IBM and ARM are working on a small power soi chip

November 15 News, according to foreign media reports, IBM, ARM, the same batch of semiconductor manufacturers are carrying out a small power SOI chipset research project, is intended to be made of the use of body silicon CMOS design conversion to fulfill the depletion-type Fd-soi assembly.

With the ultra thin oxide layer covering, the device using this kind of chip will provide better performance and lower energy consumption. The formula for this collaborative study is arm, French semiconductor manufacturer Leti, the University of Leuven in Belgium (the Universitécatholique de Louvain), IBM, GlobalFoundries, and French Soitec.

Horacio Mendez, executive director of the SOI Industry Association, said: "This work shows that the manufacturing technology of the PCB is made from the body silicon steering FD-SDI can be directly carried out, depending only on the FD-SDI technology used by a particular chip manufacturer." This design can shorten the time-to-market based on Fd-soi devices and will lead to more optimized ICS and faster real-time speeds. ”

In the research of BULK-TO-FD-SOI network chip design, it will make the smallest adjustment in the existing plane design, especially the feasible standard cell library, memory compiler and input and output operating system to obtain the analog and mixed signal design.

Fd-soi A design feature is its potential performance, in the running of the full IP core or the whole group of chips when the supply of voltage can be very low, probably between the 0.5-0.6v.

Currently, the team is testing two lines of the entire chip design interface.

(Responsible editor: The good of the Legacy)