Design engineers must follow the following design specifications:
Latest key keepout options:
1) when using PROTEL 99 or dxp software design engineers, be sure not to check the keepout option in online attribute options regardless of the layer when drawing the wire, once the keepout option is selected, this line cannot be made (as long as this option is selected, this line is disabled ),
I. Most common errors related to engineer design:
1) character design: the width of the silkscreen in the circuit board cannot be less than 0.15mm, the character height cannot be less than 0.8mm width/height ratio. The ideal value is. If it is smaller than this parameter, jialichuang will not resize the characters in the file, this may cause serious unclear characters due to exceeding the production capacity, and the company will not accept such complaints that the characters are unclear due to design inconsistency. Please pay attention to the design. clear characters, some characters are unclear)
2) window opening layer: Separate solder and paste )! To open the window, do not use the solder layer. paste is only a steel mesh layer.
Ii. Problems Related to protel99 dxp Software
1: very few customers use the multilayer layer to think that the pad can be made (two-layer lines and the window opening effect) This is wrong, if you want to open the window also need to add the soldering layer solder layer
Iii. pads software problems:
1) In the pads software hatch copper, the circuit board factory uses hatch to restore the design of copper, the copper display is restored, rather than the electrical network of copper flood is the design of copper, you must use hat copper to check the circuit board!
Jia Lichuang: circuit board manufacturing design
------------ Ask all the design engineers to spend an hour reading the following articles and do not make any mistakes. Thank you! Regulate your design to avoid any problems. The phone number is as follows: 13724397630 simple design technical problems should not be mistaken. If your design is wrong, the factory will not take responsibility and hope to understand it!
I. Division I is based on the files provided by the customer (support for 99se, pads/dxp and Gerber ). 1) It should be noted that the high-edition Board, such as dxo2004, or a later version should not be converted to the 99se version, resulting in less copper skin. 2) (important) if you use dxp2004, ad6.9, and Ad series design software, convert it into a gerber file and submit it to us, otherwise, the Board may be useless because of an error in the isolation ring caused by version compatibility! The design of the inner layer with the main panel is not affected. Multiple cases have emerged! If not clear phone 13724397630 consulting two: PCB Material :( 1) substrate FR-4: Glass Cloth-epoxy resin copper foil. Jia Lichuang adopts a Grade A copper foil of KB: 99.9% or more electrolytic copper, finished surface copper foil: conventional 35um (1 oz) thickness: 0.4-2.0mm finished plate tolerances plus or less 3: PCB structure, size and tolerances: (1) the relevant design elements that constitute the PCB should be described in the design drawings. The shape is represented by mechanical 1-16 layer or keep out layer (priority. In the design drawing, the long slot hole or hollow hole (non-metallic slot hole) can be opened, and the corresponding shape can be drawn using the mechanical 1 layer or keep out layer. However, it must be noted that the two layers (important) cannot have the same dimensional tolerances of ± 0 at the same time in the same file. 2mm. Special requirements on shape tolerances must be noted in other remarks! Iv. Concept of layer (1) the single Panel uses the top layer to draw a signal layer, which indicates that the line of the layer is face-to-face. Pay attention to this. Many design engineers work on the reverse layer (2) when the single Panel uses the bottom layer (bottom layer) as the signal layer, it indicates that the line at this layer is the perspective surface (3) top layer is the front view. bottom layer is the top layer character of the perspective. The bottom layer character is the reverse (4) Solder Mask Layer (Solder Mask). It is used to open a window and cannot meet the green oil. 5. Printed wires and pad (1) layout: the diameter of the via hole (VIA) is above 3mm, the outer diameter is above 6mm, and the width of the single side solder ring is not less than 0.15 tin plate and the width of the gold plate process is above 6 mil ., To minimize the production cycle and reduce the difficulty of manufacturing. We will increase the compensation for pad by about 15mm to make up for the thickness tolerances of copper should be sunk in the production process, and do not compensate for the guide through hole (, when designing pad with via, it cannot be mixed; otherwise, it is difficult