Applied Materials Inc. launches the mega-era breakthrough etching technology

Applied Materials introduced advanced etching technology ─applied Centura Avatar Dielectric layer etching system, this breakthrough system is to solve the challenge of building 3D memory Architecture, 3D memory architecture provides high-density gigabit storage capacity, necessary for future data-intensive operations devices.

Applied Materials company vice president and etching business Group general manager of the PA. Jorge (Prabu Raja) said: "3D memory structures must be etched in the depth of the complex multi-layer material stack, Avatar systems utilize our leadership in the plasma field to address the manufacturing challenges of 3D memory structures. Customers are very interested in the breakthrough capabilities of the new system, and we have sold more than 30 groups of systems to a number of customers for important applications, including future production of memory chips. 」

The Avatar system is a new design for deep and narrow etching in the 3D NAND memory array, which is an exciting new flash memory device with up to 64 layers of vertically built memory units that create extremely high bit densities within a small area.

Avatar system can be in the composite film stacking layer of hole etching and groove etching, the depth-width ratio can be as high as 80:1, in the shape of the proportion of the United States, the Washington Monument to the depth-width ratio is 10:1 high (Taipei 101 building about 9:1). In addition, the system is the first with the ability to etch deep changes in the depth of the characteristics of the structure of the function of the system, to create a connection with the various layers of memory units of the "ladder-type" contact structure is very important.

During the 2012 exhibition of the West American Semiconductor exhibition from July 10 to 12th, Applied materials will display a number of new wafer fabrication technologies such as Avatar systems.