A number of software board (Fpcb/flex Cable) manufacturing plants were organized to design the circuit design guide to avoid quality problems.
| 1.relationship between Through Hole, land , Cover Film, and Cover Coat |
|
Not Recommended (no suggestions) |
Recommended (suggestion) |
|
|
|
|
|
|
|
Through-hole welding mattress must be used cover film Cover in order to avoid the use of: 'd fall. |
|
|
|
|
| 2. |
Circuit Pattern Guidance |
|
|
Not Recommended (no suggestions) |
Recommended (suggestion) |
|
Avoid sudden expansion or reduction in pattern width. No sharp angle. |
Avoid sudden changes in the width of the line or small, and should not have a sharp angle . |
|
|
|
|
|
|
|
|
|
| 3. |
Design at Folding Area |
|
|
Not Recommended (no suggestions) |
Recommended (suggestion) |
|
If the FPC need to is folded then the folding area shall is covered with cover film to prevent trace breaking. |
If the board has the need to bend, it is suggested that cover Film must cover the bend to avoid line break. |
|
|
|
|
Avoid Folding at below locations A. The change of pattern width. B. Folding parallel to the pattern. |
Avoid the following bends and methods: A. Where the line width changes. B. Parallel line Bend. |
|
|
|
|
|
|
| 4. |
Plating Leads |
|
|
Not Recommended (no suggestions) |
Recommended (suggestion) |
|
Plating leads and disconnection holes should be designed as illustrated in order to avoid short circuits. |
The neighboring route should be opened with maximum angle to avoid short circuits. |
|
|
|
|
|
|
| 5. |
Connector Terminal |
|
|
|
|
FPC Trace Pattern Layout Design Notices (software circuit design notes)