Learning materials for Linux Bond technology

Bond Technology Principles

Bond is the technology of virtual network card to be a piece of NIC, through the bond technology to make multiple NIC appear to be a separate Ethernet interface device and have the same IP address.

The principle of Bond is that the NIC operates in promiscuous (PROMISC) mode, in which the network card is not typically the Ethernet frame that only receives the destination hardware address as its own Mac, filters out other data frames to reduce the burden on the driver, and instead receives all the data frames on the network. The MAC address of the driver is changed, the MAC address of the two NIC is changed to the same, the data frame of the specific Mac can be received, and then the corresponding data frame is transferred to the bond driver processing. Working mode of Bond NIC

There are two modes of working with the NIC Bond: the mode of operation and the load Balancing mode of the primary and standby.

The two-Nic bond topology diagram looks like this: Figure 1. Dual NIC bond topology diagram

In the main standby mode, only the primary network card eth0 work, eth1 as a backup network card is not working, only when a network interface failure (such as the main switch power off, etc.), in order to avoid network interruption, the system will be configured according to the configuration of the specified network adapter sequence to start work, to ensure that the machine can still service, played a function

In the load balancing operation mode, because the two network cards are working, it can provide twice times the bandwidth, in this case a network card failure, will only be the server egress bandwidth drops, will not affect network use.

LinuxUnder the network Cabondine technology not only increased the reliability of the server, but also increased the available network bandwidth, to provide users with uninterrupted network services.

Here are some of the articles collected about configuring Bond under Linux

http://sunshyfangtian.blog.51cto.com/1405751/577762

http://blog.itpub.net/27144762/viewspace-1127106

Http://support.huawei.com/ecommunity/bbs/10155553.html

Learning materials for Linux Bond technology