Computer black screen Didi notes

We recommend that you take a look at the CPU fan and other heat dissipation problems, as well as cleanup, and clear all the gold fingers of the memory graphics card. Try another monitor.

Press f8. Always press, not press. Select the VGA mode. Then, adjust the resolution and refresh rate of the monitor. If the screen is LCD, You can first choose 1024x768. The refresh rate is 60Hz, and then restart the system.

We recommend that you take a look at the CPU fan and other heat dissipation problems, as well as cleanup, and clear all the gold fingers of the memory graphics card. Try another monitor.

View desktop memory module model information

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1. Method 1:Directly view.Disassemble the chassis lid, carefully take down the memory stick, and turn it to the front. We can see the main information of the memory stick on the left. As shown in, the memory stick brand is Kingston, which is obvious. The main information should be obtained from kvr800d2n6/2g. The memory is DDR2, the main frequency is 800, and the memory size is 2 GB.

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   Method 2:Use third-party software.Download Master Lu's installation, double-click it, and the software automatically obtains computer hardware information. Click memory information in the option bar on the left. You can see the memory details in the Information bar on the right.

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   After knowing the three major information about the memory stick, we must know how much memory we need when selecting the memory stick, which is a waste and boring. Select ddr1/DDR2/ddr3, and select the clock speed. Basically, these three are the right ones, and the memory size is nearly.

    

    

    

   Speaker is the interface of the chassis horn. It is used for alarm purposes. Generally, when the system is started, the "Speaker" sounds like the chassis horn, and hardware errors may make different noises Based on the cause of the error, this determines the reason for memory, video card, hard disk, and other devices.
   The red is positive, the Black is negative, and the speaker has two interfaces. If you unplug the video card, it means there is a problem with your horn.
   
   
   Figure 1 shows the family photos of three generations of memory, from top to bottom: ddr3, DDR2, and DDR. Remember what they look like, because the image will be mentioned later.
   
   

   
   
   
   Defense Against stay gaps: different locations prevent insertion errors
   Figure 1 red circles refer to the anti-stay gap we are talking about, so that we can avoid inserting errors when installing the memory. We can see from figure 1 that there is only one sticky protection gap in the three generations of memory. Pay attention to the metal slices on both sides of the three bayonet ports, we can see that the number of metal slices on both sides of the gap is different.
   For example, the number of single-sided Gold finger pins in the DDR memory is 92 (184 on both sides), the left side of the gap is 52, and the right side of the gap is 40; DDR2 memory 120 single-sided gold fingers (240 on both sides), 64 on the left side of the gap, 56 on the right side of the gap, and 120 on the ddr3 memory single-sided gold fingers (240 on both sides ), 72 pins on the left side of the gap and 48 pins on the right side of the gap.
   　　Chip encapsulation: concentration is the essence
   Different numbers of block particles are distributed on different memory disks, which are what we call Memory particles. At the same time, we also noted that the shape and size of memory particles are not the same for different memory specifications, which is caused by the different memory particle packaging technology. In general, the DDR memory adopts the TSOP (thin small outline package, thin and small package) encapsulation technology, which is long and large. DDR2 and ddr3 memory use fbga (bottom spherical pin encapsulation) encapsulation technology. Compared with TSOP, the memory size is much smaller. fbga Encapsulation has obvious advantages in anti-interference and heat dissipation.
   TSOP is the memory particles welded to the memory PCB through the pins (Figure 2 yellow box), the pins are directed around the particles, therefore, we can see that there are many metal columnar contacts between the particles and the memory PCB interface, and the shape size of the particle package is large and rectangular. The advantage is that the cost is low and the process requirement is not high, however, the contact area between solder joints and PCB is small, making the DDR memory less conductive, vulnerable to interference, and less heat dissipation ideal.

   
   
   In the fbga package, the DDR2 and ddr3 memory particles are made into squares (figure 3), and the size is about 1/3 of the DDR memory particles. The columnar metal contacts on the DDR memory chip are not displayed on the memory PCB, because its columnar solder joints are distributed in the encapsulation form by arrays, all the contacts are "wrapped" and cannot be seen outside. It effectively shortens the signal transmission distance.
   
