SOP, DIP, PLCC, TQFP, PQFP, TSOP, BGA package explanation

1. SOP Package
SOP is an abbreviation for the English small Outline package, which is a small form factor. The SOP Packaging technology has been successfully developed by Philips in the past 1968-1969 years, and has been gradually derived from soj (small form factor J-pin package), TSOP (small form factor package), VSOP (very small form factor package), SSOP (reduced SOP), TSSOP (thin shrink sop) and sot (small form factor transistor), SOIC (small form factor integrated circuit), etc.
2. Dip Package
The dip is an abbreviation for the English double In-line package, which is a two-row in-line encapsulation. One of the plug-in packages, the pins are drawn from both sides of the package, and the packaging material is made of plastic and ceramic. Dip is the most popular plug-in package, the application range includes standard logic IC, memory LSI, microcomputer circuit and so on.
3. PLCC Package
PLCC is an abbreviation for the English plastic leaded chip carrier, the plastic-sealed J-Lead chip package. PLCC package, the shape of a square, 32-pin package, surrounded by a pin, external dimensions than the dip package is much smaller. The PLCC package is suitable for SMT surface mount technology to install wiring on PCB, with the advantages of small form factor and high reliability.
4. TQFP Package
TQFP is an abbreviation for the English Thin Quad flat package, which is a thin, low-profile, flat packaging. The four-sided flat package (TQFP) process enables efficient use of space, thereby reducing the requirement for PCB space size. Due to the reduced height and volume, this encapsulation process is ideal for applications with high space requirements, such as PCMCIA cards and network devices. Almost all Altera CPLD/FPGA have a TQFP package.
5. PQFP Package
PQFP is an abbreviation for the English plastic Quad Flat package, which is a plastic-encapsulated four-corner flat packaging. PQFP package chip pin distance between the small, very thin pin, generally large-scale or VLSI use of this package, the number of pins is generally more than 100.
6. Tsop Package
The TSOP is an abbreviation for the English thin Small Outline package, which is a thin, small-size packaging. A typical feature of the TSOP memory encapsulation technology is that the pin is made around the encapsulated chip, and the TSOP is suitable for mounting cabling on the PCB (printed circuit board) with SMT Technology (surface Mount Technology). TSOP package dimensions, parasitic parameters (the current greatly changes, causing output voltage disturbance) reduced, suitable for high-frequency applications, the operation is more convenient, high reliability.
7. BGA Package
BGA is the abbreviation for the English Ball grid array package, which is the spherical grid array encapsulation. The 1990s with the progress of technology, chip integration continues to improve, the number of I/O pins increased sharply, power consumption also increased, the requirements of integrated circuit packaging more stringent. In order to meet the development needs, BGA packaging began to be used in production.
Using BGA-encapsulated memory, the memory can be increased by two to three times times the volume of memory, and BGA has a smaller volume, better thermal performance and electrical performance than TSOP. BGA packaging technology to increase the storage per square inch, the use of BGA Packaging technology memory products in the same capacity, the volume is only one-third of the TSOP package, in addition, compared with the traditional TSOP package, BGA packaging method has a faster and more efficient way of cooling.
The I/O terminals in BGA packages are distributed in the form of circular or columnar solder joints in an array, and the advantage of BGA technology is that although the number of I/O pins increases, the lead spacing does not decrease but increases, thus improving the assembly yield; Although its power consumption increases, BGA can be welded with controlled collapse chip method, Thus, it can improve its electrothermal performance, the thickness and weight are less than the previous packaging technology, the parasitic parameters are reduced, the signal transmission delay is small, the use frequency is greatly improved, and the assembly can be used with coplanar welding and high reliability.
When it comes to BGA packaging, Kingmax Company's patented TINYBGA technology, TINYBGA English is all called the tiny ball Grid
Array (small ball grid array package), which belongs to a branch of BGA packaging technology. Kingmax Company was successfully developed in August 1998, its chip area and package area ratio of not less than 1:1.14, you can make the memory in the case of the volume of memory increased by one to one-fold, compared with TSOP packaging products, it has a smaller volume, better thermal performance and electrical performance.
Memory products with TINYBGA packaging technology have a volume of only 1/3 of the TSOP package in the same capacity. The pins of the TSOP encapsulated memory are drawn around the chip, while the TINYBGA is led by the center of the chip. This method effectively shortens the conduction distance of the signal, the length of the signal transmission line is only 1/4 of the traditional TSOP technology, so the attenuation of the signal decreases. This not only greatly improves the chip's anti-jamming, anti-noise performance, but also improves the electrical performance. The TINYBGA package chip is resistant to up to 300MHz FSB, while the traditional TSOP package technology is up to 150MHz resistant to FSB.
The memory of the TINYBGA package is also thinner (package height is less than 0.8mm), and the effective cooling path from the metal substrate to the heatsink is only 0.36mm. As a result, the TINYBGA memory has a higher heat conduction efficiency and is ideal for long-running systems with excellent stability.

SOP, DIP, PLCC, TQFP, PQFP, TSOP, BGA package explanation