Discrete component package size and PCB board process and design examples

Discrete Component Package Dimensions

Inch	Mm	(L) mm	(w) mm	(t) mm	(a) mm	(b) mm
0201	0603	0.6±0.05	0.30±0.05	0.23±0.05	0.10±0.05	0.60±0.05
0402	1005	1.00±0.10	0.50±0.10	0.30±0.10	0.20±0.10	0.25±0.10
0603	1608	1.60±0.15	0.80±0.15	0.40±0.10	0.30±0.20	0.30±0.20
0805	2012	2.00±0.20	1.25±0.15	0.50±0.10	0.40±0.20	0.40±0.20
1206	3216	3.20±0.20	1.60±0.20	0.55±0.10	0.50±0.20	0.50±0.20
1210	3225	3.20±0.20	2.50±0.20	0.55±0.10	0.50±0.20	0.50±0.20
1812	4832	4.80±0.20	3.20±0.20	0.55±0.10	0.50±0.20	0.50±0.20
2010	5025	5.00±0.20	2.50±0.20	0.55±0.10	0.60±0.20	0.60±0.20
2512	6432	6.40±0.20	3.20±0.20	0.55±0.10	0.60±0.20	0.60±0.20

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Sheet Technology

The following parameters or tables represent only part of the plate process and simulation selection parameters, the actual production will have a certain difference (but not a small deviation!). ）

The simulation software uses Polar's "Si9000".

1oz=28.35g,1oz copper thickness refers to 1 square feet of area on average copper foil weight equal to 1oz average thickness, hoz represents 0.5oz.
1ft2=0.09290304m2, copper density =8.9g/cm3. h=1oz/copper density/1ft2.
The calculated h=34.3um, the 1oz copper thickness =h=34.3um=1.35mil.
However, in the PCB production, the inner layer of copper thickness is reduced by polishing and etching, and the outer layers are thickened by electroplating copper.
Take inner layer 1.2mil, outer 1.8~2.1mil.

PCB Core Board (CORE) thickness comparison table:

Nominal core plate (mm)	0.13	0.21	0.25	0.36	0.51	0.71	/
British Standard (MIL)	5	8	10	14	20	28
Nominal core plate (mm)	1.0	1.2	1.6	2.0	2.4	2.5	0.8
British Standard (MIL)	38.98	45.25	61.02	76.77	92.52	96.46	31.5

Note: The first row of the core plate is not copper, the third row of the core plate containing copper.

thickness and dielectric constant of semi-cured sheet material (prepreg):

Model	Thickness	Dielectric constant
1080	2.8mil	4.3
3313	3.8mil	4.3
2116	4.5mil	4.5
7628	6.8mil	4.7

Due to the corrosion of copper foil, the cross-section of the conductor is not rectangular, but trapezoidal.

Line trapezoidal cross-sectional parameter comparison table:

layer	line width (mil)	downline width (mil)
inner layer (0.5oz copper thickness)	w-0.5	w
inner layer (1.0oz copper thickness)	w-1	w
outer (0.5oz copper thick)	w-1	w
outer (1.0oz copper thickness)	w-0.8	w-0.5

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Example of PCB overlay design

The following is my work 6 layer impedance plate stack design case, for each plate plant material differences, simulation calculation has certain discrepancies.

Design Requirements: Plate thickness 1.0mm, single-ended impedance 50ohm±10%, differential impedance 90ohm±10% and 100ohm±10%.

Laminated design signal (L1)--gnd (L2)--signal (L3)--signal (L4)--power (L5)--signal (L6).

PCB suppliers to provide plate compression diagram:

The L1/L6 reference plane is the L2/L5,L3/L4 reference plane respectively L2 (main) &L4 and L3&L5 (main).

The following calculations are provided by the plate factory model and the calculation of parameters, each plate factory are different, preferably before the design and the plate factory to obtain relevant parameters. Adjust plate lamination and line width to meet impedance requirements.

If there is no fixed supplier, you need to select a suitable plate laminated structure and according to similar parameters, and finally with the plate factory fine-tuning line width to meet the design requirements (impedance).

L1/L6 single-ended 50OHM,PCB line width of 5mil, simulation such as:

L1/L6 differential 90OHM,PCB line width is 5mil& line distance 6mil, simulation such as:

L3/L4 differential 90OHM,PCB line width is 5.3mil& line distance 6mil, simulation such as:

L1/L6 differential 100OHM,PCB line width is 4mil& line distance 7mil, simulation such as:

L3/L4 differential 100OHM,PCB line width is 4.5mil& line distance 7mil, simulation such as:

Discrete component package size and PCB board process and design examples