Wafer (Wafer)

Wafer(Wafer) is a silicon wafer used for the preparation of a silicon semiconductor IC. It is called a wafer because it is in a circular shape. Wafer is a production Integrated CircuitThe carrier used. Generally, wafer multi-finger single crystal silicon.

Wafer is the mostCommonly used semiconductor materials are divided into 4 inch, 5 inch, 6 inch, 8 inch, and other specifications according to their diameter, recently, it has developed more than 12 inch specifications (14, 15, 16 ,...... ). The larger the wafer, the more ics can be produced on the same disc, which can reduce the cost. However, the material technology and production technology have higher requirements. Generally, the larger the diameter of a silicon wafer, the better technology of the wafer factory. The yield rate is very important in the process of wafer production.

 

The silica ore is extracted by arc furnace. After hydrochloric acid chloride and distillation, high-purity polysilicon is made. The purity is as high as 99.999999999%. The wafer manufacturing plant then melted the polysilicon, then added a small silicon crystal grain into the solution, and then pulled it out slowly to form a cylindrical silicon crystal rod, because a silicon rod is gradually generated from a small grain in a melting silicon raw material, this process is called "Long Crystal 」. After grinding, polishing, and slicing, the silicon wafer becomes the basic raw material of the integrated circuit factory. This is the wafer 」.
Simply put, a single crystal silicon wafer is made from ordinary Silicon Sand. After dissolution, purification, and distillation, it is made into a single crystal silicon rod. After polishing and slicing, the single crystal silicon rod becomes a wafer.
The wafer is processed with multiple Optical Masks, each of which includes the coating, exposure, development, corrosion, penetration, or steaming of the photosensitive agent, to form an IC Wafer with Multilayer lines and components, then it is handed over to the testing, cutting, and packaging plant in the back section to form the finished integral circuit.