1. CPU
3 dnow! (3D no waiting, no need to wait for 3D processing)
AAM (AMD analyst meeting, amd analyst conference)
ABP (advanced branch prediction, advanced branch prediction)
ACG (aggressive clock gating, active clock selection)
AIS (alternate instruction set, alternate Instruction Set)
Alat (Advanced load table, advanced load table)
Alu (arithmetic logic unit, arithmetic logic unit)
Aluminum (aluminum)
Agu (address generation units, address Generation Unit)
APC (advanced power control, advanced energy control)
APIC (Advanced rogrammable interrupt controller, advanced programmable interrupt controller)
APS (alternate phase shifting, alternating phase jump)
ASB (advanced system buffering, advanced system buffer)
ATC (Advanced transfer cache, advanced transfer cache)
ATD (assembly technology development, assembly technology development)
Bbul (bumpless build-up layer, built-in non-concave-convex layer)
BGA (Ball Grid Array)
BHT (branch prediction table, branch prediction table)
BOPS (billion operations per second, 1 billion operations/second)
BPU (branch processing unit, branch Processing Unit)
BP (Brach pediction, branch prediction)
BSP (boot into processor, starting the bundled processor)
Btac (branch target Address Calculator, Branch Target addressing calculator)
CBGA (Ceramic Ball Grid Array, ceramic ball network array)
CDIP (ceramic dual-in-line, dual ceramic line)
Center processing unit utilization, CPU usage
CFM (cubic feet per minute, cubic feet/second)
CMT (Course-grained multithreading, Process elimination multithreading)
CMOS (Complementary Metal Oxide semicondu, Complementary Metal Oxide Semiconductor)
Cmov (conditional move instruction, conditional move command)
CISC (Complex Instruction Set Computing, Complex Instruction Set Computer)
CLK (clock cycle, clock cycle)
CMP (On-Chip Multiprocessor, In-chip multi-processing)
CMS (Code morphing software, code deformation software)
Co-CPU (Cooperative CPU, coprocessor)
Cob (cache on board, integrated cache on the board, secondary cache on the CPU card, usually half the speed of the kernel ))
COD (cache on die, chip kernel integrated cache)
Copper (copper)
Cpga (ceramic pin grid array, ceramic needle Grid Array)
CPI (cycles per instruction, cycle/instruction)
CPLD (Complex Programmable Logic Device)
CPU (center processing unit, central processor)
CRT (Cooperative redundant threads, collaboration with redundant threads)
CSP (Chip Scale Package, chip proportional package)
Cxt (chow.extend, reinforced K6-2 kernel, K6-3)
Data Forwarding (data delivery)
DB (decibel, decibel)
DCLK (DOT clock, dot clock)
DCT (DRAM controller, DRAM controller)
Dynamic deferred transaction)
Decode)
Dib (dual independent Bus)
DMT (Dynamic multithreading architecture, dynamic multi-thread structure)
DP (dual processor, dual processor)
DSM (dedicated stack manager, dedicated stack Management)
Dsmt (Dynamic simultaneous multithreading, dynamic synchronization multithreading)
DST (depleted substrate transistor, attenuation bottom-layer Transistor)
DTV (dual threshold voltage, dual limit voltage)
DUV (deep ultra-violet, deep UV)
Ebga (enhanced Ball Grid Array, enhanced spherical network array arrangement)
EBL (Electron Beam Lithography, electron beam print)
EC (embedded controller, embedded controller)
Edec (early decode, early decoding)
Embedded chips (embedded)
EPA (edge PIN array, edge PIN array)
EPF (Embedded Processor Forum, embedded processor Forum)
EPL (electron projection lithography, electronic emission print)
Enhanced Power management, enhanced energy management)
EPIC (Explicitly Parallel Instruction Code, parallel instruction code)
EUV (extreme ultra violet, UV)
EUV (Extreme Ultraviolet Lithography, Extreme uv print)
FADD (floationg point addition, floating point addition)
Fbga (fine-Pitch Ball Grid Array)
Fbga (flipchip BGA, light chip bga)
