The correct way to apply the heat sink to the CPU

Keen to overclocking, the transformation of the DIYer are all know the importance of heat dissipation, but seemingly simple coating the heat (silicone grease) method, but many players are most easily overlooked one.

Because the die part of the CPU surface is too small, coupled with some CPUs (such as AMD Athlon XP) surface also has the exposed capacitance, resistance and gold bridge, etc., with the thermal paste improper at any time may be due to short-circuit CPU burned, so the installation of Athlon XP is still the most difficult to DIY novice graduation exam In view of this, today I would like to discuss with you what kind of coating the heat treatment is the most appropriate method.

Heat sink or less to be in the "more", "less" two words in the hard election as a standard words, I advise you DIY novice better. Of course, the use of heat sinks too much or too little is not in fact appropriate, but the use of the heat sink is known, the general will squeeze too much heat, so the most basic use of heat-cream is to know how to control the squeeze when the strength of the paste.

　　Recommended standard for the extrusion of heat-dissipating cream

1. When extruding, the nozzle of the heat sink points to the die center of the CPU surface. Don't squeeze from left to right like a toothpaste, because when the heat sinks, the pressure will push the die on both sides of the heat, and the excess heat will be pushed closer to the capacitor.

2. The die portion of the Athlon series CPU is small, so just squeeze out about 1/4 of the die area of the heat sink.

3. P4 CPU Die protection cover area is larger, extrusion heat sink only about 1/9 of the die area of the weight. Some people think that the surface of the P4 should also be covered with heat, but this is not necessary. The P4 surface of the heat sink is squeezed into a diameter close to the metal Guebent of the circle is enough, too much is easy to pollute the CPU socket and motherboard.

4. If the cooling cream is slightly more than the proportion of the above, you can use paper to gently erase the excess heat.

5. If the amount of heat-dissipating paste is too much, it is best to clean the contaminated parts outside the die completely and try again. Because if you do not understand the conductivity of a brand heat sink, the fouling resistance, capacitance and the Gold Bridge's heat sink is enough to cause a short circuit to burn the CPU.