Ying Tai vigorously promote FI application gift value 129 Yuan High-fidelity fi headphones

It is clear that today APU has become the core of AMD's products, its thunder has even overshadowed the flagship Bulldozer FX, the "Piling Machine (piledriver)" architecture will be the first to apply to the second generation APU products. At present, using good CPU performance and quite excellent GPU performance, AMD second-generation APU will become the absolute market force. With the second generation of Apu matching Ying Tai fi a85w motherboard has also become a market-selling products, relying on its solid workmanship and unique fi performance, the market at one point sold off the situation. Now a new batch of Ying-tai Fi a85w arrival Market, the price is still 699 yuan, Ying Tai to promote the promotion of FI applications, with the new gift value of 129 yuan Ideq high-fidelity fi headphones, please buy the latest Ying-tai fi a85w motherboard friends attention.

The FI a85w motherboard is based on the ATX form-factor design, designed for the AMD A85 chipset, and integrates a new generation of http://www.aliyun.com/zixun/aggregation/29900.html for the latest AMD FM2 platform. >radeon HD7000 series of display core, performance compared to the more outstanding, as one of the fi series of fi a85w motherboard, is to make more a meal not only can enjoy more beautiful video can easily enjoy the fi level of quality.

Ying Tai fi a85w Motherboard power supply is equipped with a solid 6-phase power supply, are using high-quality solid-state capacitors and fully enclosed inductance, MOSFET covered by an independent heatsink, for the CPU to provide a pure current, to ensure that the power supply part of long-term stable operation.

The FI a85w motherboard provides 4 DIMM slots, supports dual-channel DDR3 memory, and supports dual-channel ddr3-2400/2133/1866. Memory/chipset power supply all with low ESR high quality solid state capacitance, fully enclosed inductance and high current impedance Mosfet, the top materials to ensure the efficiency of the module power supply, and obtain the highest energy conversion efficiency and the lowest conversion heat loss.