FC-BGA (flip-chip Ball Grid Array, reverse chip spherical Grid Array)
FC-LGA (flip-chip land grid array, reverse contact grid array)
FC-PGA (flip-chip pin grid array, reverse Chip Pin Grid Array)
Fdiv (floationg point divide, floating point Division)
Femms: Fast entry/exit multimedia state to quickly enter/exit the multimedia status
FFT (Fast Fourier Transform, Fast hot ohm conversion)
FGM (fine-grained multithreading, advanced multithreading)
FID (FID: frequency identify, frequency identification number)
FIFO (first input first output, first in first out queue)
FISC (fast Instruction Set Computer, fast Instruction Set Computer)
Flip-chip (chip reversal)
Flops (floating point operations per second, floating point operation/second)
FMT (fine-grained multithreading, pure multi-thread elimination)
Fmul (floationg point multiplication, floating point multiplication)
Fprs (floating-point registers, floating point register)
FPU (Float Point Unit)
Fsub (floationg point subtraction, floating point subtraction)
GfD (Gold finger device, Gold finger overclocking device)
Ghc (Global History counter, General History counter)
GTL (gunning transceiver logic, radio transceiver logic circuit)
Gvpp (generic visual perception processor, conventional visual processor)
HL-PBGA: Surface adhesive, high heat resistance, light and thin plastic ball network array package
Htt (hyper-Threading Technology, super Thread Technology)
Hz (Hertz, Hertz, Frequency Unit)
Ia (Intel architecture, Intel architecture)
Intel application accelerator (Intel application accelerator)
ICU (Instruction Control Unit)
ID (identify)
IDF (Intel Developer Forum, Intel Developer Forum)
Ieu (Integer Execution units, Integer Execution Unit)
IHS (Integrated Heat spreader, complete thermal extension)
ILP (Instruction Level Parallelism, command-level parallel operation)
Imm: Intel Mobile module, Intel Mobile Module
Instructions cache, command Cache
Instruction coloring)
Iops (integer operations per second, Integer Operation/second)
IPC (instructions per clock cycle, instruction/clock cycle)
ISA (Instruction Set architecture, instruction set architecture)
ISD (inbuilt speed-Throttling Device, internal speed control device)
ITC (Instruction trace cache, instruction tracking cache)
Itrs (International Technology Roadmap for semiconductors, international semiconductor technology development blueprint)
Kni (Katmai new instructions, Katmai new instruction set, I .e. SSE)
Latency)
LDT (lightning data transport, lightning data transmission bus)
LFU (legacy function unit, a traditional function unit)
LGA (Land grid array, contacts Grid Array)
Ln2 (liquid nitrogen, liquid nitrogen)
Local Interconnect)
MAC (multiply-accumulate, accumulative multiplication)
Mbga (Micro Ball Grid Array, micro ball network array)
Nm)
MCA (machine check Architecture)
MCU (micro-controller unit)
MCT (memory controller, memory controller)
MESI (modified, exclusive, shared, invalid: Modify, exclude, share, discard)
Mf (microops fusion, micro-command merge)
Mm (micron metric, micron)
MMX (multimedia extensions, multimedia Extended Instruction Set)
MMU (Multimedia Unit, Multimedia Unit)
MMU (Memory Management Unit)
Mn (model numbers, model number)
Mflops (million floationg point/second, millions of floating point operations per second)
MHz (megahertz,)
Mil (unit of length for PCB or wafer layout, 1 mil = 1 inch in kilobytes)
MIPs (million instruction per second, millions of commands/s)
MOESI (modified, owned, exclusive, shared or invalid, modify, own, exclude, share, or invalid)
MOF (micro ops fusion, micro operation fusion)
Mops (million operations per second, millions of Operations/s)
MP (Multi-processing, multi-processor architecture)
MPF (micro processor Forum, microprocessor Forum)
MPU (microprocessor unit, microprocessor)
MPs (multiprocessor specification, multi-processor Specification)
MSRs (model-specific registers, special module register)
