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RFID (Radio Frequency identification): A Tutorial

note that this data is still encoded.The reader decodes the data using suitable decoder, and forwards it for further processing to a computer (or any backend s erver).Applications of RFID: Employee Identification and Access Control Airline Baggage identification Wafer identification during manufacturing process Livestock identification Parts identification Identification and Tracking of vehicles Identification of widg

DDR3 basic knowledge and test "turn"

(CAS), where the data is saved in the matrix. Trp:ras The pre-charge time, which is the time between disabling data row access and starting another row of data access. Tras: Activates the pre-charge delay, which is the time that the memory must wait before starting the next memory access. cmd: The command rate is the time between the storage chip activation and the first command sent to the memory. Sometimes, this value is not advertised. It is usually T1 (a clock speed) or T2 (2 clock sp

EMMC Chip Applications

per second with fast, upgradeable performance. At the same time, the interface voltage can be 1.8v or 3.3v.EMMC (Embedded Multi Media Card) uses a unified MMC standard interface to encapsulate high-density NAND flash and MMC Controlle in a BGA chip. For the characteristics of Flash, the product has included flash management technology, including error detection and correction, flash average erase, bad block management, power-down protection and other technologies. The user does not have to worr

Parsing what is 3D touch, what is In-cell

also transparent when the thickness is very thin, can let the visible light penetrate, so a large number of applications in various optoelectronic components.In addition, the semiconductor process technology must be used above the post-conductive glass to grow "switch element", the simplest switching element is "MOS", but MoS has a metal, oxide, semiconductor structure, must grow on the silicon wafer, to grow on the conductive glass on the switch ele

Mifare Series 3-card energy and data transfer

layer prevents the wafer from being folded, twisted, and many other abnormal physical damage to the card. It also prevents the microchip from being exposed to ultraviolet radiation, allowing the card to be used for a long time. However, from the point of view of electrical performance, due to the addition of a protective layer, the IC and the antenna on the card is composed of the frequency of the oscillation circuit will be changed. Because the prot

The difference between TVs diodes and Zener diodes

polar tube work?Does the TVs tube have positive and negative polarity?The characteristic parameters of TVs tubes, the selection criteria of TVs tubes, and the effect of TVs transient suppression of two-polar tubes.With this issue of protection, little masters for all of the engineers and acquisitions that focus on TVs transient suppression of the two-polar tubes. The protection of the TVs tube.The first thing to know is the TVs transient suppression diodes, the instantaneous suppression of the

Pin and pad differences in Altera FPGA chips

In Chip Planner, when you watch your feet, you'll see the pin and pad appear at the same time,such as pin120/pad174 Bank 4So what's the difference?Pin refers to the chip is packaged in the pin, that is, the user sees the pin;Pad is the pin of the wafer, is encapsulated in the inside of the chip, the user can not see.There is also a wire connection between the pad and the pin.Pad also refers to the input and output buffer/register unit.Further in the R

Single-chip computer learning Note 1

First, the concept of single-chip microcomputer, application.Microcontroller is also called MCU (microcontroller).is aIC Chip, is the use ofLarge scale integrated circuittechnology that has the ability to process dataCpuCPU,Random memoryRAM,Read-only memory rom, multiple I/O ports, andInterrupt System,Timer/Counter and other functions (may also include a display driver circuit,Pulse width modulationcircuit, analog multi-channelConverters,A/D convertersintegrated into a single

"Code" Reading notes: Building computer systems from scratch

possible capacity of memory, which should be used to store program code and program execution of the data generated, these instructions in memory is stored sequentially, and can be addressed by the program counter, but allow conditions to jump. This is the stored program concept (Stored-program concept).11 development of the computerChip: A silicon wafer containing integrated circuits that is small in size and often part of a computer or other electr

Protocol stack implant chip is imperative, IPSec is a mistake

This article is a bit extreme, but it may also cater to the meaning of certain individuals or organizations. This article is short, I will continue to write this topic later. The heart is too painful, the person is too bad.1. protocol stack implant chipIf you think that the stack of chips is consuming material and cost, then you are wrong. The Tcp/ip/ethernet protocol stack has now become a de facto standard, and many teenagers have not changed. Cured things in view of the circuit design, open m

