Description of layer in pads

Source: Internet
Author: User

The role of each layer in pads:

1) top layer

2) bottom layer of bottom

3)-19) layer I intermediate signal Layer

21) Solder Mask top layer mask (Solder Mask)

22) paste mask bottom layer Solder Paste Layer

23) paste mask top layer Solder Paste Layer

24) drill drawing Hole Position layer, each of which has a corresponding symbol.

25) layer 25 corresponds to the component solder blocking window layer in the PCB drawing board (that is, the window opened by the Green Oil 26) silkscreen top screen printing text

27) assembly drawing top assembly drawing and assembly drawing

28) Solder Mask bottom layer mask (Solder Mask)

29) silksceen bottom-layer netprint text 30) Meaning of other software middle layers of assembly drawing bottom-layer assembly drawing: many of the specialized terms of EDA software do not have the same definition. The following is a literal explanation.

Mechnical

Keepoutlayer: defines the areas where a part cannot be laid, punched out (VIA), or placed. These restrictions can be defined separately.

Topoverlay: it cannot be understood literally. Provide more information for further discussion.

Bottomoverlay: it cannot be understood literally. You can provide more information for further discussion.

Toppaste: The top layer must expose the parts of the solder paste on the copper skin.

Bottompaste: the bottom layer must expose the parts of the solder paste on the copper skin.

Topsolder: top-layer Solder Mask to avoid accidental short circuits during manufacturing or future maintenance.

Bottomsolder: the bottom Solder Mask.

Drillguide: A table with different aperture sizes, corresponding symbols, and numbers.

Drilldrawing: refers to the bitmap of a hole. Each aperture has a corresponding symbol.

Multilayer: there should be no single layer, which can be a multi-layer panel. For single panel and double panel.

Toppaste: this is what is used to enable the steel mesh when surface layer patches are used.

Bottompaste: this is what is used to enable the steel network when the underlying SMD is used.

Internal plane Layer

Top (copper) layer:->. GTL

Bottom (copper) layer:->. GBL

Mid layer 1, 2,..., 30:->. G1,. G2,...,. g30

Internal plane Layer 1, 2,..., 16:->. gp1,. gp2,...,. gp16

Top overlay:->. GTO

Bottom overlay:->. GBo

Top paste mask:->. GP

Bottom paste mask:->. GBP

Top Solder Mask:->. GTS

Bottom Solder Mask:->. GBS

Keep-out layer:->. gko

Mechanical Layer 1, 2,..., 16:->. GM1,. gm2,...,. gm16

Top pad master:->. GPT

Bottom pad master:->. GPB

Drill drawing, top layer-bottom layer (through hole):->. gd1

Drill drawing, other drill (layer) pairs:->. GD2,. Gd3 ,...

Drill guide, top layer-bottom layer (through hole):->. gg1

Drill guide, other drill (layer) pairs:->. gg2,. gg3 ,...

 

 

 

PadsThe layers in the software are divided into the following categories:

 

21 layer ...... Solder Mask top → Gerber file. It includes pads ( pad ) and testpoints (test point) can be used to walk bare lines →→→ top layer

22 layer ...... Paste mask bottom → indicates output SMD (surface encapsulation) Gerber file of the component. powerpcb SMD pads ( pad ) output →→ bottom layer

23 layer ...... Paste mask top → indicates output SMD (surface encapsulation) Gerber file of the component. powerpcb SMD pads ( pad ) output →→ top layer

24Layer...... Drill drawing →Output reference graph file for drilling. It is only a file that stores information about the location of a drilled hole.

25Layer...... Layer_25 →It is used when the inner layer is designed for secure pad. Note that onlyDipRequired only for components,QFPAnd so onSMDYou do not need to install components on the surface. The safe pad should generally be set to be larger than the surface connecting disk.

26 Layer ...... Silkscreen top → Indicates the output of the Silk Screen Layer Gerber File. Powerpcb The Silkscreen Layer Line (2d Line ) , Text ( Text ) And Outline ( Border ) Output → Top layer 27272727 Layers ...... Assembly drawing top → Indicates the output assembly Gerber File. → Top layer

28Layer...... Solder Mask boottm →Output of the main padGerberFile. It includesPads (Pad)AndTestpoints(Test point) can be used to walk bare lines→Bottom Layer

29 Layer ...... Silkscreen bottom → Indicates the output of the Silk Screen Layer Gerber File. Powerpcb The Silkscreen Layer Line (2d Line ) , Text ( Text ) And Outline ( Border ) Output → Bottom Layer

30Layer...... Assembly drawing boottom →Indicates the output assemblyGerberFile.→Bottom Layer

 

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