Hua Tian Science and Technology directed additional investment 834 million yuan

Huatian Technology (002185) bulletin, the company intends to non-public offering of shares not exceeding 75 million shares (including 75 million shares), the issue price is not less than 11.12 yuan/share, the total amount of fund-raising not more than 834 million yuan. Huatian technology will be thrown into the "copper wire bonding integrated circuit packaging process upgrade and industrialization project", "integrated circuit high-end packaging Test line technology reform project" and "Integrated circuit packaging testing production line technology upgrading project."　　If the raise funds can not meet the amount of the proposed project, the difference will be the company's own funds, bank loans and other means to complement. According to the company, copper wire bonding integrated circuit packaging process upgrade and industrialization project completed, will be built with the international advanced level of copper wire bonding integrated circuit packaging production line, the new copper wire bonding integrated circuit packaging products 500 million of production capacity. The project is implemented by the company, the total investment of the project is 201.6 million yuan, to be invested 201.6 million yuan to raise funds.　　The project is expected to increase sales revenue of 245.2 million yuan, net profit of 32.5 million yuan, the project internal yield is expected to be 25.68%. Integrated circuit high-end packaging Test line technical renovation project completed, the annual new CP test 360,000 pieces, the annual new BGA, LGA, QFN, DFN, Tssop and other integrated circuit high-end packaging test products 500 million production capacity. The total investment of the project is 298.4 million yuan, which is to be invested 298.4 million yuan. This project raises funds to invest in XI ' an day wins.　　The project is expected to increase sales revenue of 401.29 million yuan, net profit of 51.93 million yuan, the project internal yield is expected to be 25.1%. The total investment of integrated circuit packaging test production line technology upgrading project is 414 million yuan. After the completion of the project, the annual new ELQFP, QFP, LQFP series of integrated circuit packaging products 900 million production capacity. The total investment of the project is 414 million yuan, the proposed investment is 299 million yuan and the remainder is solved by the company. The project is expected to increase sales revenue of 457.2 million yuan, net profit of 54.63 million yuan, the project internal yield is expected to be 16.39%.