Intel IDF2013: Mobile Computing works together to build a new era of data society

At today's 2013 Intel Information Technology Summit in Beijing, Fedauming, the global vice-president and general manager of the System software division of Intel, and Justin Rattner, Intel's chief technology officer, addressed a keynote address on how Intel drives computing modernization Bring an extraordinary new experience to the user. The following is a summary of these keynote speeches and the disclosure of information in them.

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Doug Fisher, the global vice-president of Intel Corporation and general manager of System Software division, Fedauming the first keynote speech on the second day of the IDF, explaining the secrets of promoting industry development and revealing huge opportunities for innovation for developers. Specifically, he will demonstrate Intel's efforts to reinvent the PC experience and drive innovation in other computing devices, introducing how Intel supports a variety of operating environments, helping developers to upgrade and extend computing innovations with new software and hardware features, resulting in a more compelling user experience. He will also discuss how developers can use touch and sensor interfaces to upgrade applications and use perceptual computing to enable consumers to interact with PCs through voice control, gesture recognition, and so on.

Intel ®HTML5 Development Environment: Intel firmly supports and actively invests in HTML5 to ensure that the development platform continues to evolve and remains open to innovation while helping application developers reduce overall costs and accelerate Time-to-market for cross-platform application development and deployment. HTML5, which is based on network standards and supported by the consortium, allows software developers to deploy software to multiple platforms at a time, with the potential to impact billions of of devices and users-which is often difficult to implement in their respective operating system environments.

Fedauming describes the intel® ®HTML5 development environment (INTEL®HTML5 Development Environnement), designed to allow all developers to exploit HTML5. This solution delivers an end-to-end, end-to-end, integrated, cross-platform development environment that supports application development, testing, and deployment in a variety of operating systems environments, including ios*, android*, Windows * 8, and Windows Phone 8. intel® HTML5 Development environment helps developers deploy applications through a variety of app stores, including amazon* App Store, apple* App Store, facebook*, Google Chrome Web store, google* play Store and Windows * Phone store. Developers can obtain a free Intel HTML5 development environment in the HTML5 area on Intel®developer zone without a license.

China UnionPay announced cooperation with Intel (China) in developing mobile payments: using near-field communications (NFC), mobile payments and intel® identity protection technology, Intel joins bank card to organize China UnionPay to make mobile payments more convenient and secure. During Fedauming's keynote speech, Mr. Chaihong, executive vice president of China UnionPay, introduced the UnionPay service. With this service, consumers can use NFC smart phones based on Intel processors to buy goods from a growing number of department stores or vending machines.

As Intel continues to promote innovative user usage patterns such as NFC mobile payments to enhance the user experience, China UnionPay is constantly refining its innovative products and services, including mobile payments, to meet customer demand for convenient, secure, and efficient payment services through integration with emerging information technologies. The strategic cooperation of two companies focuses on three areas: Intelligent payment solutions for Cross-platform platforms, End-to-end Security solutions, cloud computing, and large data solutions.

Chaihong, executive vice president of China UnionPay, said: "UnionPay is vigorously promoting the universal application of the Financial IC card, the current financial IC card issued more than 130 million, the national POS and ATM terminals are basically completed acceptance of the transformation, of which, more than 1.2 million terminals have been supporting the ' flash-pay ' function." UnionPay is also speeding up the mobile payments business, especially to lead and promote the development of NFC mobile payment, and the industry chain of mutual benefit, and jointly promote the progress of the mobile payment industry. ”

The future of Architecture computing

Justin Rattner, Intel's chief technology officer, introduced the Intel Institute to achieve a better future through technological innovation in a keynote speech. Justin unveils the vision of a sustainable, interconnected city that interprets how information technology can provide people with clean air and water, as well as better health and safety. He explains how today's urban mobile lifestyle requires faster, cheaper wireless broadband communications. Looking into the post-Information age, Justin paints a new era of "Data society," where cloud data will work for everyone, analyzing and working in a collaborative and secure way, to bring new value to individuals, businesses and society as a whole.

Silicon photons: Today, Justin first publicly demonstrated a fully functioning silicon photovoltaic module with intel® Silicon Photon technology, running at 100GB (Gbps) per second. This fully integrated module includes Silicon modulators, detectors, waveguide and circuits. Intel believes this is the only module in the world that uses a hybrid silicon laser. The presentation was made by Justin Timberlake in the Beijing IDF2013 keynote speech.

In addition to the Intel Silicon Photonic Technology module, Justin also showcases Intel's new photovoltaic cables and connectors developed jointly with Corning. The new connector has fewer moving parts, is more resistant to dust and costs less than other photonic connectors. Intel and Corning want to make this new cable and connector an industry standard. Justin says the connector can transmit 1.6TB of information per second.

(Responsible editor: Fumingli)