COG (chip on glass)

Source: Internet
Author: User

COG (chip on glass)

Directly connect the I/O of the driving IC to the electrode terminal of the display glass substrate. The Drive IC used by the cog module must first grow a convex block (bumping ), the convex block material of the liquid crystal panel module is Au. At present, the manufacturing process of using ACF as the connection material is relatively mature.


It is a process of connecting electrode terminal of display glass substrate and I/O of driving IC directly to each other. the driving ic must have bumping, and the material used for liquid crystal substrate bumping is Au. the manufacturing process, which uses ACF as its connecting material, is more matured.

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