What is video memory encapsulation

Video memory packaging refers to the memory of the particles used in the packaging technology type, packaging is the memory chip wrapped up to avoid the chip and the outside contact to prevent the damage to the chip outside. Impurities in the air and bad gas, and even water vapor will corrode the precision circuit on the chip, resulting in a decline in electrical performance. Different encapsulation technology has great difference in manufacturing process and process, and it plays an important role in the performance of memory chip after encapsulation. The main memory packaging forms are QFP, TSOP, Tsop-ii, MBGA, Tsop-ii and MBGA are more common. Early SDRAM and DDR video memory used a lot of tsop-ii, and now with the increase in video memory speed, more and more video memory using the MBGA package, especially DDR2 and DDR3 video memory, all using the MBGA package. In addition, many manufacturers also DDR2 and DDR3 memory of the package known as the FBGA, which is more emphasis on the arrangement of pins to the name, is actually the same package form. In addition, although MBGA and tsop-ii can achieve a higher frequency of video memory, but it is not easy to think that the MBGA package of memory must be better overclocking, because it is easy to overclocking, more depending on the factory agreed to the default frequency and video memory can actually reach the gap between, including the design and manufacture of graphics, Simply put, the MBGA package can achieve a higher frequency, but its default frequency is also higher.

QFP

QFP is the abbreviation of Quad Flat package, which means "Small block plane package". The QFP package is used more frequently on early graphics cards, but there are few QFP packages with speeds above 4ns, because of the process and performance problems that have been gradually replaced by tsop-ii and BGA. The QFP package has pins around the particles and is quite obvious to identify.

QFP Package Memory

Tsopii

Tsop-ii (Thin Small out-line Package, thin small size package). TSOP package is to make pins around the chip, using SMT technology (surface installation technology) directly attached to the surface of the PCB board. TSOP package size, parasitic parameters (the current changes greatly, resulting in output voltage disturbances) reduced, suitable for high-frequency applications, easy to operate, reliable and relatively high. At the same time, TSOP package has the advantages of high yield and cheap price, so it has been widely used. TSOP package is currently the most widely used memory package type. The TSOP-II package pins are on both sides of the video memory.

TSOP Package Memory

Mbga

MBGA refers to the miniature Ball grid array package, which is called Micro Ball grid array Package. Unlike TSOP memory chips, MBGA pins are not exposed, but are parasitic on the bottom of the chip in the form of tiny tin balls, so this memory is not visible to the pins. MBGA has the advantages of less noise, good heat dissipation, excellent electrical performance, the number of feet can be more, and can improve the yield. The most prominent is because the internal components of a smaller interval, signal transmission delay is small, can make the frequency of a greater increase.

MBGA Package Memory

MBGA package has the advantage of less noise, good heat dissipation, excellent electrical performance, the number of feet can be more, and can improve the yield of goods. The most prominent feature is that the internal components of the interval is smaller, signal transmission delay is short, you can increase the frequency of a larger.

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MBGA memory performance is excellent compared with TSOP package memory. But also to the circuit wiring has put forward the request, the former as long as 66Pin, the lead is very long, and are lying on the PCB board, design, welding, processing and testing relatively easy, while the latter area of only about 1/4 of the former, but there are 144Pin, each pin is a small size of the tin ball, design and production is much more difficult. Due to the difficulty of MBGA manufacturing technology, the difficulty of manufacturing applications is considerable, and the high cost of MBGA video memory, so the graphics card with this type of memory is less.