for your components to be inserted due to different compensation mechanisms. The width tolerances of printed wires are subject to the Internal Control Standard of ± 10% (2) mesh: because of the use of dry film, the grid will produce broken dry film, resulting in the possibility of open circuit, in order to make the circuit board better than the production, copper as much as possible to build a solid copper skin, if you do need to build a grid, the grid spacing should be above 10 mil, And the grid width should be above 10 mil (3) Heat Insulation pad (thermal pad) processing in a large area of ground (electricity, often connected with the components of the foot, the processing of the connection foot take into account the electrical performance and process needs, made into a cross flower pad (heat insulation disk ), this greatly reduces the possibility of generating virtual welding points due to excessive heat dissipation of the cross section during welding. (4) The inner strip and copper foil isolation drilling should be above 3mm MPa. It is recommended that the grounding pin of the component should be insulated and the distance from the copper foil to the drill should be above 3mm MPa. The outer wire and copper foil should be above 2mm MPa from the side of the board, and the inner layer of the Golden finger should not be copper foil, avoid short-circuit caused by exposed copper skin. Vi. pore size (hole) (1) Definition of PTH and npyh. By default, we use the following non-metallic methods: (1) when the customer sets the non-metallic properties of the installation holes in the Advanced properties (removed from the platde items in the advanced menu), our default is non-metallic. When the customer uses the keep out layer or the mechanical 1 layer arc to represent drilling in the design file, our default is non-metallic hole (the two layers cannot appear simultaneously in a file ), in the design drawing, the PCB Component hole and the (2) guide through hole (via hole) are generally controlled as follows: the negative tolerances are not required, and the positive tolerances are controlled within + 3mil (0.18. (3) Design of slot hole (slot hole) It is recommended that the non-metallic slot hole be used to draw its shape using mechanical 1 layer (or keep out layer). The metallic slot hole is represented by a connection hole, but the Connection holes should be large and small, and the holes should be in the same horizontal line. (4) Our minimum groove is 0.8mm. When the non-metallic slot hole is enabled for shielding, it is recommended that the diameter of the non-metallic slot hole be greater than 0mm in order to facilitate processing when the climbing between high and low voltage is avoided. The most suitable groove for processing is 1.6; otherwise, it will greatly increase the difficulty of work, resulting in higher production costs. 7. Solder Mask (1) coating parts should be coated with solder mask. it is determined by the designer. Generally, the PCB Surface except the pad, mark point, and test point must be used. (2) If the cooling or tin injection on the large copper strip is required, then, you must use the Solder Mask (Solder Mask) layer to draw a picture of the corresponding size and overlay it on the large copper skin and lines, to indicate that there is a tin. do not use the steel mesh paste mask layer to replace Solder Mask Layer eight characters and etching mark (1) basic requirements: PCB characters should generally be less than 0.15 in width, the height cannot be less than 0.8mm, and the width to height ratio is. It is more suitable to have a Character Spacing of more than 6 mil. If it is smaller than this parameter, the risk of unclear characters will be greatly increased, it does not affect the readability of text .. (2) We will not make any adjustments to the proportion and size of matching characters to maintain the originality of the file and design the consistency with the production effect (3) we will add the customer ID and internal number to the screen printing layer in the Board according to our technical requirements (4) text pad \ SMT processing character layer do not allow pad characters from pad distance not less than 7mil 9 about V-CUT (cut vslot) (1) no gap is left between the V-cut Board and the Board. that is to say, the shape line of the two Boards overlap, but note that the distance between the wires in the Board and the V cutting line is not less than 0.4mm (2) generally, the depth of the residual V after cutting is 1/3 thick. After the product is opened, the size of the glass fiber is slightly different because of the loose phenomenon, and the size of some products is larger than 5mm. (3) V-CUT knives can only walk straight lines, not curves and line;
From Weizhi note (wiz)
Design engineers must follow the following design specifications:
