One-day tour of Intel/Micron 25nm craft FAB (Multi-Chart) (1)

Last weekend, Intel and micron, a joint venture Flash Manufacturing Company, IM Flash Technologies and LLC (IMFT), announced that they had begun the trial of 25 bn Flash memory chips. In addition to the paper announcement, they actually invited a number of media to visit IMFT's 25nm craft Fab in Lehi, Utah.

 

IMFT factory at the foot of snow mountains

 

In the factory structure, the most critical dust-free room for semiconductor products is located on the third layer. The pressurized ceiling forms a top-down air flow, and equipment maintenance is completed on the second layer of the "SubFab" layer.

 

The packaging process before entering the Cleanroom. Due to strict requirements in the Cleanroom, the following internal photos are from the IMFT official website)

 

In the wafer factory corridor, the top Automatic Transportation System AMHS is transporting wafers at a speed of 13 kilometers per hour between various manufacturing stages without stopping for 24 hours. Each vehicle is mounted in a FOUP front-end opening film box), where up to 25 300mm wafers can be loaded.

 

All the holes on the plant Floor ensure that the air is circulated from top to bottom, and dust may be minimized.

 

The FOUP film box is attached to a manufacturing device, and the latter is being lifted by AMHS.

 

 

Almost all manufacturing processes are completed automatically, so the work of most workers in the plant is to ensure the normal operation of these equipment.