Dual Interface Card

The dual-interface card is composed of PVC layer and chip coils,Based onSingle Chip, SetContact TypeAndNon-Contact InterfaceIntegrated Smart CardIt has two operation interfaces,Chip access can be achieved through contact orAccess the chip in RF mode by distance. There is only one chip on the card, and two interfaces can perform the same operation through both the contact interface and the non-contact interface. The two interfaces comply with two different standards, the Contact Interfaces comply with ISO/IEC 7816, and the Non-Contact Interfaces comply with ISO/IEC 14443.

Dual-interface card/CPU card (timecos/di) is a single-chip-based smart card that integrates contact and Non-Contact Interfaces.These two interfaces share the same microprocessor, operating system, and EEPROM. Card includes a microprocessorChip andAntenna CoilBy the readerThe generated electromagnetic field provides energy and achieves energy supply and data transmission through RF.

Product Model: timecos/di card has two types:

One is based on Philips The Mifare PRO-MF2ICD80 dual interface chip developed by the company, its contact part conforms to iso7816 and "China Financial integrated circuit IC card specification" requirements, the non-contact part conforms to the type a standard in the standard. One is the upcoming release based on Siemens The company's sle66clxx Series Dual interface chip development, contact part comply with iso7816 and "China's financial integrated circuit IC card specification", the non-contact part of the support for ISO14443-TYPE A or type B dual interface card. The card capacity is 8 K bytes and 16 K bytes. Advantages of Dual-interface cards

One-Card Multi-purpose, one-card

CARDS support multiple applications: A card can be integrated with multiple different applications, multiple industries, and multiple applications for simultaneous card issuance. The application is flexible and convenient. You can choose to use contact or non-contact transaction methods to reduce operating costs based on different application conditions and requirements. It is suitable for large transaction volumes and short transaction time, in a trial environment that requires no waiting during the transaction process, the machine is completely closed, suitable for harsh working environments and self-consumption places, with strong anti-destruction and anti-interference capabilities; suitable for systems with high security requirements, it can be used as a financial e-wallet application. The Card conflict prevention mechanism allows multiple cards to enter the transaction zone at the same time. It is fully compatible with traditional contact devices and can be used directly on it. High Security Chip Security: A chip with a random data generator is used to prevent physical and logical attacks. Program Code Cos, once written, cannot be reproduced; each chip has a unique Factory Code. Operating System Security: supports singledes and tripledes. Algorithm : The singledes or tripledes algorithm can be automatically selected based on the key length. Line encryption and protection are supported to prevent illegal theft or tampering of communication data. Multiple key types support different key usage methods. Transmission Security: Non-contact data transmission follows the relevant transmission protocol. After encryption and processing of cards and machines, data will not be leaked even if it is intercepted. Fast transaction The chip contains the des operation accelerator, which can quickly complete singledes, tripledes and other algorithms. A single tripledes operation time is 130 microseconds. In non-contact communication, the communication transmission rate is 106 kbps; the communication rate of the contact part can be adjusted, and the communication rate can reach bps. Good compatibility Meets the requirements of China Financial integrated circuit (IC) card Specification; complies with Type A in the standard, and later based on Siemens chip dual interface card supports type A or type B. Currently, the application supports Mifare-I card reading and writing. You only need to upgrade the software to easily read and write the Mifare-Pro type timecos/di that supports type. Dual interface CPU card encapsulation process description As a new technology, dual-interface CPU card has special requirements for card encapsulation. Currently, two main packaging processes are used: laminated and injection molding. Compared with common contact cards, the dual-Interface Card adds a set of antennas and cards. Encapsulation The process is difficult. At present, the dual-Interface Card packaging process has some problems: the antenna is a medium for Energy Transfer and communication between the chip and the read/write machine in a non-contact mode, which is generally in encapsulation, The contact between the antenna and the chip isConductive RubberTo connectDue to the process and Conductive Rubber problems, the connections between some card antennas and contacts are unstable, The dual interface is often stuck after encapsulation or used for a period of time, and the non-contact interface cannot work normally.In application testing, the proportion of non-contact card interfaces that cannot work normally due to encapsulation problems accounts for the majority of card failure rates. But some German manufacturers use Flexible Conductive AdhesiveThe reliability is also good, and this situation does not occur. Currently, Chinese enterprises have not mastered this technology. Some companies also adopt a unique encapsulation technology in the encapsulation of Dual-interface cards to solve the connection problem between antennas and contacts of Dual-interface cards, this makes the connection between the antenna and the contact more solid and reliable. Due to the application of this technology, the encapsulation yield rate of the dual interface card and the failure of the non-contact interface in use have been greatly reduced.

There are three types of Dual-interface cards:

1. The contact smart card system and the non-contact smart card system are physically combined into a card. The two EEPROM systems are independent of each other. 2. The contact smart card system and the non-contact smart card system operate independently of each other, but the internal part of the shared card Storage space . 3. The contact smart card system is fully integrated with the non-contact smart card system. The contact type and non-contact operation status are the same and share one CPU management. Among the three dual-interface IC cards, only the last dual-interface IC card is the real non-contact dual-interface CPU card.