Difference between gold plating and Gold Plating

Gold Plating refers to electroplating, that is, the gold ions discharge on the workpiece surface as the cathode (the PCB Board here) under the action of direct current, and gradually form a gold plating layer;

Gold Plating refers to the chemical plating, that is, the chemical reduction reaction is performed only by the plating bath without external power supply, so that the metal ions are continuously restored on the workpiece surface to form a gold coating.

The applications of the two on PCB have their own characteristics.Large Coating Thickness and Different Hardness, Can be used in the plug part to improve wear resistance (hard gold), also available in wire or other conductive parts. Because power is required,The PCB should be reserved with process wires, which can be removed only after the plating is completed. This process is troublesome.The finalized gold cannot be plated with a large thickness. It is mostly used in the line section with a low requirement on the gold layer. It does not need to reserve process wires and is easy to process, with high efficiency and low cost. It is suitable for mass production.

Secondly, electroplating gold is mostly usedMicro-cyanide process with low toxicityChemical gold uses high cyanide and operates at high temperatures, causing great toxicity and harm.

Difference between gold plating and Gold Plating