northbridge heatsink

When cleaning the motherboard and CPU, on the heatsink and chip surface of silicone smear, but after applying silicone, the temperature did not fall, but rose higher. If the silicone smear too much, not only will affect the heat conduction, silica gel also adsorbed some dust, after mixing will seriously affect the cooling effect. and silicone touch too much, in the chip and heatsink between the extrusion,

reason? Answer: When playing the game, the reason for the dead flower screen is more, one is the graphics card's own hardware problems, such as the display of the graphics card is a minor damage, graphics card workmanship or poor compatibility, will lead to the electrical performance of the video card greatly discounted, such as this situation is best to use the replacement Because of the use of AGP8X graphics card, users can also in the BIOS to adjust the speed of the graphics card to agp4x t

not exceed 3.5mA. Temperature requirements refers to the chassis power supply internal temperature should not exceed 65 ℃. Electronic interference is divided into two kinds of conduction interference and radiation interference, conduction interference through the power line transmission, the frequency of 30 MHz below, the main interference audio audio section, such as the start of the power in the vicinity of the TV, audio and other household appliances may not be normal use, this is the impact

On the computer represents the power consumption of each component, especially the computer's CPU (central processing Unit) GPU (graphics processor) is an important indicator of computer consumption. is the highest power value that CPU companies refer to the heatsink design for a series of processors. TDP technology is to reduce CPU power consumption of energy-saving technology. CPU Power consumption The CPU's TDP power consumption is not the real p

multiplied by the current power under 2 W, can not add the radiator, if it is greater than 2W less than 15W need to add 200x200x4mm3 heatsink Board Adjustable chip output voltage adjustable range in the 1.25v-13.8v package form has the following several: So, the only thing that can add a heatsink is TO-220. Because there is overheating inside the chip protection, so in other packages, if the power consump

maintenance and maintenance, this time to come in handy. Through the fault surface, after a lot of analysis, finally determined that the CPU is poor heat dissipation, resulting in the CPU overheating protection function open and frequent restart. The author's computer configuration is the Intel Pentium 4 630 processor, 1GB ddr2-667 memory, gigabyte 945P-G motherboard, 160GB SATA hard drive, Rainbow 6600GT graphics card, configuration can be said to be the mainstream. But after running for just

System activation:1. Run cmd as Administrator2. SLMGR.VBS/UPK//Uninstall Product Key3. SLMGR/IPK W269N-WFGWX-YVC9B-4J6C9-T83GX//Installation4. slmgr/skms zh.us.to\5. Slmgr/atoMachine Assembly:1. Motherboard installation, including CPU, heatsink, and memory strips2. Look at the chassis structure, think of a good way to go line3. Install the power supply, distinguish the function of the power line4. Install motherboard, solid state, mechanical hard driv

1, computer hardware composition?Chassis, power, motherboard, CPU, memory, video card, NIC, hard drive, optical drive, etc.2, computer assembly machine order?(1), install CPU (2) Install CPU heatsink (3) Install memory(4) Installing the hard drive and optical drive (5) Installing the video card (6) Installing the front panel(7) Simple testing of major hardware(8) If the main hardware is normal, then connect the motherboard to the chassis3. Wiring the

) relationship, I²c Device selection/topology, interface device/line order definition, LED size/color/drive, heatsink, fan, JTAG, power topology/timing/circuit, etc.For DVT, the requirements are simple and complex: what interface on the board, chip, main device, circuit, it is necessary to test what, especially in the case of the Board normal operation of the power/voltage/ripple/timing, business interface of the eye Diagram/template, the internal dat

gather a lot of pollutants, in the humid environment is very easy to become bacteria, germs, "incubation base." These bacteria and fungi spread rapidly along the air duct and spread to the entire building. When a person's body resistance drops, these bacteria, mold will cause disease, such as colds, asthma, rhinitis and so on. There is no doubt that regular cleaning of the air conditioning to protect health.how can air conditioning be completely Cleaning clean? Most people will simply clean the

called the tiny ball GridArray (small ball grid array package), which belongs to a branch of BGA packaging technology. Kingmax Company was successfully developed in August 1998, its chip area and package area ratio of not less than 1:1.14, you can make the memory in the case of the volume of memory increased by one to one-fold, compared with TSOP packaging products, it has a smaller volume, better thermal performance and electrical performance.Memory products with TINYBGA packaging technology h

Ldo and Buck Buck regulator comparisonIn the control system with MCU/DSP/FPGA design, the low-voltage input stage (generally under 12V), the output 5v/3.3v/1.8v/1.5v/1.2v circuit, the common power chip is the buck (buck type) switching regulator and Ldo (low dropout) linear regulator. These two power chips in the application, have their own advantages and disadvantages, in the circuit design, it is necessary to use according to the actual choice.One, Ldo and Buck Buck regulator comparison1, when

Boot0_sdcard.fex, U-boot.fex and kernel (uimage) created from sources kernel built with many features enabled (Btrfs, USB serial adapters, Bluetooth, HDMI sound, nfsd ...) CPU runs at 1.53GHz, termal management adjusted so the all 4 cores is active up to °C GPIO, i²c (TWI), SPI enabled Linux FS created from scratch with debootstrap Mimimal image can is the base for server or desktop framebuffer Console works Serial (UART) Console works ssh installed, root login ower ssh enabled

reminded, a phase capacitance is sometimes used three sometimes with two, but the number of inductors and FET is relatively fixed, respectively, one and two, so the beginner to identify the phase number, can be biased in accordance with the number of FET and inductance as the basis.Real Combat! Mainstream motherboards with several phasesFinally, is our actual combat stage, using our knowledge and Qi Qi together to identify the motherboard power phase bar., we see Qi QI the motherboard power sup

IC 2003 Drive RelayThe left figure 1~7 is the signal input (in), the 10~16 is the output signal (out), and the 8 and 9 are IC power supplies. The diagram on the right is the inner schematic of the integration block.2.1 Simple introduction of working principleAccording to the input and output characteristics of IC Driver 2003, it is referred to as "drive" "inverter" "amplifier" and so on, now frequently used model: TD62003AP. When the 2003 input is high, the corresponding output is low, the rela

motherboard temperature is too high reason and solution: 50 more normal, games, etc. in 60, or even 70 degrees (occasionally), generally more than fifty or sixty degrees that should take measures to dissipate heat. 1. Your motherboard temperature monitoring failure (sensor damage) caused, the temperature does not change. 2. Your host box internal cooling performance is too poor, fan aging and other factors caused. 3.CPU model problem: If the processor for Pentium D, especially the Pentium D8