MSv (multiprocessor Specification Version, multi-processor Specification Version)
Naoc (no-account overclock, invalid overclock)
Ni (non-intel, non-Intel)
Nop (no operation, non-operation command)
NRE (non-recurring engineering charge, non-repetitive engineering cost)
Obga (organic Ball Grid arral)
Ocpl (off center parting line, far from the center Queue)
Olga (organic land grid array, organic flat network array packaging)
Ooo (out of order, execution in disorder)
OPC (optical proximity correction, optical near correction)
Opga (organic pin grid array, organic and plastic needle Grid Array)
(Ordering part number)
Performance acceleration technology (performance acceleration technology)
PBGA (plastic pin ball grid array, plastic ball network array)
Pdip (plastic dual-in-line, plastic dual line)
PDP (parallel data processing, parallel data processing)
PGA (Pin-grid array, pin Grid Array), High Power Consumption
PLCC (plastic leaded chip carriers)
Post-RISC)
Pr (performance rate, performance ratio)
PIB (processor in a box, boxed processor)
PM (pseudo-multithreading, false multithreading)
Ppga (plastic pin grid array, plastic needle network array package)
Pqfp (plastic quad flat package, plastic block plane package)
PSN (processor serial numbers, processor serial number)
QFP (quad flat package, block plane encapsulation)
Qsps (Quick Start Power State)
RAS (return address stack, return address stack)
Raw (read after write, post-read)
REE (rapid execution engine, quick execution engine)
Register contention (preemption register)
Register pressure (insufficient registers)
Register renaming (register rename)
Remark)
Resource contention)
Retirement)
Balanced CED Instruction Set Computing, simplified instruction set computer)
Rob (re-order buffer, resort buffer)
RSE (register stack engine, register stack engine)
RTL (register transfer level, transfer layer. A Description Level of the hardware description language)
Sc242 (242-contact slot connector, 242-pin Gold finger slot connector)
Se (special embedded, especially embedded)
SEC (single edge connector, single edge connector)
SECC (single edge contact cartridge, single edge contact card box)
Sepp (single edge processor package, single edge processor package)
Shallow-Trench Isolation (shallow isolation)
SIMD (Single Instruction Multiple Data, single command multiple data streams)
Sio2f (fluorided silicon oxide, dioxysilicon fluoride)
SMI (System Management Interrupt, System Management interrupted)
SMM (system management mode, System Management Mode)
SMP (symmetric Ric multi-processing, Symmetric Multi-processing architecture)
SMT (simultaneous multithreading, synchronous multithreading)
SOI (silicon-on-insulator, Insulator wafer)
Soic (plastic small outline, small plastic)
Sonc (system on a chip, system integration chip)
Spga (staggered pin grid array, staggered needle network array package)
SPEC (System Performance Evaluation Corporation, system performance evaluation test)
SQRT (square root calculations, square root calculation)
Srq (system request queue, system request queue)
SSE (streaming SIMD extensions, single command multi-data stream extension)
SFF (small form factor, smaller shape pattern)
SS (Special sizing, special scaling)
SSP (slipstream processing, stream processing)
SST (Special sizing techniques, special screening technology)
Ssop (shrink plastic small outline, small plastic)
STC (space time computing)
Superscalar (over-Standard Architecture)
Tap (Test Access Port)
Tbga (tie ball grid array, spherical grating array)
TCP: tape carrier package (Thin Film encapsulation), with low fever
TDP (thermal design power, thermal design power)
Throughput (throughput)
TLB (translate look side buffers)
TLP (thread-Level Parallelism, line-level parallel)
TMP (threaded Multi-path, multi-channel thread)
TPI (true performance initiative/index, real performance first/indicator)
