Dip pad Making:
1. Launch pad Designer.
2.New a pad, take a name. Round through hole rectangular pad4_0r2_3cir1_5md, round through Hole square PAD4_0SQ2_4MD, round through hole round PAD5_0CIR3_0MD, circular through hole finger-shaped p2o4x1_4cirmd, finger-shaped through hole p1_8o3_0x1_0o2_ 0MD, no solder disc round through hole nvia1_5mcir, no pad square through hole nvia3_0msq, no pad rectangular through hole nvia7_6rec1_7m, through the hole line via24cir12m.
3. In the Parameters tab, a) plating Select whether to tin, b) Drill diameter fill the diameter of the through hole (the diameter of the hole is generally greater than the diameter of the pin 8~20mil, the diameter of the pin is less than 40mil, the aperture is d+12mil, pin diameter Greater than 40mil is less than 80mil, the aperture is d+16mil, the pin diameter is greater than 80mil, Aperture is d+20mil); Drill/slot symbol in Figure select through hole type; characters fill a Width and height fill hole size.
4. In the Layers tab, the pad diameter is 0.8mm larger than the through hole diameter
A) Begin layer regular pad for the size of the pad size, Thermal relief should be larger than regular pad 20mil (0.5mm), if the size of the pad diameter of less than 40mil (1mm), can be appropriately reduced as needed, Anti Pad size is usually larger than the diameter of the pad 20mil (0.5mm), if the size of the pad diameter of less than 40mil (1mm), can be appropriately reduced as needed;
b) the Default internal regular pad is as large as the relief pad on the begin layer of the regular pad 10mil,thermal anti and regular pad than the begin layer;
c) The END layer is the same size as the begin layer; Pastemask does not have to be set.
d) The regular pad in the soldermask_top and soldermask_bottom layers is generally 4mil (or 0.1mm) larger than the pads.
Irregular pad Making:
1. Open the PCB Editor. Select File-new.
2. Select the shape symbol type in the drawing type and set the path and pad name.
3. Select Shape-polygon
4. Enter coordinates in the command window. Save.
Production of dip package and dip pad, irregular pad making