Analysis on SAN cabling Implementation Scheme

The SAN network usually uses optical fiber and supports high-speed transmission of 2G, 4G, 8G, and 16G. The wiring density of the SAN area is relatively high. In the high-density Wiring Scheme, SAN's MDA needs to involve management and maintenance functions. We should also consider the subsequent space expansion. Cross-wiring should be adopted in this region.

In the EDA area of servers and storage devices, interconnection solutions can be used to improve cabling efficiency as much as possible, because the EDA area mainly involves subsequent maintenance and resizing, channel Management is rarely involved. Therefore, MPO (or MTP) connections can be used to solve high-density cabling in limited cabling space.

Because the devices used in this region are usually devices of special sizes and cannot be solved by traditional cabling, there are usually three kinds of cabling solutions available in the industry, that is, the cable tray, cabinet, floor. On the cable tray, the wiring products are directly installed on the cable tray, the trunk cable is connected to the back of the distribution rack, and the front jumper of the distribution rack is connected to the internal port of the device through the top of the device, the main advantage of this method is relatively low cost, neat and beautiful wiring, flexible and convenient installation, basically not limited by the manufacturers and models of equipment. The disadvantage is that the product installation location is high, which is inconvenient during maintenance or when jumper is added.

In a cabinet, this type of wiring is to design various Installation Accessories according to different device models and specifications. These accessories can be easily installed on the equipment, in this way, EDA can be easily integrated within the device.

This method has the advantages of convenient wiring, easy resizing, and convenient maintenance. The biggest drawback is that due to the large number of device models, many specialized wiring products are required according to the device structure, which is limited by the Internal Space Structure of devices of various manufacturers.

Under the floor, place the floor box below the floor, and the trunk cable passes through the wiring panel in the floor box, the patch cord from the wiring panel is routed from the bottom of the device under the floor to the device and connected to the device's port. This wiring is suitable for cabling on the underfloor, the main advantages of this method are the convenience of resizing and maintenance, and are not limited by the device models and differences. The disadvantage is that the installation cost is slightly higher than that of the floor, which hinders the underfloor air flow.