SK Heidelberg Development Ultra-high speed memory power consumption minus 40%

South Korea's semiconductor giant SK Heidelberg 26, announced that the company has developed high-speed memory (HBM). This ultra-high-speed memory data processing speed is currently the highest performance of the processor speed of 4 times times, but the power consumption is reduced by 40%. This ultra-high-speed memory uses silicon through-hole technology (Tsv,through-silicon-via). This is the latest technology to interconnect the chips by making a vertical conduction between the chip and the chip, the crystal Circle and the wafer. is 4 times times faster than the fastest dram (GDDR5) in the world today. SK-Rexroth said it would first use the ultra-high-speed memory for graphics-processing semiconductors, after which the company plans to massively produce this ultra-high-speed memory for supercomputers, networks, servers and other products. Samsung, on the other hand, announced its results in the third quarter of this year in October, announcing its access to silicon through-hole technology. Analysts expect Samsung Electronics to soon launch its own hyper-high-speed storage.