Card body test

Currently, there is a standard for testing cards with or without chips, which is the ISO/IEC 10323 standard. There is also the en 1292 standard in Europe, but it is dedicated to smart cards and terminals, including their general electrical requirements. The relevant card standards are often related to the individual test and test steps for feature verification specified in the standard.

Many common tests and tests for smart cards are described in alphabetical order in the following sections. See figure 1. The test lab room of the card manufacturer usually has 100 ~ A list of 150 different tests.

Figure 1 Classification and selection of card tests (each individual card element: holographic images, magnetic stripe, Chip, etc., all require a series of tests)

Environment conditions are the basic requirements for testing environment standardization, which means that in the test lab, the temperature must be kept at 23 ℃ + 3 ℃ while the relative humidity is between 40% and ~ Between 60%, the tested card must be adapted to more than 24 hours in this condition to carry out the actual test.

1. magnetic stripe wear test

(According to: ISO 7811-2; Test Procedure: ISO/IEC, 10373)

To understand how the magnetic stripe reflects wear, first write the test data into the magnetic stripe, and then use a dumb read/write head. The hardness is 110hv to 130hv and the curvature radius is 10mm, along the magnetic stripe. 5 N of the external force often move times, and then read the data, the signal range must be within the range specified by ISO 7811-2.

2. Adhesion or bonding into blocks

(According to: ISO 7810; Test Procedure: ISO/IEC 10373)

This test checks that the shape of the stored cards changes under certain environmental conditions, and 5 unembossed cards are stacked together, at the relative temperature of 40 ℃ and 90%, the temperature is uniformly under the pressure of kPa for 48 hours, and then the layer, color change, surface change and other visual changes are checked.

3. Bending Stiffness

(According to: ISO 7810; Test Procedure: ISO/IEC 10373)

To determine whether the card has the required bending stiffness, the left end of the card is clamped at a depth of 30mm, and the front of the card is downward. First, the bending volume is measured without load, and then the 0.7n load is applied to the edge of the other end of the card to calculate the bending Volume Difference in the case of load and no load, the results show the stiffness of the card. The bending stiffness test is usually executed at a temperature higher or lower than the normal test temperature of 23 ℃.

4. Chemical Resistance

(According to: ISO 7810, ISO 7811-2; Dam test procedure: ISO 10373)

The chemical resistance of the card body and magnetic stripe is examined using these tests. At a temperature of 20 ℃ ~ At 25 ℃, place different cards in the following accurately defined liquids.

· 5% sodium chloride solution;

· 5% acetic acid solution;

· 5% sodium carbonate solution;

· 60% ethanol solution;

· Gasoline (ISO 1817 );

· 50% ethylene glycol solution.

Remove the cards from the solution one minute later and use visual or magnetic stripe reader for testing.

5. Dynamic Bending pressure

(According to: ISO 7816-1; Test Procedure: ISO/IEC 10373)

Figure 2 shows the dynamic bending stress, which is bent at a rate of 30 times per minute (0.5Hz), with a length of 2cm and a width of LCM (R ), bend at least 250 times (a total of 1 000 cycles) in each of the four possible directions; the card must not be damaged.

Figure 2 How the card is loaded during dynamic bending stress testing

6. Dynamic torsion stress

(According to: ISO 7816-1; Test Procedure: ISO/IEC lo-373)

In the dynamic torsion stress test, the unit is twisted 30 times per minute (0.5Hz) along the longitudinal axis to torsion ± 15 .. The standard requires that the function of the card should not be invalidated and the card should not be visible or damaged after 1 000 reverse cycles.

7. Contact Resistance and contact impedance

(According to: ISO 7816-1/2; Test Procedure: ISO/IEC 10373)

The contact resistance is an important basis for the stable power supply and data transmission of the card microcontroller. The contact resistance is added to the diagonal corner of the smallest available rectangular contact plane with two probes, and 0.5 ± 0 is applied. in force, the probe is a sphere with a radius of 4mm, the surface is gold plated, the resistance between the two probe should be less than 0.5 Ω.

8. Electromagnetic Field

(According to: ISO 7816-1; Test Procedure: ISO/IEC 10373)

In this test, the contents of the memory of the card should not be changed when the maximum rate of the card is moved to a static electromagnetic field with a strength of 10 00 OE (79.580 H.

9 Flammability

(According to: ISO 7813; Dam test procedure: ISO/IEC 10373)

The flammability of the card is measured by a jet lamp. During measurement, the side is placed with a 45 ° angle clip in the specified jet lamp flame (diameter 8.5mm, height 25mm) for 30 s.

10. Spatial Changes of magnetic flux changes

(According to: ISO 7811-2; Test Procedure: ISO/IEC 10373)

This measurement determines whether the magnetic flux changes of individual BIT codes in the magnetic stripe are uniform and have sufficient strength. A Reading head passes along the magnetic stripe and records the changes in the magnetic field. The measurement results are compared with the specified value in ISO 7811-2.

1. letter embossed convex height

(According to: ISO 7811-1; Test Procedure: ISO/IEC 10373)

In this test, the thickness of the convex print is measured by a micrometer, and the applied force is between 3.5N and 5.9n.

