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Common Hardware glossary! Absolutely authoritative! (Go !) 11. Scanner Glossary

11. Scanner Glossary    CCD (charge coupler): CCD has developed for a long time, and its technology and manufacturing process have been quite mature. the image quality of CCD scanners is quite prominent and can meet almost all requirements. It mainly uses CCD micro-semiconductor photosensitive chip as the core of the scanner. Using CCD for scanning requires a set of precise optical systems, which makes the scanner structure complex. Therefore, it is

Forbes: AMD and others on the chip forum in autumn are "Fever"

dual-core chips ." Mark said. Other companies that announced the design of multi-core chip products on the Forum include Freescale Semiconductor companies, as well as mobile phone giants such as Motorola, Sun, and Fujitsu. The two-core chip CODE released by the latter is UltraSPARC IV +. At the same time, a company named Cavium Networks in California published an Octeon anti-virus processor product on the Forum to control spam and Trojan viruses. Dep

The inventor of CCD Willard Boyle died.

Willard Boyle, a Nobel Prize winner from amerster, Nova se, Canada, whose achievements paved the way for digital photography and died at the age of 86 on May 7, 2011. Because of his revolutionary significance in semiconductor circuit imaging, Boyle won the Nobel Physics Award in 2009. His old friend Ron Macnutt, A camberland lawyer, mentioned that Boyle is very proud of this honor and has long hoped to win this award. "We have already celebrated sever

88 Glossary that gives you a full understanding of digital camera

is filled at the rear of an optical lens. When light and image pass through and are projected to the CCD surface from the lens, the CCD will generate current, convert the inductive content into digital data for storage. The larger the number of CCD pixels and the larger the size of a single pixel, the clearer the collected image. Therefore, although the number of CCD is not the only key to determining the image quality, we can regard it as one of the important criteria for determining the camer

What is SOC (source derived from http://www.elenchina.com/bbs.do? Method = view & id = 1440 & code = plate02)

SOC Technology Development The development of integrated circuits is now 40It has been following Moore's instructions and is now in the deep sub-micron stage. Due to the demand of the information market and the development of microelectronics, the feature size of the integrated circuit is constantly reduced.Small) is the main feature of the development of a variety of process integration technologies and application-oriented system-level chips. As the semic

Android Development NOTE 1 (Open Mobile Alliance-Open Handset Alliance)

. Softbank MobileSprint Nextel (USA)T-Mobile (Germany)Telecom Italia (Italy)Telef ónica (Spain)Vodafone TelecomChina UnicomSemiconducompanies semiconductor manufacturing companyAKM semiconduincAudienceArmAtheros communicationsBroadcom Corporation (Broadcom)Ericsson (Ericsson)Intel Corporation (Intel)Marvell semicondu, Inc. (the company that acquired Intel Mobile chip Division)NVIDIA Corporation)Qualcomm Inc. (Qualcomm)Sirf Technology Holdings, Inc. (w

Step 5 of petshop4.0 (business logic layer design of petshop)

or comments, or as the author of the writing, at least he should be an important member of the Review Committee. Standardize the terms and technical terms in the business field. Domain experts and technical experts must communicate with each other in a semantic environment without ambiguity. If there are differences in understanding, we must resolve them in a timely manner and establish terminology standards through discussion. It is hard to imagine that people with different languages can coo

Using the Nucleo-F401 as an example to develop an mbed Environment

The world's leading semiconductor supplier and the world's leading arm? Cortex? -STMicroelectronics (ST), a m microcontroller manufacturer, further strengthens the ease-of-use and design flexibility of the stm32 series microcontroller, and releases a cost-effective and easy-to-expand prototype development board for all stm32 products. Stm32 nucleus o perfectly integrates ease of use, flexibility, connection functions, and compatibility with mainstream

Computer English 3

1. CPU (center processor unit) Central Processing Unit 2. mainboard 3. random memory (RAM) 4. Rom (read only memory) read-only memory 5. Floppy Disk floppy disk 6. Hard Disk 7, CD-ROM disc drive 8. monitor 9. keyboard 10, mouse 11. Chip 12, CD-R disc Recorder 13. Hub 14 Modem 15, P-P (Plug and Play) plug-and-play 16. uninterruptable Power Supply 17. BIOS (basic-input-output system) Basic Input/Output System 18, CMOS (Complementary Metal-oxide-semiconductor

Embedded Operating System: Another world for Microsoft?

