High Frequency Circuit Wiring techniques in PCB Layout
1. Multi-board wiring
High-frequency circuits often have a high degree of integration and a high wiring density. Using a multi-layer board is not only required for wiring, but also an effective means to reduce interference. In the PCB Layout stage, a proper selection of printing board sizes of a certain number of layers can make full use of the middle layer to set shielding to better achieve nearby grou
catheter, plastic catheter, or other protection with different Grounding Impedance. Therefore, there is only one solution to achieve permanent ground-to-ground performance: grounding with multiple layers of aluminum foil on all core wires. Aluminum Foil protects the fragile twisted pair core wires and creates a balance environment for UTP cables. This means that the FTP cable-based shielding solution is **
is created and its "Reference" is assigned to None. Because sometimes the last node is called a "grounding point", we simply use an electrical grounding symbol to represent None. It is a good idea to assign a value of None to initialize a "Reference.
Figure 3 node objects include data domains and references to the next node
Figure 4 typical node RepresentationUnordered list class
As mentioned above, t
6
Reserved
7
Vdd
P
Power supply for digital logic circuits
+ 3.3v
8,33
Gndd
Grounding for IO and digital circuits
GND
9,10
Mic[p,n]
AI
Microphone input (positive and negative)
Mic
11
MONO
AI
Mic Input LineIn Input
12
Mbs
Microphone
conditions of Use1) ambient air temperature limit is not more than 40 ℃, not limited to 45 ℃;2) The wind speed is not much 35m/s;3) elevation is not higher than 1000m, earthquake intensity does not exceed 8 degrees;4) Environmental Humidity: The average monthly relative humidity is not greater than 90%, the daily average relative humidity is not greater than 95%;5) icing thickness not exceeding 10mm;6) Installation site should be non-flammable, explosive, chemical corrosion and frequent violent
conditions of Use1) ambient air temperature limit is not more than 40 ℃, not limited to 45 ℃;2) The wind speed is not much 35m/s;3) elevation is not higher than 1000m, earthquake intensity does not exceed 8 degrees;4) Environmental Humidity: The average monthly relative humidity is not greater than 90%, the daily average relative humidity is not greater than 95%;5) icing thickness not exceeding 10mm;6) Installation site should be non-flammable, explosive, chemical corrosion and frequent violent
work! Speculation: Chassis grounding collapse.Continue to heat the chassis solder melting welding, the second block also according to this method of treatment, all return to normal, which is determined to be chassis grounding problems.2, VGA video display flower screen, not synchronizedCheck program: found that the camera parameter is 68013 configuration, so check 68013 of the camera configuration mode to
Recently made a mistake Test action:test Scenario: direct from the mains socket to access the 3W non-isolated switching power supply circuit board, using an oscilloscope to test the output voltage, when the oscilloscope through another outlet directly from the mains powertest Result: in the oscilloscope to the output negative moment, the leakage protection switch trip!!!After consulting, analysis, just understand oneself because did not understand "oscilloscope ground and mains 0 line, the FireW
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characteristics) are primarily used to solve EMC problems. (e.g. ground to ground, power supply and IC pin).7, the single point of grounding (refers to the protection of ground, work ground, DC grounding on the device to separate each other, respectively become independent system).8, Fuse action inductor① analog ground and digital ground single point groundingAs long as it is the ground, eventually will ha
I. Basic knowledge1. Serial communication and parallel communication: More and more serial communication is used at present. The advantage of serial communication is that the connection is simple, the transmission distance is far, the disadvantage is slow transmission speed. 2. Serial communication: Divided into synchronous communication and asynchronous communication; asynchronous communication means that the sending and receiving devices use their own clock control to transmit and receive data
layer, the flower line is all the layers are painted.First, Signal Layers (signal layer)The Protel98, PROTEL99 provides 16 signal layers: Top (top), Bottom (bottom), and MID1-MID14 (14 intermediate layers).The signal layer is used to complete the wiring layer of the printed circuit board copper foil traces. In the design of the double-sided board, generally only use top (top) and bottom (bottom) two layers, when the number of printed circuit board layer more than 4 layers, you need to use Mid (
outputs can be connected to a line. With a pull-up resistor, the "and logic" relationship, i.e. "line and", is formed without adding any devices. Can be simply understood as: in all pins together, an external pull-up resistor, if there is a pin output logic 0, the equivalent of grounding, parallel with the circuit "equivalent to a short circuit", so the logic level of the external circuit is 0, only the high power, and the result is logic 1.Open-Drai
(Capt_count 0) "Color:rgb (255, 0, 0);">//if the encoder count value is less than 01;}//Enter status 1Else"Color:rgb (255, 0, 0);">//if the encoder count value is within 0~40, the reversal is not required in order for jitter to occur0;}//reversal duty ratio of 0, equivalent to negative groundingforward=0;//the duty ratio of the positive turn is 0, equivalent to the positive grounding Break; Case 1:if(Capt_count +) "Color:rgb (255, 0, 0);">//if the e
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PCB highlights:
August 5, 2014
13:04
Ground Line Design
1.1 classified analog, digital, shell, and system land
1.2 grounding mode: Single Point Grounding (F
1.3 increase the ground line, increase the running current, and increase the anti-noise capability> 3 m
Electromagnetic compatibility:
2,. 1 adopts the #-shaped wiring, that is, vertical wiring mode and metal hole reducing are adopted to avoid long dis
corresponding to the 01h unit of SFR is set to 0 and the Cal bit of the 00h unit is set to 1, the Cal pin outputs a pulse signal of Hz, it can detect whether the crystal oscillator works normally, because 512Hz is the 64-bit frequency of the crystal oscillator. Note the following when making PCB:The X1 and X2 crystal oscillator pins are high-impedance pins, and the distance between the two pins must be less than 5mm. Even if the signal is located in the inner layer of the Board, the signal line
by tr42 of the American Tia organization: TIA/EIA-568A business construction telecommunications wiring standards, TIA/EIA-569 business construction telecommunications and space standards, TIA/EIA-570A residential construction telecommunications wiring standards, TIA/EIA-606 business construction telecommunications Facilities management standards, TIA/EIA-607, commercial construction telecommunications grounding and
(I would like to make a summary later)
Connecting lines between and above, try to let the lines pass through each point in sequence to facilitate testing. The line length should be as short as possible, for example (based on the previous type ):
2. Do not wire between pins, especially between and around the integrated circuit pins.3. Do not parallel lines between different layers to avoid forming actual capacitors.4. wiring should be a straight line or a 45-degree line to avoid electromagnetic
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