12. Height and Surface Profile of the magnetic stripe

(According to: ISO 78 1 1-2/4/5; Test Procedure: ISO/IEC 10373)

This test measures the height and surface uniformity of the magnetic stripe. The height contour is obtained using a special measuring device described in detail in the standard.

13. card size

(According to: ISO 7810; Dam test procedure ISO/IEC 10373)

This test measures the height, width, and thickness of a non-embossed card. Apply the power to the card, and use the profile projector to measure the height and width. to measure the thickness, divide the card into four equal rectangles. Use a micrometer to apply the power at 3, between 5N and 5.9n, the thickness is measured at the center of each rectangle. the maximum and minimum values are compared with the standard thickness.

14. deformation caused by card dimensional stability and temperature and humidity

(According to: ISO 7810; Dam test procedure ISO/IEC 10373)

The shape and size of some types of plastics change significantly with the atmospheric temperature. Therefore, the ability of cards to meet the standards must also be tested under these conditions. During the test, the temperature and humidity are changed when the card is placed on a surface. The test conditions are-35 ℃, the relative humidity of + 50 ℃ and + 25 ℃ is 5%, and the relative humidity of + 25 ℃ is 95%, each time after exposure of ω minutes in these conditions, check whether the size and shape change relative to the standard value.

15. Contact Position

(According to: ISO 7816-2; Test Procedure: ISO/IEC 10373)

This test is used to measure the contact position. The card is placed on a flat and subjected to the power of 2.2n ± 0. 2n. Next, use a method with an expected accuracy of at least 05mm to measure the position of the contact relative to the card edge.

16. Light transparency

(According to: ISO 7810; Test Procedure: ISO/IEC 10373)

Some cards have optical bar codes embedded in thin films. This test is intended to determine the transparency of the covering layer and the rest of the body. The side of the card is illuminated by a light source, and the other side is measured by a detector with a sensitivity of nm light.

17. Contact Surface Profile

(According to: ISO 7816-1/2; Test Procedure: ISO/IEC 10373)

This test compares the surface profile of a single contact with the surface of the rest of the card to ensure that the contact is essentially in the same plane as the whole card surface.

18. Surface Roughness of magnetic stripe

(According to: ISO 7811-2; Test Procedure: ISO/IEC 10373)

The surface roughness and height of the magnetic stripe are measured in the same way as the surface profile. However, it uses a special probe to make the surface roughness of the magnetic stripe can be measured. The significance of this test is that the surface roughness is one of the main factors that the reading/writing head of the magnetic stripe reader is worn out.

19. X rays

(According to: ISO 7816-1; Dam trial procedure: ISO/IEC 10373)

(E) The content of an EPROM memory unit changes due to X-rays, just like ultraviolet rays, in order to test the memory's ability to resist X-rays, the chip emits 70 KV x-rays, then checks for any changes in the memory content, or tests whether they are still writable.

20. Vibration

(According to and test procedure: ISO/IEC 10313)

As cards are often subject to severe vibrations (for example, mobile phones in cars) during transportation or use, tests must also be conducted as appropriate. Place the cards on the shaking table and vibrate along the three axes at a frequency range of 10Hz to 5mm Hz with a magnitude greater, the functions of the chip and the content of the storage device should not be adversely affected.

21. Amplitude Measurement

(According to: ISO 7811-2; Dam trial procedure: ISO/IEC 10373)

This test checks the signal amplitude and resolution of the stripe code. A standard reading/writing head passed along the magnetic stripe at a specified exact speed is used for testing.

22. Static Electricity

(According to: ISO 7816-1; Dam trial procedure: ISO/IEC 10373)

This is a test that only makes sense for smart cards and is used to check the robustness of the chip against electrostatic discharge ESD (electrostatic discharge, A 100pf capacitor is charged to ± 1500v sequentially and discharged to different contacts of the chip through a 1500 Ω throttling resistor. Because these discharges must not endanger the functions of the chip and do not change the content of the memory.

23. trun xibu line

(According to: ISO 7816-1; Test Procedure: ISO/IEC 10373)

Since (e) EPROM storage is exposed to ultraviolet rays and will lose their storage content, there is a special test to determine whether a smart card is sensitive to ultraviolet rays. Use ultraviolet radiation with a wavelength of 254nm and an energy density of 15ws/cm2 for 10 ~ 30 minutes. The result should be (e) the content of the EPROM must remain unchanged.

24. Layered

(According to: ISO 7810; Test Procedure: ISO/IEC 10373)

The following tests only make sense for Multilayer cards, which are made up of several plastic layers. The top layer is split from the core layer with a sharp tool at a certain point. As a result, the tester tries to separate the two stacked layers. Measure the required force and compare it with the reference value.

25. Card Deformation

(According to: ISO 7810; Test Procedure: ISO/IEC 10373)

The deformation of the measurement card is stuck on a flat surface, and the deformation is measured with a contour projector. The measurement is mainly used to punch a card from a large basic material.

Of course, there are other test items, such as the number of cycles inserted, the ability to resist ink pollution, the stability of plasticizer and the ability to resist sweat and saliva, all depend on where and how to use, you must select the test conditions before performing the appropriate test.

Card body test