PCB Plate Making Notes Daquan

The original is from: I modify the part according to my needs.

Http://blog.sina.com.cn/s/blog_4dfea6e40100u923.html

-----Please forward your Electronic design Engineer
First-class production from the first-class design, our production can not be separated from your design cooperation, please fully cooperate with the engineers please according to the production process detailed design
One, the relevant design parameters:
I.     Line
1. Minimum line width: 6mil (0.153mm). That is, if less than 6mil line width will not be able to produce, if the design conditions permit, the larger the better, the larger the line width, the better the factory production, the higher the yield of general design general in the 10mil around this point is very important, design must consider
2. Minimum line distance: 6mil (0.153mm). The minimum line distance, is the line to the wire, the distance of the wire to the pad is not less than 6mil from the production point of view, is the larger the better, the general conventional in 10mil, of course, the case of design conditions, the bigger the better this point is very important, design must consider the
3. Line-to-outline line spacing 0.508mm
Two.            via vias (commonly known as conductive holes)
1.       minimum aperture: 0.3mm (12mil)
2. Minimum Vias (VIA) aperture not Less than 0.3mm (12mil), the pad can not be less than 6mil (0.153mm), preferably greater than 8mil (0.2mm) Large is not limited (see Figure 3) This point is very important, design must consider
3. Vias (VIA) hole-to-hole spacing (hole edge to hole edge) cannot be less than: 6mil Preferably greater than 8mil this point is important, design must consider
4, pad to Contour line spacing 0.508mm (20mil)


  three. Pad Pads (is commonly known as the plug-in Hole (PTH))
1, plug-in hole size depends on your components, but must be larger than your component pins, the recommended is greater than the minimum of 0.2mm or more 0.6 of the components of the PIN, you have to design at least 0.8, in order to prevent machining tolerances and lead to difficult to insert,
2, plug-in hole (PTH) pad outer ring side can not be less than 0.2mm (8mil) of course, the larger the better (as shown in Figure 2) This point is very important, design must consider
3. Plug-in hole (PTH) hole-to-hole spacing (hole edge to hole edge) cannot be less than: 0.3mm of course, the larger the better (as shown in Figure 3) This point is very important, design must consider
4. Pad to Outline line spacing 0.508mm (20mil)

Four Anti-Weld

1. Plug Hole open window, SMD open window side can not be less than 0.1mm (4mil)
Five Characters (character Fu design, directly affect the production, whether the character is clear with the character design is very related)
1. The character Fugakuan can not be less than 0.153mm (6mil), the character height can not be less than 0.811mm (32mil), the width of the height ratio of the best 5 is also to say, the word width 0.2mm Word high 1mm, in order to push the class

Six: Non-metallic slot hole slot minimum spacing is not less than 1.6mm or it will greatly increase the difficulty of Milling edge (Figure 4)

Seven: Imposition

1. Imposition there is no gap imposition, and there is gap imposition, there is a gap imposition of the imposition gap not less than 1.6 (plate thickness 1.6) mm will greatly increase the difficulty of Milling edge

Imposition work board size depending on the device is not the same, no gap imposition of the Gap 0.5mm (20mil) around the process edge can not be less than 5mm (200mil)

The following picture is my note:

