The pitch of the copper layer in DXP is modified without affecting the wiring of each layer.

The pitch of the copper layer in DXP is modified without affecting the wiring of each layer.
In the clearance of rule, create a new rules Clearance1 (name can be customized),
Then, in the Where, select Advanced (Query) in the "matches" box,
Click Query Builder, and then the Building Query from board dialog box appears,
In the first row of this dialog box, select Show all levels (default for this item).
Then select Object Kind is in the Drop-down menu below condition type/operator.
Then select Ploy in the Drop-down menu below the condition value on the right.
This will display the Ispolygon in the right query preview, click OK to confirm the save exit,
After that, in the full Query display box, change Ispolygon to Inpolygon (the bug in DXP has to be changed so that the 2004 version doesn't seem to change),
The last step, the following can be in the constraints inside to modify the spacing you need (according to your Seihan process level).
This will only affect the spacing of copper, do not affect the spacing of each layer wiring.