What is Intel Haswell in the CPU

Intel Haswell is the microprocessor architecture that Intel is currently developing and is being developed by Intel's Oregon team to replace the current Intel Ivy Bridge and Intel Sandy Bridge. Like Ivy Bridge, using the 22 nm process based on Intel's "Tick-tock" strategy and product roadmap, the Intel Haswell microarchitecture processor will be released from March 2013 to June. Intel demonstrated a chip based on the Haswell microarchitecture on the IDF in 2011.

Features from the Intel Ivy Bridge/intel Sandy Bridge

Level 14 pipelines (since Intel Core microarchitecture has been in use ever since);

In addition to some of the ultimate performance/server platforms, all processor models are fused to the Intel HD graphics display core.

New attributes that have been identified

Fabrication process/Manufacturing processes

More mature 22 nm process;

A more mature 3d-three-grid transistor;

Multi-core

Mainstream-level processor products are all the original four core;

Cache

Each core has a separate 64KB L1 cache (32KB data cache +32kb instruction cache), each core has a separate 256KB L2 cache, and all cores can share the L3 cache of the highest 32MB.

New processor cache design;

Instruction Set

AVX2 instruction Set (or Haswell new instruction set, including vector aggregation scattering, bit processing, and support for FMA3)

Improve the operation performance of aes-in instruction;

Output input bus, processor socket, memory interface, chipset

Processors still use the QPI bus, one-way data transfer performance of 4.8gt/s, 5.2gt/s, 6.4gt/s and even 8.0gt/s four of specifications, the lower-level model of the processor in the chipset and the processor still uses the DMI bus, one-way data transfer performance has 2.5gt/ s and 5.0gt/s two kinds of specifications.

New processor sockets: The desktop version is LGA 1150, and the mobile version is RPGA 947 and BGA 1364. ]intel explicitly indicates that Intel Haswell will not be compatible with the existing Intel processor platform.

Native support dual channel ddr3-1600; the Enterprise-class Haswell-ep/ex core also supports eight-channel DDR4;

New 8 Series chipsets:

Supports USB3.0 and provides up to 6 connection ports;

Support SATA 6.0gb/s and provide up to 6 connection ports;

Optimize floppy disk data transmission performance, improve data access and response capabilities, especially solid-state drives;

Optimize Intel Intelligent Response Technology and its support driver;

Provide complete trim support for the disk array formed by solid-state hard disk;

Intel Lake Tiny technology improves the transmission performance of the hybrid combination of solid-state and mechanical hard drives;

Adopt 32 nanometer process;

will be available in the second quarter of 2013, and Intel has made it clear that Intel Haswell microarchitecture processors will not be compatible with older chipsets, as Intel's Sandy Bridge microarchitecture does.

Show Core with self

The integrated display core will support DirectX 11.1 and OpenGL 3.2. Continue to strengthen the 3D graphics processing performance, support HDMI, DisplayPort, DVI, VGA connection port standards, support three-screen display signal independent output;

The new Intel HD graphics has three different versions of the display core, code-named GT1, GT2 and GT3 respectively. GT1 has 6 operating units and 1 sets of texture units, positioning entry level; GT2 has 20 operating units and 2 sets of texture units, positioning the mainstream level, the highest GT3 has 40 operating units and 4 rental texture units, but only for mobile platforms. The current Intel Ivy Bridge integrated display core has a maximum of 16 operating units, but the core architecture remains the same, due to the large scale and specification of the display core in the context of architecture and process invariant, so that the core Intel The Haswell processor's calorific value is soaring, and the desktop version can break 100 watts and move up to 57 watts.

Power Management

The processor chip will have the complete voltage regulator module, Intel once again integrates the components on the motherboard to the processor, [19] This makes the motherboard's power supply design simple, reduces the motherboard manufacturer's manufacture motherboard manufacture cost.

New Advanced power management technology;

The mobile version of the processor will have a thermal design power dissipation of 25 watts, 37-Watt, 47-Watt and 57-watt models [7] While the desktop version has a thermal design power consumption of 35 watts, 45 watts, 55 watts, 65 Watts, 77 watts, 95 watts, and maximum performance (including Advanced Server platforms) up to 100 watts of TDP models, Up to 160 watts of Haswell-ep/ex, up to 190 amps of current, but news points out that because of the increased display core, the thermal design power of mainstream and performance-level desktop processors may rise to 105 watts; In addition to mobile platforms, desktop platforms, and server platforms, Intel also designed a 15W version of TDP for ultra-extreme pen power, and it will be packaged on the same chip with multiple chips, similar to the design of the Intel Westmere, with the chipset and processor integrated into a single processor substrate.

Other

Intel Transactional Synchronization Extensions (TSX, Transaction Synchronization extension).