   

   
   
   
   　　Speed and capacity: doubled 
   We have taught you how to calculate the memory bandwidth. In fact, when we select a memory and CPU combination, we will check whether the memory bandwidth is greater than or equal to the CPU bandwidth, in this way, the CPU data transmission requirements can be met.
   We can see from the bandwidth formula (bandwidth = Bit Width x frequency limit 8) that the most closely related to bandwidth is frequency. This is also one of the reasons why the three generations of memory equivalent frequency is one liter and then increased, its purpose is to meet the CPU bandwidth.
   Not only has the speed increased, but with the increase of our applications, we also need a larger single memory capacity. In the DDR era, the most popular memory is MB and 1 GB. In the DDR2 era, the two 1 GB memory is only a standard configuration, and the number of computers with a memory of 4 GB is gradually increased. Even in the future, there will be a single 8 GB memory. This shows that people's requirements for memory capacity are constantly increasing.
   　Latency: Generation-to-generation
   Any memory has a CAS latency value, which is like a command B to do things, B needs to think about the same time. Generally, the smaller the memory latency value, the faster the transmission speed.
   We can see from DDR, DDR2, and ddr3 memory that although their transmission speed is getting faster and faster, their frequency is getting higher and the capacity is getting bigger and bigger, but the delay value is increased, for example, the latency value of the DDR memory (the size of the first value is the most important, and normal users can focus on the first latency value) is 1.5, 2, 2.5, and 3. In the DDR2 era, the latency value has been increased to 3, 4, 5, and 6. In the ddr3 era, the latency value has also been increased to 5, 6, 7, 8 or higher.
   　Power Consumption: reduced once and again
   Electronic products must work normally and must have electricity. When there is electricity, the operating voltage is required. The voltage is obtained from the memory slot on the motherboard using a golden finger. The memory voltage also reflects the actual power consumption of memory. Generally, the lower the memory power consumption, the lower the calorific value, and the more stable the operation. The operating voltage of the DDR memory is 2.5 V, and the power consumption is about 10 W. In the DDR2 era, the operating voltage is reduced from 1.8 V to V. In the ddr3 memory era, the operating voltage is reduced from 1.8v to 1.5 V, saving 30% compared with DDR2 ~ 40% power consumption. Therefore, we can also see that, from the DDR memory to the ddr3 memory, although the memory bandwidth is greatly improved, the power consumption is reduced, and the memory overclocking and stability are further improved.
   　　Manufacturing Process: Continuous Improvement
   From DDR to DDR2 to ddr3 memory, the manufacturing process is continuously improved. A higher level of process will make the memory electrical performance better and the cost lower. For example, the DDR memory particles are widely used in the manufacturing process of 0.13 microns, while DDR2 particles adopt the manufacturing process of 0.09 microns, while ddr3 particles adopt the new 65nm manufacturing process (1 micron = 1000 nm ).
   Summary
   The knowledge of memory is mentioned here. In general, memory mainly plays the role of CPU data warehouse, so the CPU Performance Improvement and memory capacity and performance must keep up with each other, however, you cannot blindly allocate too much memory capacity. For most users, 2 GB DDR2 800 of memory is enough, while the high-end computers use about 4 GB of memory.
   Physical memory and virtual memory
   Physical memory is what we can see. Virtual Memory is a false memory, which is a storage space opened on the hard disk. It is an extension and supplement for physical memory. When the memory space is insufficient, the system will transfer some temporarily unavailable data to the virtual memory. This is like in a mobile warehouse, the Administrator first moves some unsalable goods to the backup warehouse and leaves the space for the goods that often go in and out of the warehouse for use.
   　　Dimm
   The full name of dimm is dual Inline Memory Module (dual-row direct-insertion Memory Module). We can simply think of it as the type of memory slot. From the initial SDRAM dimm to DDR dimm, to the current DDR2 dimm, the number of pins (that is, golden finger) specified for several types and the pin definition to prevent stay gaps are different, cannot be mixed.