Semiconductor packaging Status Promotion

Compared with IC design and manufacturing, China's semiconductor packaging industry is closest to the international advanced level, the extensive application of advanced packaging technology will change the competition pattern of semiconductor industry, China's semiconductor packaging industry in the "climate, geography, people and" favorable environment in the international competition is expected to achieve "corner overtaking."

Semiconductor packaging Status Promotion

With the continuous miniaturization of Moore's Law and the 12-inch substitution of the 8-inch wafer as the mainstream of the process, unit chip manufacturing costs appear to be falling fast. But for the chip package, as the chip complexity of the increase, packaging raw materials, especially the price of gold and packaging from the lower-order to the gradual transition, chip packaging costs in 2007 has accounted for more than half of the total cost of integrated circuit devices.

Integrated circuit packaging from the last century 80 's dip, such as a single chip package, to the 90 's MCM, such as multi-chip packaging, and then to the 2000 since the MCP, SIP and other three-dimensional packaging, its packaging complexity has been maximized, correspondingly, the chip interconnection of mechanical properties, Electrical performance and thermal performance are very high requirements.

Advanced packaging technology includes chip stacking Stackeddie, encapsulation pip, encapsulation pop, fan out wafer-level package FO-WLP and silicon through-hole TSV technology in the smart phone integrated circuit components of the solution application. Apple's A5 processor, for example, is actually a pop package that is superimposed on the AP package and the memory package.

The application of advanced packaging technology makes the IC design department and the packaging department work together to optimize the performance of the final integrated circuit design. So it can be said that the advanced packaging technology of integrated circuit has become the final device in the design of the important consideration.

Policy promotes industry to become bigger and stronger

February 9, 2011 announced the new 18th text to increase the integrated circuit industry chain support. The original 18th text only for integrated circuit manufacturers and integrated circuit design enterprises to make various preferential policies, and in the new notice, the preferential policies to benefit the whole integrated circuit industry chain, in addition to the integrated circuit manufacturing, design enterprise policy, the notice clearly put forward, to meet the conditions of integrated circuit packaging, testing, Special-purpose materials enterprises and integrated circuit equipment related enterprises to give enterprise income tax concessions.

In addition, the integrated circuit industry "Twelve-Five" planning also put forward a clear target for industrial development. First, our country seals the structure goal of the enterprise level is: to cultivate 2-3 sales income more than 7 billion yuan backbone seal the test enterprise, enters the global Seal survey industry first 10 places, forms a batch of innovative vigor strong small and medium-sized enterprises. Second, the technical requirements of the packaging testing industry include: into the international mainstream field, further improve the technology of flip Chip (FC), BGA, Chip-level package (CSP), Multi-chips encapsulation (MCP) and so on, strengthen the development of new encapsulation and test technology such as SIP, high-density three-dimensional (3D) package, realize the scale production capacity. Third, the special equipment, the objectives of the instruments and materials are: to support etching machines, ion implantation machines, epitaxial furnace equipment, flat equipment, automatic packaging systems and other equipment development and application, forming complete sets of technology, strengthen the 12-inch silicon, SOI, lead frame, photoresist and other key materials research and development and industrialization, Support domestic integrated circuit key equipment and instruments, raw materials in the production line scale application.

Overall, China's three major packaging factory director of electrical technology, Qualcomm-rich micro-electricity and technology, as well as the representative of Shanghai Sun-yang packaging equipment and raw materials to provide manufacturers, will continue to be in the national integrated circuit "Twelve-Five" planning under the support of bigger and stronger.

Status improvement in international competition

On the scale of revenue, with the expansion of the scale of China's domestic capital Seal survey in recent years, its ranking is also constantly moving up in the mainland area seal survey industry. Long Electric Technology 2010 to 545 million U.S. dollars of revenue ranked Nineth in the Global Seal survey, declaring the Chinese mainland seal test enterprises have been firmly in the world's top ten.

Technical strength, the domestic three major packaging plants in the semiconductor advanced packaging areas such as FCBGA, MCP, SIP, PoP, TSV and other products have made significant progress and achieve mass production sales, with the world's first big factory day Moonlight Semiconductor technology gap narrowing.

Semiconductor packaging materials with high technical barriers, customer certification is difficult and so on, has been in developed countries as the main provider of companies. In recent years, China's domestic materials suppliers with long electric technology and other internal-capital packaging plant growth, its quality has gradually been recognized by the international major customers, in the country "02" special support, the strength and breadth of its import substitution will be further increased. This also helps to improve the competitiveness of the domestic packaging plant as an application manufacturer.

At present, the development and popularization of advanced semiconductor packaging manufacturing equipment in China has greatly changed the current situation of the semiconductor seal surveying industry relies heavily on foreign-funded manufacturers to provide equipment. Effectively reduce the manufacturing costs, significantly improve the competitiveness of China's semiconductor industry, gave China's semiconductor seal survey industry in the Advanced packaging process area "overtaking "Historical opportunity provides the necessary conditions.