PCB design highlights

PCB highlights:

August 5, 2014

13:04

Ground Line Design

1.1 classified analog, digital, shell, and system land

1.2 grounding mode: Single Point Grounding (F <1 MHz to avoid circulation), multi-point grounding (F> 10 MHz to reduce ground impedance) for 1 ~ 10 MHz, multi-point (wavelength <10 * ground line length)

1.3 increase the ground line, increase the running current, and increase the anti-noise capability> 3 m

Electromagnetic compatibility:

2,. 1 adopts the #-shaped wiring, that is, vertical wiring mode and metal hole reducing are adopted to avoid long distance parallel.

2.2 wire width is suitable. Short and rough wires can reduce the inductance of printed wires, thus inhibiting transient current. Therefore, for high transient current of clock leads and bus/row drivers, short and coarse wires are used. In general, the integrated circuit 1 ~ 0.2mm, 1.5mm for Discrete Devices

Three circuit board size and layout:

Comprehensive layout of cost, heat dissipation, easy-to-generate/susceptible jamming devices with reasonable spacing

Iv. Heat Dissipation:

Sensitive to temperature, heat, and low heat dissipation, and vice versa. The heat flow distribution and flow path should be studied and analyzed separately based on the natural air and forced air cooling methods.