Audio Project PCB Guidelines

1. Signal line do not take the corner, go straight.

2.PCB, at right angles there will be radiation effects, electromagnetic compatibility problems.

3. Follow the modular layout and regional layout.

4. Line thickness consistent, otherwise it will heat uneven, welding problems.

5. Ground mode, single point grounding, multi-point grounding.

6. Determine where the noise comes, first exclude peripheral devices, and then eliminate the program, and finally suspected PCB cabling.

7.MIC filter capacitance, as close as possible to the microphone head.

8. The analog line goes next to the ground, parallel to the line.

9. Bottom noise problem, blocking anti-match effect. It is easy to produce reflective phenomena.

10. When the bottom noise is the highest DC voltage, enlarge the volume.

11. Infrared and sweep screen, easy to generate crosstalk and radiation, causing noise.

12. The bottom noise problem, mainly by the PCB processing, not through the signal line into the amplifier and speakers.

13. Antennas, also to be wrapped by clean ground and power supply.

14. The digital signal line should be parallel to the line, and the analog line should be avoided, and to have the package to deal with, provide a good 0 level reference.

15.CE test: The main processing, and capacitance decoupling position placement, circuit reflow area.