VR-Zone released a roadmap and a structural diagram showing the future of Intel 14nm.
In the 14nm process, Intel will adopt a mix of two generations of products.
Broadwell-K still uses the LGA1150 encapsulation interface, which can be used with the current 9 series motherboard, but the 8 series is basically hopeless. If you have or are about to replace the platform, then you also want to experience new technology or overclock, or not satisfied with the current i7-4790K, i5-4690K, this is prepared for you.
Skylake uses the new LGA1151 encapsulation interface and requires a new 100 series motherboard. It is suitable for preparing a new version, but you cannot overclock it.
According to the latest news, Broadwell will continue the FIVR (fully integrated voltage regulator) approach, but the strange thing is that Skylake-S has to give up on it and bring it back to the main board, I don't know what it is for, but at least there are more things that the motherboard manufacturer can play.
I still don't know when Skylake's mobile version will be launched. Intel may launch the mobile version of Skylake in mid-2016 or even the second half of the year.
Let's look at the system architecture of Skylake-S. It will native support Thunderbolt lightning technology, convergence from the processor's x4 DisplayPort 1.2, from the chipset's x4 PCI-E channel, but not the first generation, it should be the second generation, the theoretical bandwidth of 20 Gbps.
Wireless aspect, supporting 2x2 802.11ac Wi-Fi, Bluetooth via PCI-E x1, CLINK. X4 PCI-E/sata ssd refers to M.2, but it is unclear if it will be upgraded to PCI-E 3.0.
The memory also supports DDR3, DDR3L, and DDR4 (not as limited to DDR4 as Haswell-E with fever). The advantage is that the motherboard manufacturers and consumers can determine the memory according to their own needs and pre-selection, however, the motherboard design requires a good volume of memory. According to historical practices, pure DDR3, pure DDR4, and mixed DDR3/4 may occur, so there will be more motherboard models.
Tip: Skylake can integrate up to 72 execution units
Intel will launch two mainstream 14nm processors in the next year. Broadwell focuses on the notebook mobile platform and Skylake will bring new upgrades to the desktop platform, both architecture and technology will make a qualitative leap, especially supporting DDR4.
Today, we have learned a lot of detailed information about Skylake, especially in terms of memory and thermal design power consumption.
As we have said before, Skylake will have four different versions: Y and U series ultra-low voltage single chip Mobile Edition, H series high performance mobile edition, and S series desktop edition.
They all match the new 100 series chipset, but Y and U will integrate the processor and chipset together, just like Haswell, however, it is said that it will be completely single-chip SoC instead of glue encapsulation. The H and S series are still dual-independent chips, but the interconnection bus between them will be upgraded to DMI 3.0, and the bandwidth will greatly exceed the current DMI 2.0 8GT/s.
Skylake supports dual-channel memory, Y and U series each channel, and H and S series each channel.
Y, U are dual-core, memory support LPDDR3-1600, the latter will also support DDR3L/DDR3L-RS-1600. In other words, they do not have DDR4.
The Y Series works with the kernel display GT2, and the thermal design power consumption is only 4 W. Note that this is the thermal design power consumption (TDP), not the design power consumption (SDP) of the shrinking scenario ). The Haswell Y series can only achieve thermal design power consumption of 11.5 W and scenario design power consumption of 6 W. Intel is crazy.
The U series has multiple variants. The GT2 core displays TDP 15 W, and the GT3 core displays 64 MB eDRAM embedded cache TDP 15/28 W. The two levels are the same, but the cache does not exist currently.
The H series is four cores and supports DDR4-2133. The GT2 core displays TDP 35, 45 W, and the GT4 core displays 128 MB eDRAM cache is 45 W.
There are three types of S series: dual-core GT2, four-core GT2, and four-core GT4 64 MB eDRAM. TDP has two types: 35 W and 65 W, and the four core GT2 has 95 W. The memory is all supporting DDR3L/DDR3L-RS-1600, DDR4-2133.
Y, U, and H series are BGA integrated packages. Some models support adjustable TDP. The S series are independently encapsulated and the interface is the new LGA1151 and requires a new motherboard.
According to previous reports, Skylake's core presentation will be a "9th generation low-power architecture". Three levels of GT2, GT3, and GT4 have 24, 48, and 72 execution units respectively, supports DX11.2, OpenGL 5.0, OpenCL 2.1, H.265 hardware decoding, and shared virtual memory.