Tqfp (thin plastic quad flat pack, thin plane package)
TRC (row cycle time, column Cycle Time)
TRD (transistor density, transistor density)
TSOP (thin small outline plastic, small plastic)
USWC (uncacheabled speculative write combination, unbuffered random joint write operation)
Valu (vector arithmetic logic unit, vector arithmetic logic unit)
Vfsd (vertex frequency stream divider, separated by vertex frequency streams)
Vid (VID: Voltage identify, voltage identification number)
VLIW (very long instruction word, ultra-long script)
VPU (vector permutate unit, vector arrangement Unit)
VPU (vector processing units, vector processing unit, where SIMD commands such as MMX and SSE are processed)
VSA (Virtual System Architecture)
VTF (via technical forum, Weisheng Technical Forum)
Xbar (crossbar)
XP (experience)
XP (extra performance, extra performance)
XP (extreme performance, fast performance)
Radiator
TFT (tiny fin technology, micro fin Technology)
2. Motherboard
Repeated io (Third Generation Input/output, third-generation input/output Technology)
ACR (Advanced Communications riser, advanced communication upgrade card)
Adimm (advanced dual in-line memory modules, advanced dual embedded memory module)
Agtl + (supported ed gunning transceiver logic, supporting transmitting and receiving logic circuits)
Ahci (Advanced Host Controller Interface, advanced Host Controller Interface)
Aimm (AGP Inline Memory Module, memory upgrade module on The AGP Board)
Amr (audio/MODEM riser; audio/MODEM motherboard With upright plug-in card)
Aha (accelerated hub architecture, Acceleration Center Architecture)
Aoi (Automatic Optical Inspection, Automatic Optical Inspection)
Apu (audio processing unit, audio processing unit)
Asynchronous receive FIFO (asynchronous)
ASF (Alert Standards Forum, warning standard discussion)
Ask Ir (amplitude shift keyed infra-red, long waveform removable input infrared)
At (Advanced Technology)
ATX (at extended)
BiOS (Basic Input/Output System, Basic Input/Output System)
CNR (communication and networking riser, communication and network upgrade cards)
CSA (Communication streaming architecture, communication stream architecture)
CSE (configuration space enable, allocable space)
Coast (Cache-on-a-stick, stripe cache)
Dasp (dynamic adaptive speculative pre-processor, dynamic adaptive prediction Preprocessor)
DB: Device Bay, device plug-in rack
DMI (Desktop Management Interface)
DOT (Dynamic overclocking technonlogy, dynamic overclock Technology)
DPP (direct print protocol, direct print protocol
Drcg (direct Rambus clock generator, direct Rambus clock generator)
Dvmt (dynamic video memory technology, dynamic video memory technology)
E (economy, economy, or entry-level, entry-level)
EB (expansion bus, extended Bus)
EFI (extensible firmware interface, extended firmware interface)
EHCI (enhanced Host Controller Interface, enhanced Host Control Interface)
EISA (enhanced industrial standard architecture, enhanced Industrial Standard Architecture)
Emi (electromagnetic interference, electromagnetic interference)
Escd (extended system configuration data, scalable system configuration data)
ESR (equivalent series resistance, equivalent series resistance)
FBC (frame buffer cache, frame buffer cache)
Firewire (Firewire, ieee1394 Standard)
Flexatx (Flexibility ATX, scalable ATX)
FSB (front side bus, Front End bus)
Fwh (firmware hub, firmware Center)
GB (Garibaldi architecture, Garibaldi is based on The ATX architecture, but it can also use the wtx architecture chassis)
Gmch (Graphics & memory controller hub, graphics and memory control center)
GPA (graphics performance accelerator, graphics performance accelerator)
GPIs (general purpose inputs, general operation input)
GTL + (gunning transceiver logic, transmitting and receiving logic circuit)
