Three speculations about Intel's increase in Rong

March 26, Chengdu Chip packaging testing plant 480 million chips off the line, and the formal production of the most advanced 2010 new Core Mobile processors, means that the Intel Chengdu Plant Two expansion near the final.　　In this context, with senior Vice President Blaine Kozinnik led by the Intel high-rise, and in the Intel Chengdu Packaging Testing Plant, welcomed the provincial and foreign more than 60 news media nearly hundred reporters group interviews.　　What does it mean for an Intel to continue to raise capital in Chengdu? March 25, a number of domestic media have reproduced such a report, Dalian deputy Mayor Dai Yulin in an interview with the Intel Dalian Chip factory revealed that the original investment is 6 billion U.S. dollars, not the announced 2.5 billion U.S. dollars.　　In addition to will include the second wafer production line, but also to build 3-4 of packaging testing plant and the formation of industrial chain matching. After understanding the main content of the reporter's questions through translation, Blaine Kozinnik responded firmly: "Such a report is inconsistent with the facts, the amount of cooperation with Dalian has been announced before the 2.5 billion U.S. dollars." "Intel Global Packaging Test general manager Robin Martin, after the expansion of the Chengdu plant, the current Intel in the global production of packaging and testing factory total of 3, distributed in the United States, Israel and Chengdu, China, its capacity is sufficient to support the demand for chip packaging output."　　Chengdu is fully capable of satisfying the demand for a new increase in packaging testing within a year or two. "Chengdu Plant has become the most important Intel packaging testing and wafer pretreatment base."　　"Blaine Kozinnik made it clear. For the different layout of Intel in Chengdu and Dalian, Tang Jichang, director of the Development Planning Bureau of Chengdu Hi-tech zone, said that "we are not as good as Dalian in terms of investment, but it does not mean that the overall pattern of benefits to the opponent." At the same time, Intel's continued expansion in Chengdu has unleashed a unique advantage for us.　　"Guess when the second mainstream chip production line can be settled in Chengdu?"　　In Chengdu Chip packaging testing plant 480 million chips off the line and 2010 new Core mobile processor production ceremony, there is a detail caused by the numerous media reporters in the endless reverie.　　Robin Martin, who served as the first general manager of the Intel Chengdu plant, "deliberately" chose its wafer products worth more than 8,000 yuan when he presented gifts to the leading guests of the Chengdu City, who represented Intel.　　Whether or not Intel will be able to package and test the factory in Chengdu, but also to make its representative technology core chip manufacturing line married Chengdu. "Will Intel expand on the production chain of the Chengdu plant in the future?" "," Intel is developing the 450mm wafer production in the future will be located in Chengdu? "There are similar problems at the press conference. Blaine Kozinnik did not have a positive answer, but his remark aroused great concern: "450mm wafer production is expected to be achieved in 2015, it will be a landmark product." To be sure, we will certainly put itProduction and processing in Chengdu.　　"Whether the wafer production or packaging test, it seems something."　　Reports from Chengdu City show that at present, Chengdu High-tech zone is trying to speed up a 12-inch chip production line to settle, investors are not clear, but no matter who, Intel continued to "add" Chengdu, is to attract the highest status of the 12-inch chip production line "aim at" the Catalyst Chengdu.　　Wonder if Intel can fan the "Butterfly Effect" again? Intel's cooperation with Chengdu has entered its 7th year. August 2003, Intel announced the investment in the construction of the Intel Chengdu Chip Packaging Testing plant, a period of investment of 375 million U.S. dollars, and started construction in 2004. March 2005, Intel announced the increase in capital Construction Plant Phase II project, total investment amounted to 525 million U.S. dollars.　　In 2009, Intel invested a third additional 75 million dollars in the Chengdu plant, making Intel's total investment in Chengdu at $600 million.　　In the past 30 years, Intel has been the largest foreign investment and industrial transfer project in Chengdu, and its entry has allowed Chengdu to rapidly accumulate a large number of well-known enterprises in the chip industry in just two years. After Intel, the global power semiconductor chip packaging testing Service industry leader-psi in Chengdu to establish a semiconductor chip test packaging plant.　　Followed by SMIC's integrated circuit testing Package plant project, the Malaysian Friends of the company's semiconductor test packaging factory, the United States core-source systems company's Chengdu Chip base ... "7 years, the continuous increase of Intel Chengdu, Chengdu plant in the High-tech area of the development of integrated circuit industry has brought industrial agglomeration effect." Shenggang, general manager of Intel Products (Chengdu) Co., Ltd.　　Tang Jichang Introduction, with Intel as the vane, the region is still gathered nearly hundreds of IC design enterprises, two 8-inch chip production lines, 5 packaging testing enterprises and more than 10 related supporting enterprises in the Midwest leading position.　　Today, whether it is the fact that Chengdu has become the most important base for Intel's global packaging test and wafer preprocessing, and the announcement by Intel's top executives that it will continue to work with Chengdu, it is a sign that Intel's "Butterfly Effect" on Chengdu will continue. Sichuan Daily reporter Zeng Shi Liu