Two: Related matters needing attention
First, about the pads design of the original document.
1,pads paved with copper way, Division I is Hatch way to pave the copper, customer original document after the line, all to re-lay the copper to save (with Flood copper), to avoid short-circuit.
2, double panel file Pads face property to select the Through Hole property (Through), The Blind Hole properties (Partial) cannot be selected, and the drilling file cannot be generated, which can lead to leak drilling.
3. Inside the pads design slot do not add in the components together, because the Gerber can not be generated normally, in order to avoid leakage groove, please in the drilldrawing slot.
Ii. documents relating to PROTEL99SE and DXP design
1. Our resistance welding is to solder mask layer, if the solder paste layer (paste layer) to be made, there are multi-layer (M ultilayer) solder Resist window can not generate Gerber, please move to solder mask.
2. Do not lock the contour line inside the Protel99se, unable to generate Gerber normally.
3. Do not select the Keepout option in the Dxp file, it will screen the contour line and other components, unable to generate Gerber.
4, the two files please note that the front and back design, in principle, the top is a positive, the bottom of the design to be anti-word, Division I is from the top floor to the bottom of the overlay system board. Single-chip board special attention, do not arbitrarily mirror. It's not right to do it.
Three Other precautions.
1, shape (such as plate frame, slot, v-cut) must be placed in the keepout layer or mechanical layer, can not be placed in other layers, such as silk screen layer, line layer. All grooves or holes that need to be mechanically molded should be placed on one floor as much as possible to avoid leaking slots or holes.
2, if the mechanical layer and the Keepout Layer two layer shape is inconsistent, please do special instructions, in addition to the shape to give an effective shape, such as the inner groove, and the inner groove at the intersection of the outer shape of the line should be deleted, no leakage of the groove, design in the mechanical layer and the keepout layer groove and hole is generally based on the production , if you need to process into a metal hole, please special remarks.
3, if the most prudent way to do metallization slots is to put together multiple pad, this practice must be no error
3. Gold Finger Board Please special note whether you need to do bevel chamfer treatment.
4. To Gerber file Please check whether there are a few layers of the document, the general secretary will be directly in accordance with the Gerber document production.
5. With three kinds of software design, please pay special attention to whether the key position needs to be exposed to copper.

Classification of Mmark points:
1) Mark Point is used for the optical positioning of solder paste printing and component patches. According to Mark Point on the PCB, can be divided into the board Mark Point, the single board Mark Point, the local Mark Point (also known as the device level Mark Point)
2) There should be at least three mark points on the side of the panel and on the single board without the need for a puzzle, and the diagonal mark points are asymmetrical on the center.
3) If there are mounting components on both sides, then each side should have a mark point.
4) Try to have mark points on a single board that requires a puzzle, and if you do not place the Mark Point, Mark points will not be placed on a single board.
5) The lead center distance of ≤0.5 mm QFP and the center distance ≤0.8 mm BGA and other devices, should be in the component center point diagonally near the diagonal set local mark point, in order to accurately locate it.
6) If several SOP devices are closer (≤100mm) to form an array, consider them as a whole and design two local mark points at their diagonal positions.


design instructions and size requirements:

1) Mark point shape is a 1mm diameter solid circle, the material is copper, the surface spray tin, need to pay attention to smoothness, edge smooth, neat, color and the surrounding background color has obvious difference;
The solder-resist window is concentric with mark, and the diameter of the panel and veneer is 3mm, with a local mark point diameter of 1mm.
2) The mark Point on the veneer, the center distance plate edge is not less than 5mm, the mark Point on the edge of the process, the center of the plate edge is not less than 3mm.
3) in order to ensure the printing and patch recognition effect, Mark point range should be no solder pads, vias, test points, walking lines and screen marks, etc., can not be v-cut groove cutting machine can not be identified.
4) in order to increase the contrast between the mark Point and the substrate, you can lay the copper foil below Mark Point. Mark points on the same board have the same background, i.e. there is no copper foil at Mark Point.
5) The Mark Point for veneer and panel should be designed as a component, and the local mark point should be designed as part of the component package. It is easy to assign accurate coordinate values for positioning.

1. New Pcb:file------PCB.

2. Select, select Place/line to draw the shape and size of the board (closed graphic).

Draw the closed graphic you want.

3. Select all the graphic border lines you just drew.

4. Click Design-> Board Shape---Define from selected objects will become as shown in the figure below, the board shape has become the shape you draw, the other place becomes gray.
5. Click Clear in the lower right corner, the color will be restored, the shape and size of the PCB board to determine.