. Based on the powerful technology and economic strength of Microsoft, we can fully believe that Microsoft can also play a role in embedded systems, so using the wince system has a long vitality.It can be seen that Microsoft's embedded system market is really fierce. So many manufacturers are faced with such a big temptation, difficult to support, and have invested in Microsoft's arms.Microsoft CEO Steve Balmer announced a strategic alliance with several sem

BIOS settings graphic tutorial Award Bios latest)

simplified, which creates confusion between the two concepts to a certain extent. In fact, BIOS programs are stored in CMOS memory. CMOS is a semiconductor technology that can be used to integrate paired metal oxide semiconductor field effect transistor (MOs) into a silicon wafer. This technology is usually used to produce RAM and exchange application systems. The products produced by it consume extremely

Why is insulation wire piercing clip implemented?

With the accelerated process of Power Line Insulation in China, the insulation wire construction technology has ushered in a huge revolution era, how to ensure the correct use of insulated wires to maximize the role and the longest service life has become a subject of our research.I. Why is insulation wire piercing clip implemented?According to expert research and tests, the semiconductor layer of insulated wires can improve the carrying capacity of w

Digital Camera terminology

. Special technologies include the Super CCD technology developed by Fuji.  Super CCD (Super CCD): Developed by Fuji, Super CCD is arranged in an staggered manner and has unique octagonal photosensitive elements, which can provide larger photosensitive elements for each pixel. The shape and arrangement of Super CCD sensors can generate a more balanced digital photo quality. The sensing degree has been further improved, and the dynamic range has also been improved. At the same time, it can improv

Analog and digital interfaces for LCD display

interference while achieving high-speed data transmission, and because it sends differential signals, compared to a common signal, it produces the least noise.For many reasons, the LVDS solution is not directly used for other displays, especially for desktop displays. First, two oldest LVDS solutions from National Semiconductor Corporation and Texas Instruments Corporation are incompatible. But this is not for all reasons. This solution is optimized

Reading Notes 4

components, such as storage and IO devices. CPU The CPU consists of four main components: Arithmetic logical operation unit (ALU): This is the basic module of the CPU. It performs arithmetic operations and logical operations such as addition, subtraction, and Boolean operations (and or not ). Control unit: A digital circuit that controls CPU operations and coordinates CPU functions. Register: indicates a set of storage units. registers store the number of immediately requir

Business logic layer design for petshop

writing, a domain expert or comments, or as the author of the writing, at least he should be an important member of the Review Committee. Standardize the terms and technical terms in the business field. Domain experts and technical experts must communicate with each other in a semantic environment without ambiguity. If there are differences in understanding, we must resolve them in a timely manner and establish terminology standards through discussion. It is hard to imagine that people with di

Analysis of common memory concepts: Ram, SRAM, SDRAM, Rom, EPROM,

Analysis of common memory concepts: Ram, SRAM, SDRAM, Rom, EPROM,From: http://blog.sina.com.cn/s/blog_622cc2430100euju.html Concept Analysis of common memory: Ram, SRAM, SDRAM, Rom, EPROM, EEPROM, and Flash memory can be divided into many types, including RAM (Random Access Memory) based on whether power loss data is lost) and Rom (read-only memory), where Ram access speed is relatively fast, but data will be lost after power loss, and data will not be lost after Rom power loss.Rom and RAM are b

(Sticker) transistor knowledge

Structure and type of Transistor Crystal transistor is one of the basic components of semiconductors and is the core component of electronic circuits. The transistor is made on a semiconductor substrate to form two close Pn knot, two The PN junction divides the positive semiconductor into three parts. The middle part is the base zone, and the two parts are the emission zone and the Collector zone. PNP and

Update the wireless NIC Driver in ubuntu10.10

the way, http://www.itmop.com/network/system/linux/12224227.html prompts how to uninstall the old core. I have always found that my wireless network card is not very stable. Sometimes the connection fails and the connection succeeds. In the past few days, even if the connection fails, you can connect again. However, the computer needs to be restarted when the device is offline. None of the other tricks can be used. It is very likely that the NIC driver problem occurs, so I do this: mark@mark:~

[Other] Computer composition principle decomposition experiment: Experiment 2 Ram Experiment

Experiment 2 Ram I. Tutorial purpose: Measure the test taker's knowledge about the working principle and usage of semiconductor static random read/write Memory RAM. Master the word and bit extension technology of semiconductor memory. Ii. devices and instruments used in the experiment: Ram uses two mm2114 cards 74ls125 for isolating Components 74ls138 Decoder Iii. experiment content: 1 k x 4 chips are

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