piezoelectric wafer

Intel Core i7-7700k Contrast i7-6700k which is better? Intel Kabylake and 200 series simply say As mentioned above, the 200 series chip group from B250, H270 to Z270, its wafer PCIe channel number increased, providing more bandwidth increase use, so you can see at least one PCIe X4 storage device, and the other memory frequency from 2400MHz, performance will be improved, Another high-profile Intel Optane memory needs to use the H270 and Z270 motherb

based on a single semiconductor, but it's hard to explain essentially why a dual-core is born, and if you want to pursue the origins of the two cores, you have to start with some basic knowledge of physics and electronics: Unable to overcome power and calorific value Now the chips are made on a single crystal wafer, large area of the wafer itself will inevitably exist some defects, the process of productio

Russia Fizoptika Norwegian Sensonor Corp. Japan Silicon BEI Murata, USA EPSON United States CROSSBOWKVH Some universities and research institutes in China are also developing and producing some gyroscopes. From the data, the main manufacturers of these high-tech components are still foreign high-tech companies, and mainly used in high-tech industries, a mobile phone equipped with a high-tech equipment for space flight, which is impossible anyway. So due to the cost of production and so on, t

the viscous liquid will flow smoothly. Unfortunately, the specific formula and principles of this coating have not yet been made public. 2. As a high-end it person, if you do not carry two or three mobile phones or tablets, you are embarrassed to say hello to others. However, "high-end atmosphere" also needs to pay the price-charger and data lines of various specifications are too troublesome! God said, "Get rid of these troubles", so there is ubeam. A 22-year-old American girl named

the active drive after the power failure (slow for n seconds), and then he can no longer get the money to find Uncle Js. (If you smell the smell, immediately cut off the power supply, and then open the chassis to find the reason, but do not open the display, can only be handed over to professional repair, it is highly piezoelectric, never joke with your own life.Transferred from skynetWhen using computers, friends may encounter many unexpected faults

by more than 2000 compared with that in 70%. V. CSP chip size Encapsulation With the global demand for personalized and lightweight electronic products, packaging technology has improved to CSP (chip size package ). It reduces the size of the chip encapsulation shape, so that the size of the bare chip is as large as that of the package. That is, the side length of the encapsulated IC is no more than 1.2 times that of the chip, and the IC area is no more than 1.4 times larger than that of th

U disk storage of the core components are known as "Flash flash" chip, its cost determines the finished product U disk price high and low, the market, a variety of brands of u disk products show Different price grades, largely because of the use of "flash flash" chip differences. Flash memory chip is divided into authentic flash, black flash, etc. Authentic Flash refers to the formal brand flash, generally for Korea, Japan factory brand, such as "Samsung", "Hyundai", "Hitachi", etc. used as a

I. Introduction of industrial camera typeThe CCD was invented by Bell Laboratories in the late 60. Started as a new kind of PC storage circuit, soon CCD has many other potential applications, including signal and image (silicon photosensitivity) processing.CCD is a thin silicon wafer processing a series of different functions, on each silicon wafer on the distribution of several identical IC, such as the pr

New Optical Switch Technology Now we have an optical switch based on thermal, liquid crystal, acoustics, and Micro-electromechanical MEM: Micro-o-Mechanical. The thermo-Optical Switch uses an aggregation waveguide with heat regulating. The swap is controlled by thin film heating elements published in the polymer stack. When the current passes through the heater, it changes the heat distribution in the waveguide branch area, thus changing the refractive index, so that the optical coupling can be

-called "black film", there are basically two kinds, one refers to Samsung, Toshiba, Hyundai and other manufacturers to eliminate the defective products, the second refers to the market recycling of second-hand flash chips. As the chip manufacturers in the production of flash chips, the wafer production is graded, can be divided into 99% capacity, 97% capacity, 93% capacity and so on. Grades below 93% capacity below the

life, can achieve 100,000 times to erase, is MLC more than 20 times times. MLC can be erased 3000-5000 times. And TLC is much worse, generally can only write to 500-1000 times, as for performance, price, poor also a lot. TLC flash memory for a large number of cheap u disk products, SLC solid-state hard disk is rarely seen, this is the price reason: too expensive. Note that as the flash process progresses, the number of times to erase is declining. Why? Storage density increased, the "storage p

Memory frequency is the same as CPU frequency, is used to represent the speed of memory, it represents the maximum operating frequency that memory can achieve. The memory frequency is measured in MHz (MHz). The higher the memory frequency is to a certain extent, the faster the memory can reach. The frequency of memory determines how often the memory can work correctly. The current market is more mainstream 667MHz and 800MHz of DDR memory. Brief introduction As you know, the clock speed of comp

this stage mainly in NM (NM) as a unit. The manufacturing process of the display chip is the same as that of the CPU, and it is measured by micrometer. The improvement of manufacturing process means that the display chip will be smaller, more integrated and can accommodate more transistors. Like the central processing Unit, the core chip of the display card is also made on a silicon wafer. The development and progress of microelectronic technology m

　　memory frequency is the same as CPU frequency, is used to represent the speed of memory, it represents the maximum operating frequency that memory can achieve. The memory frequency is measured in MHz (MHz). the higher the memory frequency is to a certain extent, the faster the memory can reach. The frequency of memory determines how often the memory can work correctly. Currently the more mainstream memory frequency rooms are 333MHz and 400MHz of DDR memory, as well as 533MHz and 667MHz of DDR2

IButton is a computer chip encapsulated in a 16mm thick stainless steel housing. Because of its unique robust housing, the latest information can be carried anywhere with the person or the target object. In fact, the steel iButton housing is solid enough to withstand various harsh indoor or outdoor environments, making it almost accessible to install anywhere. IButton is very small and lightweight and can be attached to key chains, ring rings, watches, or other personal items, it is ideal for co

Enhanced Depletion type N-Channel P-Channel N-Channel P-Channel 3. Structure and graphics Of The FET (taking the nd-channel enhanced insulation gate FET as an example) Note: ① It is a low impurity concentrationP-type Silicon WaferAs a substrate, twoN-zone, which is very close to each other and has a high doping concentration,Two electrodes, called the source Pole s and the drain electrode D, are extracted respectively. A thin insulation

Ball Grid Array, micro ball network array) Nm) MCA (machine check Architecture) MCU (micro-controller unit) MCT (memory controller, memory controller) MESI (modified, exclusive, shared, invalid: Modify, exclude, share, discard) Mf (microops fusion, micro-command merge) Mm (micron metric, micron) MMX (multimedia extensions, multimedia Extended Instruction Set) MMU (Multimedia Unit, Multimedia Unit) MMU (Memory Management Unit) Mn (model numbers, model number) Mflops (million floationg point/seco