Hdit (high bandwidth differential interconnect technology, high bandwidth differential Interconnect Technology)
Hslb (high speed link bus)
HT (hypertransport, super transmission)
I2C (Inter-ic)
I2C (Inter-integrated circuit, built-in ic)
Ia (instantly available, instantly available)
Ibases (Intel baseline AGP System Evaluation Suite, Intel baseline AGP System Evaluation Suite)
IC (Integrated Circuit)
Ich (Input/Output Controller hub, Input/Output Control Center)
ICH-S (ICH-Hance rapids, ich high speed)
ICP (Integrated Communications Processor, integrated communication processor)
IHA (Intel hub architecture, Intel hub Architecture)
IMB (Inter module bus, hiding module Bus)
Intin (Interrupt inputs, interrupt input)
Ipmat (Intel power management analysis tool, Intel energy management analysis tool)
Ir (infrared ray, infrared)
IRDA (infrared ray, an infrared communication interface for LAN access and file sharing)
ISA (Industrial Standard Architecture, Industrial Standard Architecture)
ISA (Instruction Set architecture, industrial setting Architecture)
K8htb (K8 hypertransport bridge, K8 lightning transport bridge)
LSI (large scale integration, large-scale integrated circuit)
LPC (low pin count, less-pin Interface)
MAC (Media Access Controller)
MBA (manage boot agent, management startup agent)
MC (memory controller, memory controller)
MCA (micro channel architecture, micro channel Architecture)
MCH (memory controller hub, memory control center)
MDC (mobile daughter card, mobile sub-card)
MII (Media independent interface, media independent interface)
Mio (media I/O, media input/output unit)
MOSFET (metallic oxide semiconductor field effecttransistor, metal oxide semiconductor field effect transistor)
Memory repeater hub, memory data processing center)
MRH-S (SDRAM repeater hub, SDRAM data processing center)
Mrimm (media-RIMM, media Rimm expansion slot)
MSI (Message signaled interrupt, information signal interrupted)
Mspce (Multiple Streams with pipelining and concurrent execution, pipeline transmission and concurrent execution of multiple data streams)
Mt = megatransfers (MB transfer rate)
MTH (memory transfer hub, memory conversion Center)
Mutiol (multi-threaded I/O link, multi-thread I/olink)
Ncq (native command Qu, local command sequence)
NGIO (Next Generation Input/output, Next Generation Input/Output Standard)
Nforce platform processor architecture, nforce platform processing architecture)
OHCI (Open Host Controller Interface, open master controller Interface)
ORB (Operation Request block, Operation Request block)
Ors (over reflow soldering, back-to-weld, SMT component welding method)
P64h (64-bit PCI Controller hub, 64-bit PCI Control Center)
PCB (printed circuit board, Printed Circuit Board)
Pcba (printed circuit board assembly, printed circuit board assembly)
PCI (Peripheral Component Interconnect, interconnect peripheral devices)
PCI sig (Peripheral Component Interconnect Special Interest Group, specialized group for connecting peripheral devices)
PDD (performance driven design, performance-driven design)
Phy (Port physical layer, port physical layer)
Post (power on self test, powered on self test)
PS/2 (Personal System 2, second generation personal system)
PTH (plated-through-hole technology, plating through hole technology)
Re (read enable, readable)
QP (quad-pumped, quadruple pump)
RBB (Rapid BIOS boot, quick BIOS boot)
RNG (random number generator, random number generator)
RTC (real time clock, real-time clock)
KBC (keybroad control, keyboard controller)
SAP (sideband address port)
SBA (side band addressing, side band addressing)
SBC (Single Board Computer)
SBP-2 (Serial Bus Protocol 2, the second generation Serial Bus Co-operative)
SCI (serial communications interface, serial communication interface)
Sck (CMOs clock, CMOS clock)
SDU (segment Data Unit)
SFF (small form factor, small size Architecture)
SFS (stepless frequency selection, Step Frequency option)
