What is FBGA in memory

The FBGA is a surface array pin structure with solder balls at the bottom so that the mounting area required for encapsulation is close to the chip size.

BGA Development of FBGA packaging technology is gradually showing its new force, Kingston, Qin Mao Technology and other leading memory manufacturers have introduced the use of FBGA packaging technology memory products.

FBGA as a new generation of chip packaging technology, on the basis of BGA, TSOP, FBGA Performance has a revolutionary upgrade. FBGA package can make the chip area and the package area of more than 1:1.14, already quite close to 1:1 of the ideal situation, the absolute size is only 32 square millimeters, about the ordinary BGA 1/3, only the equivalent of TSOP memory chip area of 1/6. In this way, in the same volume, the memory can be loaded into more chips, thereby increasing the single capacity.

In other words, compared with the BGA package, the FBGA package in the same space can increase storage capacity by three times times, showing the comparison of three kinds of encapsulation technology memory chips, from which we can see clearly that the memory chip packaging technology is developing toward a smaller volume direction.

FBGA package memory not only small size, but also thinner, the metal substrate to the heat dissipation of the most effective heat path only 0.2mm, greatly improve the memory chip in the long run after the reliability of the line impedance significantly reduced, the chip speed has also been greatly improved. The electrical performance and reliability of the FBGA package are also greatly improved compared with BGA and TOSP.

Under the same chip area FBGA can reach more than TSOP, BGA pin number more (Tsop up to 304, BGA to 600 root, fbga in principle can produce 1000), so that it can support the number of i∕o ports increased a lot.

In addition, the central pin form of the FBGA encapsulated memory chip effectively shortens the transmission distance of the signal, its attenuation decreases, and the anti-interference and anti-noise performance of the chip can be greatly improved, which also makes the access time of FBGA 15%-20% better than that of BGA.

In the packaging of FBGA, memory particles are welded by a tin ball on the PCB board, due to solder joints and PCB board contact area is larger, so the memory chip in the operation of the heat generated can be easily transmitted to the PCB board and distributed out; and the traditional Tsop package method, Memory chip is through the chip pin welding on the PCB board, solder joints and PCB board contact area is small, making the chip to the PCB board heat transfer is relatively difficult.

FBGA package can radiate from the back, and the thermal efficiency is good, FBGA heat resistance is 35℃/w, and Tsop thermal resistance 40℃/w. Test results show that the use of FBGA encapsulated memory can be conductive to the PCB board of heat up to 88.4%, and TSOP memory conduction to the PCB board on the heat can be 71.3%. In addition, because of the compact structure of the FBGA chip, low redundancy, it also eliminates a lot of unnecessary power consumption, resulting in the chip electricity consumption and operating temperature relatively lower.

At present, the memory pellet factory in the manufacture of DDR333 and DDR400 memory are used 0.175 micron manufacturing process, good product rate is low. And if the manufacturing process is upgraded to 0.15 or even 0.13 microns, the yield will be greatly improved. and to achieve this level of technology, the adoption of FBGA packaging is inevitable. Therefore, the FBGA encapsulation of high-performance memory is the general trend.

FBGA is just a package of components to reduce the volume, while slightly increasing the speed. Your computer does not need to consider this problem at all, just install the appropriate driver. Memory requires only the root memory speed.