Terry announces and Mosis company to help customers develop complete high-performance ASIC solutions

The Tektronix Component FX has recently announced that it has agreed with Mosis to help customers develop complete high-performance ASIC solutions while reducing early ASIC development costs. By adopting a multi-project wafer production (wafer run) scheme early in the design cycle for prototype design and encapsulation development, customers can effectively speed up the implementation of the first packaged ASIC.

"The use of supply chain integrators like Mosis is a proven high-performance ASIC development approach," said Tom Buzak, president of the firm's corporate solutions. We see our relationship with Mosis as a partnership to provide a complete, economical ASIC solution to customers who need a low number of high-performance devices. ”

By leveraging the Mosis and Terry Component Solutions team, customers can reduce the cost of initial ASIC prototyping by developing their own complete template sets prior to finalizing the first silicon component design. In addition, the company also provides front-end high-performance ASIC design, and back-end package IC Package services to achieve a complete ASIC solution. By partnering with the Gram component solutions company early in the ASIC development process, customers are able to take into account encapsulation, external interconnection, and performance while designing the ASIC, thus speeding up the implementation of the first packaged device.

This partnership is significant for contractors in the aerospace and defense industries, medical OEMs, high-speed communications developers and other organizations that require the most high-performance ASIC, as the company and Mosis have extensive experience in using a variety of high-performance semiconductor technologies. In particular, two companies have technical expertise in the development of high-speed ASIC based on SiGe (SiGe) technology. For aerospace and defense customers, the partnership provides a reliable supply chain, as both the firm and Mosis are recognized as "trusted suppliers" that provide ASIC development and microelectronic encapsulation services in a secure environment.

"As the company's in-house ASIC design and encapsulation development team, the company has a strong ability to develop high-performance microelectronic devices," said Mosis director Wes Hansford. We look forward to working with the Gram component solutions to deliver custom ASIC solutions to meet the high performance requirements of our customers ' next generation systems. ”