(reprint) PCB Package size

0805 Package Size /0402 Package Size /0603 Package Size /1206 Package Size ( reproduced )

Electronic components 2010-09-08 21:21:48 read 672 comments 0 font Size: Big Small Subscription

Package size and Power relationship:
0201 1/20w
0402 1/16w
0603 1/10w
0805 1/8w
1206 1/4W
Package size and package correspondence relationship

0402=1.0mmx0.5mm
0603=1.6mmx0.8mm
0805=2.0mmx1.2mm
1206=3.2mmx1.6mm
1210=3.2mmx2.5mm
1812=4.5mmx3.2mm
2225=5.6mmx6.5mm

SMD resistor capacitance Common packaging has 9 kinds (capacitance refers to the non-level SMD), there are both imperial and metric representations. The imperial representation method is a 4-digit EIA (American Electronics Industry Association) code, the first two representing the resistance or capacitance length, and the last two digits representing the width, in inches. The 0805 package we often say refers to the imperial code. In fact, the metric is rarely used, and the metric code is represented by a 4-digit number in millimeters, similar to Imperial.

Package Size Regulations Lattice corresponding off The following table:

Inch (inch)	Metric (mm)	Length (L) (mm)	Width (W) (mm)	High (t) (mm)
0201	0603	0.60±0.05	0.30±0.05	0.23±0.05
0402	1005	1.00±0.10	0.50±0.10	0.30±0.10
0603	1608	1.60±0.15	0.80±0.15	0.40±0.10
0805	2012	2.00±0.20	1.25±0.15	0.50±0.10
1206	3216	3.20±0.20	1.60±0.15	0.55±0.10
1210	3225	3.20±0.20	2.50±0.20	0.55±0.10
1812	4832	4.50±0.20	3.20±0.20	0.55±0.10
2010	5025	5.00±0.20	2.50±0.20	0.55±0.10
2512	6432	6.40±0.20	3.20±0.20	0.55±0.10

package size and power available off It is usually as follows:

1/2w

Imperial	Power W
0201	1/20w
0402	1/16w
0603 / td>	1/10w
0805	1/8w< /p>
1206	1/4w
1210	1/3w
1812
2010	3/4w
2512	1w

About the capacitance of the package in addition to the above SMD package, for the electrodeless capacitance, the package model also has a RAD type, such as "RAD-0.1" "RAD-0.2" and so on, the suffix number represents the distance between two pads in the package model, in inches. The encapsulation model with the electrode electrolytic capacitance is the RB type, for example from "rb-.2/.4" to "rb-.5/.10", the first digit of the suffix represents the distance between two pads in the package model, and the second number represents the size of the capacitor shape, in inches.

Resistance: RES1,RES2,RES3,RES4; Package property is Axial series
nonpolar capacitance: cap; package properties are RAD-0.1 through rad-0.4
Electrolytic Capacitor: electroi; package properties are rb.2/.4 to rb.5/1.0
Potentiometer: Pot1,pot2; package properties vr-1 to Vr-5
Diode: Package property is diode-0.4 (Low power) diode-0.7 (high Power)
Transistor: Common Encapsulation property is to-18 (ordinary transistor) to-22 (high power transistor) to-3 (High power Darlington)
Power supply voltage regulator block with 78 and 79 series, 78 series such as 7805,7812,7820, etc.
79 Series with 7905,7912,7920, etc.
Common encapsulation properties are to126h and to126v
Rectifier Bridge: Bridge1,bridge2: Package attribute is D series (d-44,d-37,d-46)
Resistance: axial0.3-axial0.7 which 0.4-0.7 refers to the length of the resistor, generally used AXIAL0.4
Porcelain chip capacitance: rad0.1-rad0.3. Wherein 0.1-0.3 refers to the capacitance size, generally with RAD0.1
Electrolytic capacitance: rb.1/.2-rb.4/.8 which. 1/.2-.4/.8 refers to the capacitance size. General <100uf with rb.1/.2, 100uf-470uf with rb.2/.4, >470uf with rb.3/.6
Diode: diode0.4-diode0.7 wherein 0.4-0.7 refers to the length of the diode, generally with DIODE0.4
Light Emitting diode: rb.1/.2
Integration block: DIP8-DIP40, where 8-40 refers to how many feet, 8 feet is the DIP8 chip resistor

　　

Part encapsulation refers to the appearance and position of the solder joint that the actual part is soldered to the board. It's a purely spatial concept. Therefore, different components can be shared in the same 10-piece package, and the same components can be packaged in different parts. Like resistors, there is a traditional pin-type, the size of this component, the circuit board must be drilled to place components, after drilling, inserting components, and then tin furnace or spray tin (also can be welding), the cost is higher, the newer design is the small size of the surface SMD components (SMD) This component does not need to drill, The semi-fused solder paste is poured into the circuit board with a steel film, and the SMD element is placed on the circuit board.