The difference between Flash and EEPROM

FALSH structure or EEPROM structure, even with "flexible" technical means in the program store Simulation "data store", but even so, the concept is still different, this is the basic common sense problem. EEPROM: Electric erasable Programmable read-only memory, flash operation characteristics fully conform to the definition of EEPROM, is an EEPROM is undoubtedly, the first flash launched its data manual is also clearly marked as EEPROM, and now most flash manuals are so marked, The relationship

Layer-4 Switch Technology and Application

a software-based router in the late 1990s s to an ASIC-based layer-4 switch that is being promoted today is a good proof. In addition, when the network technology is integrated into a silicon wafer, the performance will be significantly improved, and the corresponding total cost of ownership will be greatly reduced. The result of the application of hardware silicon technology is that service providers and enterprise users can, without sacrificing the

Introduction to basic concepts of NAND FLash and basic concepts of nandflash

encapsulated chip is a chip 3. die is a small square on a wafer. Several die may be encapsulated in a chip. Due to different flash technologies and different technologies, the concept of die is generated. Mono Die is a common concept, a Die, B die, etc. a chip contains N die 4. plane is the smallest unit for NAND to operate based on commands such as read, write, and erase. A plane is a storage matrix that contains several blocks.5. Block is the mini

Introduction to android Bluetooth Low-energy (LBE) Technology

technology uses a modulation index of 0.5, while the Standard bluetooth technology is 0.35. 0.5 of the exponent is close to the Gaussian minimum frequency shift keying (GMSK) solution, which can reduce the power consumption requirements of wireless devices (this reason is complicated and will not be repeated here ). The lower modulation index has two benefits: improved coverage and enhanced robustness. The standard bluetooth technology uses a long packet length. When these long data packets are

Filtering and MIP map Introduction

eight texels are included. Therefore, regular bilinear filtering will be used to select lower-resolution linear regression. Therefore, it will calculate the average of the texels in the margin boxes close to the gray boxes, so it will produce a blurred image. To avoid the blurred image, the simplest method is to take the eight texels it contains for average. Of course, this requires a larger computing volume than bilinear filtering. Because this practice is usually required only when the growth

Network operation--set BIOS password to ensure computer system security

, including the CPU, memory, read-only memory, system board, CMOS memory, parallel and serial communication subsystem, Floppy disk and hard disk subsystem and keyboard for testing. After the self test is completed, the system will look for the operating system in the specified drive and mount the operating system to the memory. So where does this BIOS program reside in the computer? The home of BIOS is CMOS memory, CMOS is complementary metal-oxide semiconductor initials, Chinese is comple

Why does Samsung want to sell chips? Mobile but Huawei Xiaomi, semiconductor good money!

Samsung intends to sell its Exynos chips to other handset makers to expand market share, foreign media digitimes reported. Samsung's sale of its own chips aims to increase the utilization of silicon wafer factories and increase their share of the global handset processor market, especially in the mid-market, according to people familiar with the situation.Why does Samsung want to sell chips? Mobile but Huawei Xiaomi, semiconductor good money!The news

Linux operating System (i)

uid=0, gid=0 can change it to an admin user?) )/etc/shadow the next 9 fields represent the meaning of the respective: http://www.cnblogs.com/zhousir1991/archive/2011/07/25/2116520.html/etc/group/dev/Device root directoryHDD (normal disk, media media is magnetic powder, according to North and South Pole to record), SSD (solid-state disk, media media is silicon wafer, because of the elimination of seek time, it is more efficient than HDD)6. File System

JS pseudo 3D Graphic Perspective effect

This article address: http://blog.csdn.net/ei__nino/article/details/9243331 The original is to achieve the perspective of multiple slices, for the operation are tested. is not a rigorous mathematical calculation. Using a simple div layout, some forms of CSS settings There is the stage depth stagedeep, the wafer depth distance is zdistance, and the correction angle P can be set to adjust the overall display effect of the image.The graph moves with the

CPU parameter setup Error causes failure

In CMOS, if the CPU voltage or frequency set incorrectly, will cause the CPU voltage is low or too high, affecting the stability of the CPU work and service life. CPU overclocking is very easy to computer failure, because in the CPU after overclocking, the logical components of the silicon wafer frequency increased, in all aspects of the parameters will change, especially in the increase in heat caused temperature is far higher than the normal

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