hole

29. Guide via:

30. plating through hole: plated through hole (PTH)

31. Clearance Hole: Access hole

32. Blind Hole: Blind Via (hole)

33. Buried hole: buried via hole

34. Buried/blind hole: buried/Blind

35. Any layer through hole: Any layer inner via hole (alivh)

36. All drilling: All drilled hole

37. Positioning hole: toaling hole

38. No connecting disk hole: Landless hole

39. Intermediate hole: interstitial hole

40. No connecting disk via hole: Landless via hole

41. guide hole: Pilot Hole

42. End-to-End full-Gap hole: terminal clearomee hole

43. Quasi-Surface Plating hole: quasi-Interfacing plated-through hole

44. Quasi-dimensional hole: dimensioned hole

45. via hole in connecting Disk: Via-in-pad

46. Hole Position: Hole Location

47. Hole Density: Hole Density

48. Hole chart: Hole Pattern

49. Drilling diagram: Drill drawing

50. assembly drawing: Assembly Drawing

51. Printed Board assembly diagram: Printed Board Assembly Drawing

52. Reference: datum referance