Rewelding process inspection (post-welding Inspection)

1. Inspection Method
The inspection method should be determined based on the detection device configurations of each unit. If there is no optical inspection equipment (A01) or online testing equipment, visual inspection is generally used. You can choose 2 to 5 times the magnifiers or 3 ~ The microscope was examined 20 times.
2. Inspection content
(1) check whether the welding is sufficient and whether there are traces of insufficient Solder Paste melt.

(2) check whether the solder joint surface is smooth, whether there are holes and defects, and the hole size.

(3) whether the amount of solder is moderate, and whether the solder joint shape is half a month.

(4) The quantity of tin beads and residues.

(5) defect rates such as suspension bridges, virtual welding, bridging, and component movement.

(6) Check the color change of the PCB surface, and then allow a little but even color change of the PCB after soldering.
3. Inspection Standards
Implemented in accordance with this enterprise standard or with reference to other standards (such as IPC standard or General Technical Requirements for SJ/T10670-1995 surface assembly processes.