Allegro in thermal relief pad and anti pad

Have never understood the relationship between thermal relief pad and anti pad, and now it is clear. Specific as follows:

Suppose now to do the board is a four-layer board, the specific layering is as follows:

Begin Layer:top

Internal1:vcc

Internal2:gnd

End Layer:bottom

Assuming a through hole type pad, the connected network is VCC, as shown in the following figure,

Top floor for regular pad

The bottom is also regular pad

Through hole INTERNAL1 layer is the thermal relief pad (here is generally through the flash pad will drill and INTERNAL1 connection)

Through-hole internal2 layer is anti pad (here is generally through the anti pad Internal2 and drill isolation)