a few days ago we started the old yellow Pascal thousand-level GTX1050 Gemini, the bright spot of these two new cards is to control the power consumption is low enough premise also can guarantee good performance, but the range of performance improvement appears slightly less sincerity, and on the other hand AMD immediately announced a product to sniper them- Radeon RX 470D, as can be seen from the title, it is very good this time.
Regarding rx
SDRAM and DDR SDRAMSDRAM is a long time, but we said it certainly will not be confused with DDR, we usually understand the SDRAM is the SDR SDRAM, for the first generation of SDRAM, and DDR1 for the second generation, and even to the DDR4 we use now, in fact, for the fifth generation SDRAM, There is a need for clarification here. To show the difference, the subsequent article with SDR to refer specifically
When the bare board program is written on the OK6410, the DDR cannot be initialized successfully using Jink or using Loadbin ddr.bin 0xc000000 in Jlink-commander, and stays in the step of waiting for the DDR to initialize ready;Note: The first two days can also successfully initialize the DDR and be able to perform the operation of the UART initialization, and th
(1) In terms of appearance, the common SDRAM memory strips and DDR SDRAM memory strips are almost indistinguishable, but careful observation will find many differences. The SDRAM is often said to be DIMM memory, it has a common (84x2 face) point of contact, so this memory is called 168-line memory, and the new standard DDR SDRAM memory bar has 184 points of contact.
(2) SDRAM's gold finger has two notches,
the DDR Stress Test Tool provides two purposes. First, it can be used to calibrate the DDR3 so that the MMDC PHY delay settings and PCB are paired to achieve the best dram new energy. The whole process is fully automated, so customers can get their DDR3 working in a short period of time. In addition, the tool can run memory stress tests to verify the functionality and reliability of the DDR3. Stress tests can be used to verify hardware connections, MM
transplant engineer himself, generally set as the appropriate size (not too small, too small easy overflow; not too big, too big wasted space)(5) Partitions are determined before the system is migrated, using the same partition table in Uboot and kernel. The partitioning method in future system deployment and system code must also be the same.2. Uboot stage DDR partition(1) The partition of DDR and the par
As we all know, there are currently three kinds of desktop memory in the market, specifically divided into DDR,DDR2 and DDR3, then the three kinds of memory in the end how to judge and distinguish it? Now the Wuhan Long Dragon Computer Maintenance center of the author to give you a specific talk about the difference between them in order to solve the computer we want to upgrade the purchase of memory strips, The memory of the purchase of the wrong, th
DDR internal composition
DDR is composed of multiple storage arrays. We call these storage arrays as banks. The early SDRAM was split into two banks, and then four, this is the maximum number of banks specified in the SDRAM specification. In the DDR2 standard, the number of banks is increased to 8.
Each storage array is like a table. Each cell in a table is the smallest storage unit. The size can be 4, 8, o
Label:looking at the DDR manual for a while, feeling a little bit about it, want to actually board debugging, but the lab is not much usable development Board, took a piece of ZYNQ board looked, DDR does have, but has integrated the controller, and the controller is placed on the PS end, PL can only be accessed through the Axi interface. But the other two development boards also like this, simply use Axi t
ZYNQ image paths to be used for ZYNQ video-related developers. This post describes a camera +hls image processing +DDR storage +VGA display image path. This channel is I and another colleague to achieve, I am responsible for the camera FPGA driver, HLS image processing IP Implementation and the system later optimization. Because of the company project, it is not possible to provide engineering documents, only to provide the framework and ideas.The sy
The error was reported today when the client used Modelsim fully automated simulation of the DDR SDRAM controller. I began to wonder if lattice software is too garbage, and there are weird problems. Tossing a night, found that I wronged the lattice, in fact, is the problem of Modelsim. I use the modelsim10.2, the error is like. A long time ago, a certain version will not be error, will only prompt warming.So how do we solve this problem? First you nee
Speed Grade (DATARATE/CL-TRCD-TRP)-1066 Mbps/7-7-7-Mbps/5-5-5 datarate Data rate 800,1066,1333,1600, even 2000MHz CL-TRCD-TRP Timing1.CL(CAS Latency): "Latent time of memory read-write operations Forefront Address Controller" (Possible options: 1.5/2/2.5/3)Other possible descriptions in the BIOS are: TCL, CAS Latency time, CAS Timing Delay. This parameter is important and is usually marked on the memory bar. The CAS parameter options for DDR memory
channel signal
Signal
Source
Describe
RID[3:0]
Equipment
Read ID tag. The value of the RID must match the value of arid.
RDATA[31:0]
Equipment
Read the data.
RRESP[1:0]
Equipment
Read response. This signal indicates the state of the read transmission: OKAY, Exokay, Slverr, Decerr.
Rlast
Equipment
Read the last data that the transaction is transmitting.
Rv
Graphics information, as shown in the following figure:
Blue Screen screenshot:
because the local video is no problem, and play the game has not seen this kind of phenomenon, so the initial suspicion is the browser problem. But it's still the
[U-boot: v2013.07-RC2]
[Author: Bo Shen ]
1. Enable the MD command
You can run the MD command by defining config_cmd_memory.
Note: Because this definition is already available in , it is in the configure file related to the Board (in ). By default,
SDRAM Calculation of capacity
Calculate the number of addressable locations (don't think of bit/byte/word for now)
Number of address lines: 11 (A0-A10)
Number of banks: 2 (BA0-BA1)
Max number of rows = 11 (I. e., no. of address lines)
Max number of
Author: DriverMonkey
Phone: 13410905075
Mail: bookworepeng@hotmail.com
QQ: 196568501
Because DDR2 is used for development and DDR3 is used in our project, we need to modify it.
1. At the beginning of the debugging, debug DDR3 according to the
P-bank: A concept of the early computer. Purpose: Match the width of the data bus of the memory chip and CPU chip. Method: Parallel multiple memory modules.L-bank: Segmentation of internal storage arrays to avoid addressing conflicts and improve
[U-boot: v2013.07-RC2]
[Author: Bo Shen ]
1. Enable the base command
Defined: config_cmd_memory,You can enable the base command.
Note: Because this definition is already available in , it is in the configure file related to the Board (in ). By
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