Summary of High-Speed board cabling with Layer 4 or above

(I would like to make a summary later)

Connecting lines between and above, try to let the lines pass through each point in sequence to facilitate testing. The line length should be as short as possible, for example (based on the previous type ):

2. Do not wire between pins, especially between and around the integrated circuit pins.
3. Do not parallel lines between different layers to avoid forming actual capacitors.
4. wiring should be a straight line or a 45-degree line to avoid electromagnetic radiation.
5. Ground Wires and power cables must be at least 10-15 mil (for Logical Circuits ).
6. Try to connect the paving line together to increase the grounding area. Line and line should be as neat as possible.
7. Ensure that components are uniformly discharged for installation, plug-ins, and welding. The text is discharged on the current character layer, with a reasonable position. Pay attention to orientation to avoid being blocked and facilitate production.
8. Considering the structure of the component emission, the positive and negative components of the patch should be encapsulated and marked at the end to avoid space conflicts.
9. Currently, the printed board can be used for 4-5 mil wiring, but it is usually used for 6 mil line width, 8 mil line distance, and 12/20 mil pad. Wiring should consider the impact of the inbound current.
10. Function Block components should be put together as much as possible, and the components near the LCD such as zebra stripes cannot * be too close.
11. Green oil should be painted through the hole (set to a negative double value ).
12. It is best not to place pad, overspace, etc. under the battery seat. The size of pad and devil is reasonable.
13. After wiring is complete, carefully check whether every connecting line (including netlable) is actually connected (available lighting method ).
14. The oscillator circuit components should be close to the IC as much as possible, and the oscillator circuit should be as far away from the easily disturbed areas such as antennas. Grounding pad should be placed under the crystal oscillator.
15. Consider multiple methods such as reinforcement and air-digging to avoid excessive radiation sources.
16. Design Process: A: design principle diagram; B: confirmation principle; C: Check whether the electrical connection is complete; D: Check whether all components are encapsulated and the size is correct; E: Place components; f: Check whether the position of the component is reasonable (A comparison can be printed); G: deploy the ground wire and power cord first; H: Check whether there is a flying line (other layers except the flying line layer can be turned off ); i: optimized wiring; J: re-checked wiring integrity; K: Compared with the network table to check for any omissions; L: rule verification, whether there are error labels that should not be correct; M: text instructions; n: add the symbolic text description of the board; O: comprehensive check.