DFM test in cam350

DFM test in cam350

Original article address:DFM Test 1 Author:Lanyuxuan

Most of these functions are concentrated under the analysis menu.

1. Silk to solder spacing

this function is used by the software to automatically check the spacing between the screen printing layer and the solder mask layer. Analysis-> the "check silkscreen" dialog box is displayed.

first, select the two layers to be checked, that is, sildcreen_top/soldermask_top, both selected or sildcreen_bottom/soldermask _ Bottom is selected at the same time. Then, enter the tolerable maximum effective spacing in clearance. It is best to check before "Remove Old silkscreen errors" to avoid confusion. After OK, the system performs a search. "silk to Sold check" is displayed on the left at the bottom of the screen. The percentage is displayed on the right. An error message box is displayed. After "OK", the screen jumps to the two layers of information, and a message display/edit entry is added in the upper right corner of the screen. Here, you can view the specific locations of all errors. You can click "all" to display all errors, or select an error from the drop-down box to query the specific location of the error.

2. Solder Mask to trace spacing

     In general EDA software, it is defined as solder mask, and it is the place where soldering tin is applied when making boards. There is no Solder Mask. When making a board, the flux is blocked. The main purpose of the solder resistance is to avoid the disorderly flow of Solder Pad leads during the welding process, which leads to a "bridge" Short Circuit. This ensures the installation quality and provides long-term electrical environment and chemical protection, form the "coat" of the printed circuit board ".
This command automatically checks the padding between cabling and sold.

analysis-> Solder Mask to trace spacing, the check Solder Mask dialog box is displayed.

    In this dialog box, select the electrical layer to be checked and the solder mask layer. The top/soldermask_top layer is also selected, or the bottom/soldermask_bottom layer is also selected. Then, enter the tolerable minimum spacing in clearance. It is best to tick the "remove old Solder Mask errors" to avoid confusion. After OK, the system performs a search. "solder" is displayed on the left at the bottom of the screen.
To trace check ": the percentage is displayed on the right. If an error is found after execution, an error message box is displayed.

    Similarly, after confirmation, the screen will jump to the two layers of information, and a message display/edit entry will be added in the upper right corner of the screen. Here, you can view the specific locations of all errors. You can click "all" to display all errors, or select an error from the drop-down list to query the specific location of the error.

3. Copper slivers

    "Copper slivers" refers to the thin and narrow copper areas that are prone to shedding during the production process. This feature not only detects narrow copper-clad areas, but also provides repair/trim functions. Before performing this operation, open the relevant layer to be checked. Analysis-> Copper slivers will pop up the "copper slivers detection" dialog box.

enter the minimum tolerable copper area after" find slivers less. You can select "Fix silvers" in "Processing Control" to fix copper. Select "Remove Old slivers" to eliminate the existing detection results, such as "Mask silvers ". If you select "process entire layer" in the "Search Area" below, the system detects all opened layers. If "window
area to process" is selected, a window is selected first, and the system detects the area of the window. After OK, the system will continue the detection at one end, and a prompt message will pop up. If there is no error, "found no new slivers" will be displayed ". if an error is found, an error prompt box is displayed. After confirmation, the screen jumps to another editing window. Here, you can view the specific locations of all errors. You can click "all" to display all errors, or select an error from the drop-down list to query the specific location of the error.

4. Mask slivers

    "Mask slivers" is a thin and narrow area of the solder mask (known as "Green Oil") that is prone to shedding during the production process. Once flushed, the solder may easily slip to the solder, causing adverse consequences. This function can be pre-detected and repaired before production to avoid unnecessary consequences. Analysis-> mask silvers, a "Mask sliver detection" dialog box is displayed.

    Enter the minimum tolerable copper area after "find slivers less. In "processing control", you can choose "Fix slivers" to fix copper. Select "Remove Old slivers" to cancel the previously generated detection results, such as "Mask slivers ". If you select "process entire layre" in the "Search Area" below, the system will detect all opened layers. If you select "window ",
Area to process indicates that a window is selected first, and the system will detect all open layers. After OK, the system will continue to check for a period of time, and a prompt message will pop up. If there is no error, "found no new slivers" will be displayed ". If an error is found, an error dialog box is displayed. After confirmation, the screen will jump to another editing window, with a message display/editing entry displayed in the upper right corner. Here, you can view the specific locations of all errors. You can click "all" to display all errors, or select an error from the drop-down box to query the specific location of the error.

5. Find solder Bridges

in most EDA software, a layer of Solder Mask is defined during PCB design. This is called the Solder Mask Layer in production, the solder mask region is not defined on the pad. That is, the place where the solder and Resistance Flux are installed during production. If the definition of this area is too large, the strip or other conductive objects near the pad will be exposed to the Resistance Flux. Thus, during processing, the pad and the metal wire near it may easily form a "bridge", resulting in short circuit. It can be seen that the "solder bridges" Phenomenon in production is usually caused by the improper definition of the mask data in the design phase and the lack of timely discovery of the CAD system. Therefore, it is necessary to quickly detect and fix the "solder
bridges" phenomenon before production and processing.

cam350 can not only quickly discover" Solder Bridge ", but also fix it. To implement this function before processing, you only need to use the menu analysis-> Find solder bridges to open the "solder bridging" dialog box.

in the small box before" top check/bottom check ", you can check the surface or bottom layer only or simultaneously.. Select the correct layer in the following "Mask Layer and check against". Note that soldermask_top corresponds to the top layer and soldermask_bottom corresponds to the bottom layer. In Bridge distance, enter the minimum tolerable bridge spacing. In the following search area, if "Process
entire layer" is selected, the system detects all the opened layers. If "window area to process" is selected, a window is selected first. The system checks the window area. After OK, the system will continue detection for a period of time. If an error is found, an error dialog box is displayed. After confirmation, the screen will jump to another editing window, with a message display/editing entry displayed in the upper right corner. Here, you can view the specific locations of all errors. You can click "all" to display all errors, or select an error from the drop-down list to query the specific location of the error.

6. Check Drill

    This feature is used to test the problems of the drilling layer. For example, whether the distance between the hole and the hole is reasonable and whether there are two holes of the same size or different sizes in the same position.

analysis-> check drills. The drill Alalysis dialog box is displayed.

" overlapped drill hits "can check whether two overlapping holes exist in the same position. "Coincident drill hits (different sizes)" can be used to check whether there are two or more passing holes of the same size at the same position, but these passing holes are produced by different tools. "Redundant drill hits (same size)" can check whether there are two or more holes of the same size in the same location, but these holes are generated by the same tool. "Drill
hole to drill hole clearance" can be used to check whether the spacing between the holes meets certain rules. Then select the layer to be checked in "layers to analyze.

7. the DFM test functions described above can all generate a report in the Info-> report menu to display the detection results. For example, sliver report, Solder Mask errors report, and silkscreen errors report, which can be saved as *. rpt files.

    If you have already run these verification functions, you can use the Info-> Find menu to view their specific locations. You can also click a menu item in the analysis dialog box.