About part packaging as we said earlier, in addition to the components in the DEVICE.LIB library, the components of other libraries already have a fixed component package because the components in this library are in many forms: for example, the transistor illustrates:

Transistors are one of our common components, in the DEVICE.LIB library, simple only NPN and PnP points, but in fact, if it is NPN 2n3055 that it may be the TO-3 of the iron shell, if it is NPN 2n3054, It is possible that the TO-66 or TO-5 of the iron shell, and the learning CS9013, there are to-92a,to-92b, there are to-5,to-46,to-52 and so on, the ever-changing. Another is the resistor, in the device library, it is also simply referred to as RES1 and RES2, whether it is 100ω or 470kω are the same, for the board, it is not related to the Ohm number, completely according to the resistance of the power of the choice of the 1/4w and even 1/ 2W resistor, can be encapsulated with AXIAL0.3 components, and a large number of power, the use of axial0.4,axial0.5 and so on. The commonly used components are now packaged as follows:

axial0.3-axial1.0 of resistive and nonpolar double-ended components

electrodeless capacitance rad0.1-rad0.4

Polar capacitance rb.2/.4-rb.5/1.0

Diode DIODE0.4 and DIODE0.7

Quartz Crystal oscillator XTAL1

Transistor, FET, UJT to-xxx (to-3,to-5)

Variable resistors (POT1, POT2) VR1-VR5

Of course, we can also open the C:\Client98\PCB98\library\advpcb.lib library to find the corresponding package for the part used.

These commonly used components are packaged, and it's best to take them back down, these components are encapsulated, You can split it into two parts to remember as resistance AXIAL0.3 can be disassembled into the axial and 0.3,axial translated into Chinese is the axis, 0.3 is the resistance on the printed circuit board of the distance between the pads is 300mil (because in the field of motor, is based on imperial units. Similarly, for the rad0.1-rad0.4 capacitance, the same is true for polar capacitors such as electrolytic capacitors, which are encapsulated as rb.2/.4,rb.3/.6, wherein ". 2" is the pad pitch, ". 4" is the outer diameter of the capacitor cylinder.

For transistors, that directly look at its shape and power, high-power transistor, with TO-3, the power of the transistor, if it is flat, with TO-220, if it is a metal shell, with TO-66, small power transistor, with to-5,to-46,to-92a, etc. can be, Anyway, it has long legs and can bend it.

For the commonly used integrated IC circuit, there is a dipxx, is the double row of the component package, DIP8 is double row, each row has 4 pins, two rows between the distance is 300mil, the distance between the pads is 100mil. Sipxx is a single-row package. Wait a minute.

It is worth noting that transistors and variable resistors, their packaging is the most headache, the same packaging, its pin is not necessarily the same. For example, for packaging such as to-92b, usually 1 feet is e (emitter), and 2 feet may be B-pole (base), or C (collector), the same, 3 feet may be C, also may be B, specifically that, only to get the components can be determined. Therefore, the circuit software is not hard to define the name of the pad (pin name), the same, FET, MOS tube can also be used in the same package as a transistor, it can be common to three pin components. Q1-b, in the PCB, loading this network table, you will not find the node (not on). Similar problems occur on the variable resistors, in the schematic, the pin of the variable resistance is 1, W, and 2, the resulting network table is 1, 2 and W, in the PCB board, the pad is three-way. When there are two components in the circuit, it is necessary to modify the difference between the PCB and sch the fastest way is to create a network table, directly in the network table, the transistor pin is changed to three-way, the change of the variable resistance to the same shape as the circuit board element can be.

Http://hi.baidu.com/79165913/blog/item/6ddaab6120844b4ceaf8f8a4.html

About the use of the packaging library in the PCB design, for these mainstream resistor encapsulation, the general library is there, including the RAD type, if you want to design your own packaging library, then you can follow the 1 mil=0.001 inch, 1 inch =2.54cm conversion relationship design, for the outer ring of the screen is not designed too loose, Otherwise, the actual use can easily overlap with other silk prints.

(reprint) PCB Package size