SMA (share memory architecture, shared memory structure)
SMT (surface mounted technology, surface adhesive encapsulation)
SPI (serial peripheral interface, serial peripheral device interface)
Ssll (single stream with low latency, low-latency individual data stream transmission)
STD (suspend to disk, wake up disk)
STR (suspend to ram, wake up memory)
SVR (switching voltage regulator, switching voltage adjustment)
Tht (through hole technology, plug-in encapsulation technology)
Uchi (Universal Host Controller Interface, universal Host Controller Interface)
UPA (Universal Platform Architecture, unified platform architecture)
Updg (Universal Platform Design Guide, unified platform design guide)
Usart (Universal synchronous asynchronous transmitter er transmitter, universal synchronous non-synchronous receiving and transmitting)
USB (Universal Serial Bus)
Usdm (unified system diagnostic manager, unified system monitoring manager)
Vid (voltage identification definition, voltage recognition certification)
VLB (Video Electronics Standards Association local bus, Video Electronics Standards Association local bus)
Large-scale integration (ultra-large scale integrated circuit)
Vmap (via modular architecture platforms, via module architecture platform)
VSB (V standby, standby voltage)
Vxb (Virtual extended Bus)
VRM (Voltage Regulator Module, voltage adjustment module)
WCT (Wireless Connect Technology, wireless connection technology)
We (write enalbe, writable)
WS (wave soldering, wave soldering, tht component welding method)
XT (Extended Technology)
Zif (zero insertion force, zero plug-in outlet)
Chipset
ACPI (Advanced Configuration and Power interface, advanced settings and Power Management)
AGP (accelerated graphics port, graphic acceleration Interface)
BMS (Blue Magic slot, Blue Magic slot)
I/O (input/output, input/output)
MIOC: memory and I/O bridge controller, memory and I/O bridge Controller
NBC: North Bridge Chip (North Bridge Chip)
Piix: pci isa/ide accelerator (accelerator)
36: page size extension 36-bit, 36-bit page size extension mode
Pxb: PCI expander bridge, PCI enhanced Bridge
RCG: Ras/CAS generator, RAS/CAS Generator
SBC: south bridge chip (South Bridge Chip)
SMB (System Management Bus)
SPD (Serial presence detect, continuous detection device)
SSB: Super South Bridge, super South Bridge Chip
TDP: Triton data path)
TSC: Triton System Controller (System Controller)
Qpa: quad port acceleration (four interface acceleration)
Main Board Technology
Gigabyte
ACOPS: Automatic CPU overheat Prevention System (CPU Overheating prevention system)
Siv: System Information Viewer)
Ying
Esdj (easy setting dual jumper, which simplifies the CPU dual jumper method)
Haoxin
Upt (USB, panel, Link, TV-OUT quad Interface)
ASUS
C. o. P (CPU overheating protection, processor overheating protection)
3. display devices
AD (analog to digitalg, analog to digital conversion)
ADC (Apple display connector, Apple dedicated display interface)
AGC (Anti glare coatings, anti-glare coating)
Amr (ATI multi-rendering technology, ATI multi-rendering technology)
ASIC (Application Specific Integrated Circuit, special application integrated circuit)
ASC (auto-sizing and centering, automatic screen size and center position adjustment)
ASC (Anti static coatings, anti-static coating)
ASD (auto stereoscopic display, automatic stereo display)
AG (Aperture grills, raster metal plate)
ARC (Anti reflect coating, anti-reflection coating)
Bla: bearn landing area (electron beam)
BMC (Black Matrix Screen, ultra-Black Matrix Screen)
CCS (Cross capacitance sensing, cross-capacitor sensing)
CD/m ^ 2 (candela/m2, brightness Unit)
CDRs (curved directional reflection screen, curve direction reflection screen)
CG-silicon (continuous grain silicon, continuous particulate silicon)
CNT (carbon nano-tube, carbon micro tube)
CRC (cyclic redundancy check)
